JP6944949B2 - 電荷が中和されたイオンビームのための無線周波数抽出システム - Google Patents

電荷が中和されたイオンビームのための無線周波数抽出システム Download PDF

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JP6944949B2
JP6944949B2 JP2018553427A JP2018553427A JP6944949B2 JP 6944949 B2 JP6944949 B2 JP 6944949B2 JP 2018553427 A JP2018553427 A JP 2018553427A JP 2018553427 A JP2018553427 A JP 2018553427A JP 6944949 B2 JP6944949 B2 JP 6944949B2
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plate
drawer
aperture
plasma
plasma chamber
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JP2019519064A5 (enExample
JP2019519064A (ja
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ビロイウ コステル
ビロイウ コステル
ルビキ ピョートル
ルビキ ピョートル
ロックウェル タイラー
ロックウェル タイラー
キャンベル クリストファー
キャンベル クリストファー
シング ヴィクラム
シング ヴィクラム
エム ダニエルズ ケビン
エム ダニエルズ ケビン
ジェイ ヘルテル リチャード
ジェイ ヘルテル リチャード
エフ クルンクジ ピーター
エフ クルンクジ ピーター
リクハンスキ アレクサンダー
リクハンスキ アレクサンダー
Original Assignee
ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド
ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32412—Plasma immersion ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422—Arrangement for selecting ions or species in the plasma

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
JP2018553427A 2016-04-20 2017-04-19 電荷が中和されたイオンビームのための無線周波数抽出システム Active JP6944949B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/133,261 2016-04-20
US15/133,261 US10224181B2 (en) 2016-04-20 2016-04-20 Radio frequency extraction system for charge neutralized ion beam
PCT/US2017/028372 WO2017184736A1 (en) 2016-04-20 2017-04-19 Radio frequency extraction system for charge neutralized ion beam

Publications (3)

Publication Number Publication Date
JP2019519064A JP2019519064A (ja) 2019-07-04
JP2019519064A5 JP2019519064A5 (enExample) 2020-05-28
JP6944949B2 true JP6944949B2 (ja) 2021-10-06

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JP2018553427A Active JP6944949B2 (ja) 2016-04-20 2017-04-19 電荷が中和されたイオンビームのための無線周波数抽出システム

Country Status (6)

Country Link
US (1) US10224181B2 (enExample)
JP (1) JP6944949B2 (enExample)
KR (1) KR102268345B1 (enExample)
CN (1) CN109417012B (enExample)
TW (1) TWI734755B (enExample)
WO (1) WO2017184736A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019182191A1 (ko) 2018-03-21 2019-09-26 경북대학교 산학협력단 C0x2 아세틸화제를 유효성분으로 포함하는 퇴행성 신경질환의 예방 또는 치료용 약학적 조성물
US11056319B2 (en) * 2019-07-29 2021-07-06 Applied Materials, Inc. Apparatus and system having extraction assembly for wide angle ion beam
KR102442204B1 (ko) 2019-09-20 2022-09-08 경북대학교 산학협력단 Cox2 단백질의 아세틸화 검출용 항체 및 이의 용도
CN113539773B (zh) * 2020-04-16 2024-07-02 新动力等离子体株式会社 具有双重输出的高频发生器及其驱动方法
US11495430B2 (en) 2020-07-15 2022-11-08 Applied Materials, Inc. Tunable extraction assembly for wide angle ion beam
US12400845B2 (en) * 2021-11-29 2025-08-26 Applied Materials, Inc. Ion energy control on electrodes in a plasma reactor
JP7629099B2 (ja) * 2022-06-07 2025-02-12 株式会社日立ハイテク プラズマ処理装置
WO2024226135A1 (en) * 2023-04-24 2024-10-31 Applied Materials, Inc. A multi-electrode source assembly for plasma processing

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6478924B1 (en) * 2000-03-07 2002-11-12 Applied Materials, Inc. Plasma chamber support having dual electrodes
JP3912993B2 (ja) * 2001-03-26 2007-05-09 株式会社荏原製作所 中性粒子ビーム処理装置
JP2007242368A (ja) * 2006-03-07 2007-09-20 Shincron:Kk ニュートラライザおよびこれを備えた成膜装置
US7498592B2 (en) 2006-06-28 2009-03-03 Wisconsin Alumni Research Foundation Non-ambipolar radio-frequency plasma electron source and systems and methods for generating electron beams
US20080132046A1 (en) * 2006-12-04 2008-06-05 Varian Semiconductor Equipment Associates, Inc. Plasma Doping With Electronically Controllable Implant Angle
US20090084987A1 (en) * 2007-09-28 2009-04-02 Varian Semiconductor Equipment Associates, Inc. Charge neutralization in a plasma processing apparatus
JP2011514441A (ja) * 2008-01-30 2011-05-06 アプライド マテリアルズ インコーポレイテッド 表面波開始プラズマ放電源の予備イオン化のためのシステム及び方法
WO2011007546A1 (ja) * 2009-07-16 2011-01-20 キヤノンアネルバ株式会社 イオンビーム発生装置、基板処理装置及び電子デバイスの製造方法
US20130098871A1 (en) 2011-10-19 2013-04-25 Fei Company Internal Split Faraday Shield for an Inductively Coupled Plasma Source
JP5495138B2 (ja) * 2011-10-31 2014-05-21 日新イオン機器株式会社 イオン源
US8907300B2 (en) * 2013-03-14 2014-12-09 Varian Semiconductor Equipment Associates, Inc. System and method for plasma control using boundary electrode
US9711316B2 (en) 2013-10-10 2017-07-18 Varian Semiconductor Equipment Associates, Inc. Method of cleaning an extraction electrode assembly using pulsed biasing
US9269542B2 (en) * 2013-11-01 2016-02-23 Varian Semiconductor Equipment Associates, Inc. Plasma cathode charged particle lithography system
FR3020235B1 (fr) 2014-04-17 2016-05-27 Ecole Polytech Dispositif de formation d'un faisceau quasi-neutre de particules de charges opposees.
US9230773B1 (en) 2014-10-16 2016-01-05 Varian Semiconductor Equipment Associates, Inc. Ion beam uniformity control

Also Published As

Publication number Publication date
US10224181B2 (en) 2019-03-05
TWI734755B (zh) 2021-08-01
TW201802860A (zh) 2018-01-16
KR20180127656A (ko) 2018-11-29
CN109417012A (zh) 2019-03-01
KR102268345B1 (ko) 2021-06-24
CN109417012B (zh) 2021-07-09
US20170309453A1 (en) 2017-10-26
JP2019519064A (ja) 2019-07-04
WO2017184736A1 (en) 2017-10-26

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