JP6958359B2 - 接着剤組成物及び構造体 - Google Patents

接着剤組成物及び構造体 Download PDF

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Publication number
JP6958359B2
JP6958359B2 JP2017552705A JP2017552705A JP6958359B2 JP 6958359 B2 JP6958359 B2 JP 6958359B2 JP 2017552705 A JP2017552705 A JP 2017552705A JP 2017552705 A JP2017552705 A JP 2017552705A JP 6958359 B2 JP6958359 B2 JP 6958359B2
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Japan
Prior art keywords
mass
component
adhesive composition
parts
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017552705A
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English (en)
Japanese (ja)
Other versions
JPWO2017090693A1 (ja
Inventor
智樹 森尻
潤 竹田津
田中　勝
立澤　貴
耕太郎 関
健太 菊地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2017090693A1 publication Critical patent/JPWO2017090693A1/ja
Priority to JP2021164972A priority Critical patent/JP7173258B2/ja
Application granted granted Critical
Publication of JP6958359B2 publication Critical patent/JP6958359B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2017552705A 2015-11-25 2016-11-24 接着剤組成物及び構造体 Active JP6958359B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021164972A JP7173258B2 (ja) 2015-11-25 2021-10-06 接着剤組成物及び構造体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015229764 2015-11-25
JP2015229764 2015-11-25
PCT/JP2016/084853 WO2017090693A1 (ja) 2015-11-25 2016-11-24 接着剤組成物及び構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021164972A Division JP7173258B2 (ja) 2015-11-25 2021-10-06 接着剤組成物及び構造体

Publications (2)

Publication Number Publication Date
JPWO2017090693A1 JPWO2017090693A1 (ja) 2018-09-13
JP6958359B2 true JP6958359B2 (ja) 2021-11-02

Family

ID=58763490

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017552705A Active JP6958359B2 (ja) 2015-11-25 2016-11-24 接着剤組成物及び構造体
JP2021164972A Active JP7173258B2 (ja) 2015-11-25 2021-10-06 接着剤組成物及び構造体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021164972A Active JP7173258B2 (ja) 2015-11-25 2021-10-06 接着剤組成物及び構造体

Country Status (5)

Country Link
JP (2) JP6958359B2 (zh)
KR (1) KR102556357B1 (zh)
CN (1) CN108291131B (zh)
TW (1) TWI811185B (zh)
WO (1) WO2017090693A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114374101A (zh) * 2022-01-12 2022-04-19 业成科技（成都）有限公司 连接结构和形成连接结构的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4649815B2 (ja) 2002-03-27 2011-03-16 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP3858740B2 (ja) 2002-03-27 2006-12-20 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP2007056209A (ja) * 2005-08-26 2007-03-08 Sumitomo Electric Ind Ltd 回路接続用接着剤
JP2007091959A (ja) * 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP2007112949A (ja) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP5061509B2 (ja) 2005-12-01 2012-10-31 日立化成工業株式会社 接着剤組成物並びにこれを用いた接続体及び半導体装置
JP2009256581A (ja) * 2008-03-28 2009-11-05 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びそれを用いた接続体
JP5298977B2 (ja) * 2008-03-28 2013-09-25 日立化成株式会社 接着剤組成物、回路接続用接着剤、接続体及び半導体装置
JP5577635B2 (ja) * 2008-10-09 2014-08-27 日立化成株式会社 接着剤組成物、回路接続用接着剤及び回路接続体
WO2013035164A1 (ja) * 2011-09-06 2013-03-14 日立化成株式会社 接着剤組成物及び接続体
JP5934528B2 (ja) 2012-03-12 2016-06-15 デクセリアルズ株式会社 回路接続材料、及びそれを用いた実装体の製造方法
WO2013161713A1 (ja) * 2012-04-25 2013-10-31 日立化成株式会社 回路接続材料、回路接続構造体、接着フィルム及び巻重体

Also Published As

Publication number Publication date
JP7173258B2 (ja) 2022-11-16
KR20180084930A (ko) 2018-07-25
CN108291131A (zh) 2018-07-17
KR102556357B1 (ko) 2023-07-14
CN108291131B (zh) 2020-08-07
WO2017090693A1 (ja) 2017-06-01
TWI811185B (zh) 2023-08-11
TW201728730A (zh) 2017-08-16
JPWO2017090693A1 (ja) 2018-09-13
JP2022000530A (ja) 2022-01-04

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