CN103579460B - 一种高亮度白光led及其制造方法 - Google Patents
一种高亮度白光led及其制造方法 Download PDFInfo
- Publication number
- CN103579460B CN103579460B CN201310552718.7A CN201310552718A CN103579460B CN 103579460 B CN103579460 B CN 103579460B CN 201310552718 A CN201310552718 A CN 201310552718A CN 103579460 B CN103579460 B CN 103579460B
- Authority
- CN
- China
- Prior art keywords
- white
- led
- parts
- fluorescent powder
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 238000000034 method Methods 0.000 title abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 32
- 239000003292 glue Substances 0.000 claims abstract description 24
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000741 silica gel Substances 0.000 claims abstract description 20
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 17
- -1 wherein Substances 0.000 claims abstract description 4
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000695 excitation spectrum Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310552718.7A CN103579460B (zh) | 2013-11-11 | 2013-11-11 | 一种高亮度白光led及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310552718.7A CN103579460B (zh) | 2013-11-11 | 2013-11-11 | 一种高亮度白光led及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103579460A CN103579460A (zh) | 2014-02-12 |
CN103579460B true CN103579460B (zh) | 2016-01-06 |
Family
ID=50050807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310552718.7A Active CN103579460B (zh) | 2013-11-11 | 2013-11-11 | 一种高亮度白光led及其制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103579460B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103887408A (zh) * | 2014-03-29 | 2014-06-25 | 中山市聚明星电子有限公司 | Led白光的制作工艺 |
US9605199B1 (en) * | 2016-03-31 | 2017-03-28 | General Electric Company | Oxy-bromide phosphors and uses thereof |
CN105870112A (zh) * | 2016-04-30 | 2016-08-17 | 浙江单色电子科技有限公司 | 一种混合波长紫光led及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101882615A (zh) * | 2010-07-12 | 2010-11-10 | 陕西科技大学 | 一种纳米粒子配光led |
CN102496674A (zh) * | 2011-12-23 | 2012-06-13 | 惠州市华阳多媒体电子有限公司 | 一种新型达成白光的led封装结构及封装方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200412682A (en) * | 2003-01-13 | 2004-07-16 | Solidlite Corp | Pink LED |
-
2013
- 2013-11-11 CN CN201310552718.7A patent/CN103579460B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101882615A (zh) * | 2010-07-12 | 2010-11-10 | 陕西科技大学 | 一种纳米粒子配光led |
CN102496674A (zh) * | 2011-12-23 | 2012-06-13 | 惠州市华阳多媒体电子有限公司 | 一种新型达成白光的led封装结构及封装方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103579460A (zh) | 2014-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 528400 member of Guangdong province Zhongshan City peak Shiqi District Hing Road seventh building two floor Patentee after: GUANGDONG JINGDE OPTOELECTRONICS CO.,LTD. Address before: 528400 member of Guangdong province Zhongshan City peak Shiqi District Hing Road seventh building two floor Patentee before: ZHONGSHAN JINGDE OPTOELECTRONICS Co.,Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A high brightness white LED and its manufacturing method Effective date of registration: 20230628 Granted publication date: 20160106 Pledgee: Agricultural Bank of China Limited Zhongshan Sanxiang sub branch Pledgor: GUANGDONG JINGDE OPTOELECTRONICS CO.,LTD. Registration number: Y2023980046460 |