JP6927970B2 - 異なる電気的構成を可能にするダイボンドパッド設計 - Google Patents

異なる電気的構成を可能にするダイボンドパッド設計 Download PDF

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JP6927970B2
JP6927970B2 JP2018526210A JP2018526210A JP6927970B2 JP 6927970 B2 JP6927970 B2 JP 6927970B2 JP 2018526210 A JP2018526210 A JP 2018526210A JP 2018526210 A JP2018526210 A JP 2018526210A JP 6927970 B2 JP6927970 B2 JP 6927970B2
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light emitting
substrate
bond pad
die
bond pads
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JP2018534786A5 (https=
JP2018534786A (ja
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ユ，ウェン
ビー シェキン，オレグ
ビー シェキン，オレグ
ウォール，フランクリン
タイ，クオチョウ
マラ，モヒューディン
ゾナ，ロバート
クメテック，ジェフェリー
ニッケル，アレクサンダー
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ルミレッズ ホールディング ベーフェー
ルミレッズ ホールディング ベーフェー
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Priority claimed from PCT/US2016/057655 external-priority patent/WO2017087116A1/en
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JP2018526210A 2015-11-20 2016-10-19 異なる電気的構成を可能にするダイボンドパッド設計 Active JP6927970B2 (ja)

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US201562258385P 2015-11-20 2015-11-20
US62/258,385 2015-11-20
PCT/US2016/057655 WO2017087116A1 (en) 2015-11-20 2016-10-19 Die bond pad design to enable different electrical configurations

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JP2018534786A JP2018534786A (ja) 2018-11-22
JP2018534786A5 JP2018534786A5 (https=) 2019-12-05
JP6927970B2 true JP6927970B2 (ja) 2021-09-01

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Publication number Priority date Publication date Assignee Title
JP7319551B2 (ja) * 2020-03-31 2023-08-02 日亜化学工業株式会社 発光装置
CN114937679A (zh) 2021-04-20 2022-08-23 友达光电股份有限公司 发光二极管元件以及发光二极管电路
JP7780963B2 (ja) * 2022-01-21 2025-12-05 旭化成エレクトロニクス株式会社 赤外線発光装置

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Publication number Priority date Publication date Assignee Title
JPH01107549A (ja) * 1987-10-20 1989-04-25 Mitsubishi Electric Corp 半導体集積回路装置
JP4904628B2 (ja) * 2001-03-14 2012-03-28 パナソニック株式会社 複合発光素子
JP4254141B2 (ja) * 2001-07-30 2009-04-15 日亜化学工業株式会社 発光装置
JP2006012916A (ja) * 2004-06-22 2006-01-12 Toyoda Gosei Co Ltd 発光素子
JP2010517274A (ja) * 2007-01-22 2010-05-20 クリー レッド ライティング ソリューションズ、インコーポレイテッド 外部で相互接続された発光素子のアレイを用いる照明デバイスとその製造方法
US10074778B2 (en) * 2011-03-22 2018-09-11 Seoul Viosys Co., Ltd. Light emitting diode package and method for manufacturing the same
DE102013101367A1 (de) * 2013-02-12 2014-08-14 Osram Opto Semiconductors Gmbh Halbleiterchip
EP2973714B1 (en) * 2013-03-15 2019-05-08 Lumileds Holding B.V. Light emitting structure and mount
WO2015052616A1 (en) * 2013-10-09 2015-04-16 Koninklijke Philips N.V. Monolithic led arrays for uniform and high-brightness light sources
JP6548066B2 (ja) * 2013-12-26 2019-07-24 大日本印刷株式会社 Ｌｅｄ素子搭載用リードフレーム、ｌｅｄ素子搭載用樹脂付きリードフレーム及び半導体装置
JP6519135B2 (ja) * 2014-09-26 2019-05-29 日亜化学工業株式会社 発光装置及び発光装置用基板

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