JP6946274B2 - 高温管状ヒーター - Google Patents
高温管状ヒーター Download PDFInfo
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- JP6946274B2 JP6946274B2 JP2018512902A JP2018512902A JP6946274B2 JP 6946274 B2 JP6946274 B2 JP 6946274B2 JP 2018512902 A JP2018512902 A JP 2018512902A JP 2018512902 A JP2018512902 A JP 2018512902A JP 6946274 B2 JP6946274 B2 JP 6946274B2
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- Prior art keywords
- heater assembly
- insulating material
- heating member
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- wall
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/072—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with aluminium
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F5/00—Compounds of magnesium
- C01F5/02—Magnesia
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G25/00—Compounds of zirconium
- C01G25/02—Oxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/363—Carbon
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Resistance Heating (AREA)
- Chemical Vapour Deposition (AREA)
Description
以下に、本願出願の当初の特許請求の範囲に記載された発明を付記する。
[1]
加熱部材(heating member)と、
前記加熱部材を外部コンポーネントの壁に取り付ける取り付け部材(mounting member)と、
前記加熱部材と前記外部コンポーネントの壁との間に配置され、前記加熱部材を前記壁から電気的に絶縁し、前記加熱部材から前記外部コンポーネントの壁への接地経路(ground path)をブロックする絶縁材(in sulator)と、
を備えるヒーターアセンブリ。
[2]
前記加熱部材は、管状ヒーター(tubular heater)である
[1]に記載のヒーターアセンブリ。
[3]
前記加熱部材は、抵抗素子と、前記抵抗素子を囲み且つ電気的に絶縁する誘電体材料(dielectric material)と、前記誘電体材料及び前記抵抗素子を囲む金属外装(metal sheath)と、を備える
[1]に記載のヒーターアセンブリ。
[4]
前記絶縁材は、前記金属外装を前記外部コンポーネントの壁から電気的に絶縁する
[3]に記載のヒーターアセンブリ。
[5]
前記金属外装は、前記絶縁材の一方の終端面(one end surface)で終端している(terminate)
[4]に記載のヒーターアセンブリ。
[6]
前記絶縁材を貫通し且つ前記抵抗素子に接続された端子ピンを、さらに備える
[3]に記載のヒーターアセンブリ。
[7]
前記加熱部材は、前記金属外装の外表面上の不透性コーティング(impervious coating)をさらに含む
[3]に記載のヒーターアセンブリ。
[8]
前記不透性コーティングは、0.8から1の範囲の放射率(emissivity)を有する
[7]に記載のヒーターアセンブリ。
[9]
前記不透性コーティングは、グラファイト、複合材料(composite materials)、酸化物材料、及びニッケル・クロム・マグネシウム酸化物からなる群から選択された材料を含む
[7]に記載のヒーターアセンブリ。
[10]
前記誘電体材料は、マグネシウム酸化物(MgO)、アルミニウム酸化物(Al2O3)、ジルコニウム酸化物(ZrO2)、及びアルミニウム窒化物(AlN)からなる群から選択される
[4]に記載のヒーターアセンブリ。
[11]
前記誘電体材料は、高熱伝導率を有する
[3に記載のヒーターアセンブリ。
[12]
前記誘電体材料は、アルミニウム窒化物(AlN)である
[11]に記載のヒーターアセンブリ。
[13]
前記抵抗素子は、1300〜1400℃の範囲の融点を有する
[3]に記載のヒーターアセンブリ。
Claims (13)
- 抵抗素子と、前記抵抗素子を囲み且つ前記抵抗素子を電気的に絶縁する誘電体材料(dielectric material)と、前記誘電体材料を囲む外側外装(outer sheath)とを備える加熱部材(heating member)と、
前記加熱部材を外部コンポーネントの壁に取り付ける取り付け部材(mounting member)と、
前記加熱部材と前記取り付け部材との間に配置され、前記加熱部材から前記取り付け部材及び前記外部コンポーネントの前記壁への接地経路(ground path)をブロックするために、前記取り付け部材及び前記壁から前記加熱部材を電気的に絶縁する絶縁材(insulator)と、
を備え、
前記加熱部材の前記外側外装は、前記絶縁材及び前記取り付け部材を貫通し、前記絶縁材は、前記加熱部材の前記外側外装と前記取り付け部材との間に密閉インターフェース(sealed interface)を提供するように、前記外側外装を囲むように前記取り付け部材を貫通し、
前記絶縁材は内側セクション及び外側セクションを含み、前記内側セクション及び前記外側セクションは前記取り付け部材の内側に配置された互いに対向する増大された端部(enlarged ends)を含み、
前記抵抗素子は、前記加熱部材の通常動作の間中は、前記誘電体材料及び前記絶縁材の両方によって電気的に絶縁され、且つ、前記抵抗素子は、前記抵抗素子から前記外部コンポーネントの前記壁への前記接地経路に起因する前記誘電体材料の誘電破壊が前記絶縁材によってブロックされる間中は、前記絶縁材によって電気的に絶縁されたままであるヒーターアセンブリ。 - 前記加熱部材は、管状ヒーター(tubular heater)である
請求項1に記載のヒーターアセンブリ。 - 前記加熱部材は、前記誘電体材料及び前記抵抗素子を囲む金属外装(metal sheath)、を備える
請求項1に記載のヒーターアセンブリ。 - 前記絶縁材は、前記金属外装を前記外部コンポーネントの壁から電気的に絶縁する
請求項3に記載のヒーターアセンブリ。 - 前記金属外装は、前記絶縁材の一方の終端面(one end surface)で終端している(terminate)
請求項4に記載のヒーターアセンブリ。 - 前記絶縁材を貫通し且つ前記抵抗素子に接続された端子ピンを、さらに備える
請求項3に記載のヒーターアセンブリ。 - 前記加熱部材は、前記金属外装の外表面上の不透性コーティング(impervious coating)をさらに含む
請求項3に記載のヒーターアセンブリ。 - 前記不透性コーティングは、0.8から1の範囲の放射率(emissivity)を有する
請求項7に記載のヒーターアセンブリ。 - 前記不透性コーティングは、グラファイト、複合材料(composite materials)、酸化物材料、及びニッケル・クロム・マグネシウム酸化物からなる群から選択された材料を含む
請求項7に記載のヒーターアセンブリ。 - 前記誘電体材料は、マグネシウム酸化物(MgO)、アルミニウム酸化物(Al2O3)、ジルコニウム酸化物(ZrO2)、及びアルミニウム窒化物(AlN)からなる群から選択される
請求項4に記載のヒーターアセンブリ。 - 前記誘電体材料は、高熱伝導率を有する
請求項3に記載のヒーターアセンブリ。 - 前記誘電体材料は、アルミニウム窒化物(AlN)である
請求項11に記載のヒーターアセンブリ。 - 前記抵抗素子は、1300〜1400℃の範囲の融点を有する
請求項3に記載のヒーターアセンブリ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021088078A JP7196234B2 (ja) | 2015-09-09 | 2021-05-26 | 高温管状ヒーター |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562216003P | 2015-09-09 | 2015-09-09 | |
US62/216,003 | 2015-09-09 | ||
PCT/US2016/050853 WO2017044674A1 (en) | 2015-09-09 | 2016-09-09 | High temperature tubular heaters |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021088078A Division JP7196234B2 (ja) | 2015-09-09 | 2021-05-26 | 高温管状ヒーター |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018530868A JP2018530868A (ja) | 2018-10-18 |
JP2018530868A5 JP2018530868A5 (ja) | 2020-08-13 |
JP6946274B2 true JP6946274B2 (ja) | 2021-10-06 |
Family
ID=56985685
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018512902A Active JP6946274B2 (ja) | 2015-09-09 | 2016-09-09 | 高温管状ヒーター |
JP2021088078A Active JP7196234B2 (ja) | 2015-09-09 | 2021-05-26 | 高温管状ヒーター |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021088078A Active JP7196234B2 (ja) | 2015-09-09 | 2021-05-26 | 高温管状ヒーター |
Country Status (7)
Country | Link |
---|---|
US (1) | US10770318B2 (ja) |
EP (1) | EP3348116B1 (ja) |
JP (2) | JP6946274B2 (ja) |
KR (1) | KR102213056B1 (ja) |
CN (1) | CN108476560B (ja) |
TW (1) | TWI644590B (ja) |
WO (1) | WO2017044674A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10542587B2 (en) * | 2015-12-08 | 2020-01-21 | Temp4 Inc. | Heating elements of large sizes and of metallic tubular designs |
WO2018076002A1 (en) * | 2016-10-21 | 2018-04-26 | Watlow Electric Manufacturing Company | Electric heaters with low drift resistance feedback |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB345563A (en) * | 1929-05-17 | 1931-03-26 | British Thomson Houston Co Ltd | Improvements in and relating to electric heaters |
CH427342A (de) * | 1965-04-23 | 1966-12-31 | Elpag Ag Chur | Anordnung an einem Behälter, welche einen Thermowiderstand aufweist |
US3971875A (en) * | 1974-01-04 | 1976-07-27 | General Dynamics Corporation | Apparatus and method for vacuum hot press joining, compacting and treating of materials |
JPS5843875B2 (ja) * | 1977-07-11 | 1983-09-29 | 松下電器産業株式会社 | 高周波加熱装置用ヒ−タ装置 |
JPS5590095A (en) * | 1978-12-28 | 1980-07-08 | Matsushita Electric Ind Co Ltd | Sheathed heater and method of fabricating same |
JPS6093794A (ja) * | 1983-10-26 | 1985-05-25 | 松下電器産業株式会社 | 遠赤外線ヒ−タ |
US4650964A (en) | 1984-02-21 | 1987-03-17 | Hewlett-Packard Company | Electrically heated transfer line for capillary tubing |
US4735259A (en) * | 1984-02-21 | 1988-04-05 | Hewlett-Packard Company | Heated transfer line for capillary tubing |
JPH0424638Y2 (ja) * | 1986-09-25 | 1992-06-10 | ||
JP3102128B2 (ja) * | 1992-03-16 | 2000-10-23 | 松下電器産業株式会社 | ヒータ及びその製造方法 |
JPH0677193U (ja) * | 1993-04-07 | 1994-10-28 | 日本ヒーター株式会社 | シーズヒーターの取付構造 |
JPH08264465A (ja) * | 1995-03-23 | 1996-10-11 | Tokyo Electron Ltd | 処理装置 |
JP3089196B2 (ja) * | 1995-11-22 | 2000-09-18 | シャープ株式会社 | 電子レンジのヒータ取り付け構造 |
JP3894577B2 (ja) * | 1996-07-15 | 2007-03-22 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 加熱要素 |
JP4041259B2 (ja) | 2000-02-23 | 2008-01-30 | 三洋熱工業株式会社 | ヒータの製造方法 |
US20020185487A1 (en) * | 2001-05-02 | 2002-12-12 | Ramesh Divakar | Ceramic heater with heater element and method for use thereof |
US20020166855A1 (en) * | 2001-05-11 | 2002-11-14 | Renwick Ian J. | Electric heater having dielectric sleeve |
JPWO2003017726A1 (ja) * | 2001-08-13 | 2004-12-09 | 三洋熱工業株式会社 | ヒータ |
JP3089196U (ja) | 2002-04-10 | 2002-10-11 | 宇呂電子工業株式会社 | アース金具 |
CN2631182Y (zh) * | 2003-06-03 | 2004-08-04 | 宝胜科技创新股份有限公司 | 氧化镁绝缘加热元件 |
US20080041836A1 (en) * | 2004-02-03 | 2008-02-21 | Nicholas Gralenski | High temperature heating element for preventing contamination of a work piece |
DE102008063677B4 (de) * | 2008-12-19 | 2012-10-04 | Heraeus Noblelight Gmbh | Infrarotstrahler und Verwendung des Infrarotstrahlers in einer Prozesskammer |
DE102009038341A1 (de) * | 2009-08-21 | 2011-04-21 | Von Ardenne Anlagentechnik Gmbh | Heizeinrichtung für eine Substratbehandlungseinrichtung und Substratbehandlungseinrichtung |
-
2016
- 2016-09-09 CN CN201680064869.XA patent/CN108476560B/zh active Active
- 2016-09-09 JP JP2018512902A patent/JP6946274B2/ja active Active
- 2016-09-09 KR KR1020187010050A patent/KR102213056B1/ko active IP Right Grant
- 2016-09-09 TW TW105129350A patent/TWI644590B/zh not_active IP Right Cessation
- 2016-09-09 US US15/260,357 patent/US10770318B2/en active Active
- 2016-09-09 WO PCT/US2016/050853 patent/WO2017044674A1/en active Application Filing
- 2016-09-09 EP EP16770407.1A patent/EP3348116B1/en active Active
-
2021
- 2021-05-26 JP JP2021088078A patent/JP7196234B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP7196234B2 (ja) | 2022-12-26 |
JP2021132043A (ja) | 2021-09-09 |
KR20180066089A (ko) | 2018-06-18 |
EP3348116B1 (en) | 2020-11-11 |
JP2018530868A (ja) | 2018-10-18 |
KR102213056B1 (ko) | 2021-02-05 |
WO2017044674A1 (en) | 2017-03-16 |
EP3348116A1 (en) | 2018-07-18 |
US10770318B2 (en) | 2020-09-08 |
US20170069514A1 (en) | 2017-03-09 |
TWI644590B (zh) | 2018-12-11 |
TW201717697A (zh) | 2017-05-16 |
CN108476560A (zh) | 2018-08-31 |
CN108476560B (zh) | 2020-11-03 |
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