JP6941693B2 - 半導体デバイス及びその製造方法 - Google Patents
半導体デバイス及びその製造方法 Download PDFInfo
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Description
本発明は、2017年10月16日に出願された中国特許出願第201710975386.1号の優先権を要求する。上記出願の内容は、参照によりその全体が本明細書に組み込まれる。
本発明は、半導体の技術分野に関する。具体的には、半導体デバイス及びその製造方法に関する。
半導体基板と、
半導体基板の一方側に製造されたソースと、ゲートとドレインと、
ソースの位置する領域においておいたスルーホール領域及びスルーホール領域に製造されたエッチング阻止層と、
エッチング阻止層の下方に位置するとともに半導体基板を貫通したスルーホールと
を含んだ半導体デバイスを提供している。
半導体基板を提供することと、
半導体基板の一方側にソースと、ゲートとドレインをつくり、ソースを製造するとき、ソースの位置する領域にソース金属を含めないスルーホール領域を置いておくことと、
おいておいたスルーホール領域にエッチング阻止層を製造することと、
半導体基板のソースから遠い一方側から、エッチング阻止層の下方までエッチングして、半導体基板を貫通したスルーホールを形成すること
を含んだ半導体デバイスの製造方法も提供している。
ステップS102では、半導体基板の一方側にソースと、ゲートとドレインを製造し、その中、ソースを製造するとき、ソースの位置する領域にソースオーミック金属を含まないスルーホール領域を形成する。
ステップS103では、おいておいたスルーホール領域でエッチング阻止層を製造する。
ステップS104では、ソースとエッチング阻止層の半導体基板から遠くはなれた一方側に連通金属を製造して、ソースとエッチング阻止層が連通金属を通じて接続するようにする。
ステップS105では、半導体基板のソースから遠くはなれた一方側から、エッチング阻止層の下方をエッチングして、半導体基板を貫通するスルーホールを形成する。
ソースとエッチング阻止層の半導体基板から遠く離れた同じ側に連通金属を製造することで、パッド金属を製造することもでき、ソースとエッチング阻止層が連通金属を通じて接続して、且つパッド金属にも接続し、デバイスを完成する。
また、本発明の記述において、説明する必要があることは、「上」、「下」、「内」、「外」等の用語で指示される方位又は位置関係は、図面に示す方位又は位置関係に基づく、或いは当該発明の商品の使用時の通常放置の方位又は位置関係に基づくものであり、単に本発明の記述を容易にし、簡略化させるためのものであり、所定の装置又は素子が必ず特定の方位を有し、特定の方位で構造し操作されることを指示又は暗示することではない。よって、本発明を制限するものであると理解してはいけない。また、本発明の説明において、「第一」、「第二」、「第三」、「第四」等の用語は、単に区別して説明するためのものであり、相対的重要性を意味又は示唆するものと理解されるべきではない。
Claims (14)
- 半導体基板と、
前記半導体基板の一方側に製造されたソースと、ゲートとドレインと、
前記ソースの位置する領域においておいたスルーホール領域及び前記スルーホール領域に製造されたエッチング阻止層と、
前記エッチング阻止層の下方に位置するとともに半導体基板を貫通したスルーホールと、を含んでおり、
前記エッチング阻止層の面積は前記おいておいたスルーホール領域の面積より小さく、エッチング阻止層とソースの間にギャップが存在して、ソースとエッチング阻止層とが直接に接触しない
ことを特徴とする半導体デバイス。 - 前記エッチング阻止層は前記おいておいたスルーホール領域を覆って、前記エッチング阻止層と前記ソースとを直接に接続して、連通させるようにする
ことを特徴とする請求項1に記載の半導体デバイス。 - 前記エッチング阻止層の面積は、前記スルーホールの前記半導体基板のソース側に近接する一方側の横断面の面積より大きい
ことを特徴とする請求項1に記載の半導体デバイス。 - 前記ソースの少なくとも一端が開くように、前記おいておいたスルーホール領域は、前記ゲートと平行な方向で前記ソースの少なくとも一端を貫通する
ことを特徴とする請求項1ないし3のいずれかに記載の半導体デバイス。 - 前記おいておいたスルーホール領域は、前記ゲートと平行な方向で前記ソースを貫通し、前記ソースの両端が開くようにする
ことを特徴とする請求項1ないし4のいずれかに記載の半導体デバイス。 - 前記おいておいたスルーホール領域は、前記ソースの内部に位置し、前記ソースが前記ゲートと平行な方向で開け口がないようにする
ことを特徴とする請求項1ないし3のいずれかに記載の半導体デバイス。 - 前記半導体デバイスには、前記ソースの対応する領域で複数のスルーホール領域がおいておかれて、前記複数のスルーホール領域は、相互に接続しあい、かつゲートと平行な方向で当該ソースを貫通し、前記ソースの両端が開くようにする
ことを特徴とする請求項1ないし4のいずれかに記載の半導体デバイス。 - 前記半導体デバイスには、前記ソースの対応する領域で複数のスルーホール領域がおいておかれて、前記複数のスルーホール領域は、ゲートと平行な方向に沿って、順番に並んでおり、且つ前記ゲートの両端に位置する二つのスルーホール領域がそれぞれ開け口を形成する
ことを特徴とする請求項1ないし4のいずれかに記載の半導体デバイス。 - 前記エッチング阻止層の材料のエッチング選択比率は前記半導体基板のそれより大きい
ことを特徴とする請求項1ないし8のいずれかに記載の半導体デバイス。 - 前記エッチング阻止層の材料は一種又は複数の金属の複合材料である
ことを特徴とする請求項1ないし8のいずれかに記載の半導体デバイス。 - 半導体基板を提供することと、
前記半導体基板の一方側にソースと、ゲートとドレインをつくり、前記ソースを製造するとき、前記ソースの位置する領域にソース金属を含めないスルーホール領域を置いておくことと、
前記おいておいたスルーホール領域にエッチング阻止層を製造することと、
前記半導体基板の前記ソースから遠い一方側から、前記エッチング阻止層の下方までエッチングして、前記半導体基板を貫通したスルーホールを形成することとを含んでおり、
前記エッチング阻止層の面積は前記おいておいたスルーホール領域の面積より小さく、エッチング阻止層とソースの間にギャップが存在して、ソースとエッチング阻止層とが直接に接触しない
半導体デバイスの製造方法。 - 前記ソースの位置する領域で前記スルーホール領域をおいておくステップは、前記半導体基板の一方側でおいておきたいスルーホール領域をシェルディング材料で覆って、当該側で材料を沈積してオーミック金属を形成するステップと、前記シェルディング材料を除去して、前記おいておいたスルーホール領域を形成するステップを含んでいる
ことを特徴とする前記請求項11に記載の製造方法。 - 前記ソースと前記エッチング阻止層の前記半導体基板から遠くはなれた一方側に連通金属を製造して、前記ソースと前記エッチング阻止層を連通金属を通じて接続させることを更に含んでいる
ことを特徴とする前記請求項11又は12に記載の製造方法。 - 前記エッチング阻止層の材料にエッチング選択比率は前記半導体基板のそれより大きい
ことを特徴とする前記請求項11ないし13のいずれかに記載の製造方法。
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