JP6926078B2 - Circuit formation method and circuit formation device - Google Patents

Description

The present invention relates to a circuit forming method for forming a circuit by using a first discharging device for discharging a curable resin and a second discharging device for discharging a metal-containing liquid containing metal fine particles, and a circuit forming device.

In recent years, as described in the following patent documents, a technique for forming a three-dimensional model by a curable resin that is cured by irradiation with ultraviolet rays or the like has been developed. Using such a technique, a resin layer is formed of a curable resin, and a circuit is formed using the resin layer.

Japanese Unexamined Patent Publication No. 2013-0433338

When the circuit is formed by utilizing the technique described in the above patent document, not only the resin layer is formed by the curable resin, but also the wiring is formed by the metal-containing liquid containing metal fine particles. .. As described above, when the circuit is formed by using the curable resin and the metal-containing liquid, each of the curable resin and the metal-containing liquid is discharged by the discharge device, but the curability when discharged. The landing diameters of the resin and the metal-containing liquid may differ depending on the temperature at the planned discharge position. Differences in landing diameter may cause non-uniform wiring width, non-uniform film thickness of the resin layer, etc., which is not desirable. The present invention has been made in view of such circumstances, and an object of the present invention is to suppress a difference in landing diameter between a curable resin or a metal-containing liquid.

In order to solve the above problems, in the circuit forming method of the present invention, a circuit is formed by using a first discharging device for discharging a curable resin and a second discharging device for discharging a metal-containing liquid containing metal fine particles. A measurement step of measuring the temperature of one of a plurality of scheduled discharge positions of the curable resin by the first discharge device and a plurality of scheduled discharge positions of the metal-containing liquid by the second discharge device. If, on the basis of the measurement value measured in the measuring step, an estimation step of estimating a linear equation showing the relationship between the measurement time of the plurality of discharge will each position and the measured temperature, estimated in the estimation step the A discharge execution step of executing discharge to the scheduled discharge position at a timing when the temperature of the scheduled discharge position is predicted to reach a predetermined temperature based on the temperature change for each of the plurality of scheduled discharge positions based on the linear equation. The discharge execution step includes a curing step of curing one of the curable resin and the metal-containing liquid discharged at the scheduled discharge position with a uniform landing diameter.

Further, the circuit forming apparatus of the present invention comprises a first discharge device for discharging a curable resin, and a second discharge device for discharging the metal-containing liquid containing fine metal particles, a plurality of cured resin by the first discharge device controlling a discharge predetermined position, a measuring device for measuring one of temperature of a plurality of ejection predetermined position of the metal-containing solution according to the second discharge device, the actuation of said first ejection device and the second discharge device An estimation unit including a control device, wherein the control device estimates a linear equation showing the relationship between the measurement time and the measurement temperature for each of the plurality of scheduled discharge positions based on the measurement values measured by the measurement device. , To the scheduled discharge position at the timing when the temperature of the scheduled discharge position is predicted to reach a predetermined temperature based on the temperature change for each of the plurality of scheduled discharge positions based on the linear equation estimated by the estimation unit. It is characterized by having a discharge execution unit that executes the discharge of the above, and a curing unit that cures one of the curable resin and the metal-containing liquid discharged at the scheduled discharge position with a uniform landing diameter by the discharge execution unit. do.

In the circuit forming method and the circuit forming apparatus of the present invention, the temperature at the scheduled discharge position of the curable resin or the metal-containing liquid is measured, and based on the measured temperature, the temperature change with the passage of time at the scheduled discharge position changes. Presumed. Then, based on the estimated temperature change at the scheduled discharge position, the curable resin or the metal-containing liquid is discharged to the scheduled discharge position at the timing when the temperature at the scheduled discharge position is predicted to reach a predetermined temperature. As a result, the temperature at the scheduled discharge position when the curable resin or the metal-containing liquid is discharged can be set to a constant temperature, and the difference in landing diameter can be suitably suppressed.

It is a figure which shows the circuit formation apparatus of 1st Example. It is a block diagram which shows the control device of the circuit forming apparatus of FIG. It is sectional drawing which shows the circuit in the state which the resin laminate is formed. It is sectional drawing which shows the circuit in the state which the wiring is formed on the resin laminate. It is a top view which shows the circuit in the state which the metal ink is ejected on the resin laminate. It is a top view which shows the circuit in the state which the metal ink was ejected on the resin laminate according to the conventional method. It is a graph which shows the relationship between the measurement time and the measurement temperature. It is a top view which shows the circuit in the state which the metal ink was ejected on the resin laminate according to the method of this invention. It is a figure which shows the circuit formation apparatus of 2nd Example. It is a block diagram which shows the control device of the circuit forming apparatus of FIG.

First Example Circuit Forming Device Configuration FIG. 1 shows a circuit forming device 10. The circuit forming device 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a measuring unit 26, and a control device (see FIG. 2) 27. The transport device 20, the first modeling unit 22, the second modeling unit 24, and the measuring unit 26 are arranged on the base 28 of the circuit forming device 10. The base 28 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 28 is orthogonal to the X-axis direction, and the lateral direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is arranged on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is slidably held in the X-axis direction by the X-axis slide rail 34. Further, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. Further, the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is arranged on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. Then, one end of the Y-axis slide rail 50 is connected to the X-axis slider 36. The stage 52 is slidably held in the Y-axis slide rail 50 in the Y-axis direction. Further, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 includes a base 60, a holding device 62, an elevating device (see FIG. 2) 64, and a temperature maintaining device (see FIG. 2) 66. The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface thereof. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate mounted on the base 60 in the X-axis direction are sandwiched by the holding device 62, so that the substrate is fixedly held. Further, the elevating device 64 is arranged below the base 60 and raises and lowers the base 60. Further, the temperature maintenance device 66 is built in the base 60 and maintains the substrate mounted on the base 60 at a predetermined temperature.

The first modeling unit 22 is a unit for modeling wiring on a substrate (see FIG. 3) 70 mounted on a base 60 of a stage 52, and has a first printing unit 72 and a firing unit 74. ing. The first printing unit 72 has an inkjet head (see FIG. 2) 76, and linearly ejects metal ink onto the substrate 70 mounted on the base 60. Metal ink is a metal ink in which fine particles of metal are dispersed in a solvent. The inkjet head 76 ejects a conductive material from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.

The firing unit 74 has a laser irradiation device (see FIG. 2) 78. The laser irradiation device 78 is a device that irradiates the metal ink ejected on the substrate 70 with a laser, and the metal ink irradiated with the laser is fired to form wiring. In addition, firing of metal ink is a phenomenon in which the solvent is vaporized and the metal fine particle protective film is decomposed by applying energy, and the metal fine particles are brought into contact with each other or fused to increase the conductivity. be. Then, the metal ink is fired to form a metal wiring.

The second modeling unit 24 is a unit that forms a resin layer on the substrate 70 mounted on the base 60 of the stage 52, and has a second printing unit 84 and a curing unit 86. .. The second printing unit 84 has an inkjet head (see FIG. 2) 88, and discharges the ultraviolet curable resin onto the substrate 70 mounted on the base 60. The inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and discharged from a nozzle.

The curing portion 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the inkjet head 88. For example, the surplus resin is rolled or rolled while the surface of the ultraviolet curable resin is leveled. By scraping with a blade, the thickness of the UV curable resin is made uniform. Further, the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curable resin discharged on the substrate 70 with ultraviolet rays. As a result, the ultraviolet curable resin discharged onto the substrate 70 is cured, and the resin layer is formed.

Further, the measuring unit 26 has a measuring unit 100. The measuring unit 100 has a temperature sensor (see FIG. 2) 110, and the temperature sensor 110 measures the temperature at an arbitrary position on the substrate 70 mounted on the stage 52. The temperature sensor 110 includes a contact type temperature sensor and a non-contact type temperature sensor, and it is preferable to use a non-contact type temperature sensor. Examples of the non-contact type temperature sensor include a pyroelectric temperature sensor, a thermopile, and a radiation thermometer.

Further, as shown in FIG. 2, the control device 27 includes a controller 120 and a plurality of drive circuits 122. The plurality of drive circuits 122 are connected to the electromagnetic motors 38 and 56, the holding device 62, the elevating device 64, the temperature maintenance device 66, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, and the irradiation device 92. Has been done. The controller 120 includes a CPU, a ROM, a RAM, and the like, and is mainly a computer, and is connected to a plurality of drive circuits 122. As a result, the operation of the transfer device 20, the first modeling unit 22, and the second modeling unit 24 is controlled by the controller 120. Further, the controller 120 is connected to the temperature sensor 110 of the measurement unit 26, and the value detected by the temperature sensor 110 is input to the controller 120.

Operation of the circuit forming device In the circuit forming device 10, a circuit pattern is formed on the substrate 70 by the above-described configuration. Specifically, the substrate 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 3, the resin laminate 130 is formed on the substrate 70. The resin laminate 130 is formed by repeatedly ejecting the ultraviolet-curable resin from the inkjet head 88 and irradiating the discharged ultraviolet-curable resin with ultraviolet rays by the irradiation device 92.

Specifically, in the second printing unit 84 of the second modeling unit 24, the inkjet head 88 ejects the ultraviolet curable resin into a thin film on the upper surface of the substrate 70. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the cured portion 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin-film resin layer 132 is formed on the substrate 70.

Subsequently, the inkjet head 88 ejects the ultraviolet curable resin into a thin film on the thin film resin layer 132. Then, the thin-film ultraviolet-curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet-curable resin discharged in the thin-film form with ultraviolet rays, thereby forming the thin-film ultraviolet-curable resin on the thin-film resin layer 132. The thin-film resin layer 132 is laminated. In this way, the ejection of the ultraviolet-curable resin onto the thin-film resin layer 132 and the irradiation of ultraviolet rays are repeated, and the plurality of resin layers 132 are laminated to form the resin laminate 130.

When the resin laminate 130 is formed by the procedure described above, the stage 52 is moved below the first modeling unit 22. Then, in the first printing unit 72, the inkjet head 76 linearly ejects the metal ink onto the upper surface of the resin laminate 130 according to the circuit pattern. Next, in the firing unit 74, the laser irradiation device 78 irradiates the metal ink with a laser. As a result, the metal ink is fired, and as shown in FIG. 4, the wiring 136 is formed on the resin laminate 130. In this way, in the circuit forming apparatus 10, the resin laminate 130 is formed by the ultraviolet curable resin, and the wiring 136 is formed by the metal ions, so that the circuit pattern is formed on the substrate 70.

Since the metal ink for forming the wiring 136 contains volatile components, curing components, etc., it depends on the temperature at the position where the metal ink is ejected (hereinafter, may be referred to as "scheduled ejection position"). , The impact diameter of metal ink may be different. Incidentally, the landing diameter of the metal ink means the diameter of the droplet of the metal ink when the metal ink ejected by the inkjet head 76 lands at the scheduled ejection position. Specifically, when the metal ink is ejected to the scheduled ejection position, the volatile components are dried or the cured components are cured at the same time as the landing. Therefore, when the temperature at the planned ejection position is high, the metal ink dries or cures rapidly, so that the fluidity of the metal ink decreases before the metal ink gets wet and spreads, and the landing diameter becomes small. On the other hand, when the temperature at the planned ejection position is low, the metal ink dries or cures slowly, so that the metal ink gets wet and spreads, and the landing diameter becomes large. As described above, if the landing diameters are different, the width of the wiring 136 formed by firing the metal ink cannot be made constant, which is not desirable.

Therefore, in the circuit forming device 10, the temperature maintaining device 66 is built in the base 60, and the temperature of the substrate 70 mounted on the base 60 is kept constant. As a result, the temperature of the substrate 70 is kept constant, so that the temperature of the upper surface of the resin laminate 130 formed on the substrate 70, that is, the temperature at the planned discharge position can be kept constant, and the metal It is possible to make the landing diameter of the ink uniform. However, the resin laminate 130 from which the metal ink is discharged is composed of a plurality of resin layers 132, and the surface temperature of the resin laminate 130 differs depending on the number of layers of the resin layers 132 constituting the resin laminate 130. There is.

Specifically, since the resin layer 132 constituting the resin laminate 130 is formed by irradiation with ultraviolet rays, the temperature of the resin laminate 130 may be higher than the ambient temperature. Therefore, for example, when the resin laminate 130 is cooled by the temperature maintaining device 66, but the resin laminate 130 is composed of one resin layer 132, the surface temperature of the resin laminate 130 is compared. The temperature is cooled to a predetermined temperature by the temperature maintaining device 66 in a short time. Therefore, the metal ink ejected to the surface of the resin laminate 130 becomes a metal ink having a relatively large landing diameter. In addition, in FIG. 5, the metal ink 138 discharged to the resin laminate 130 composed of one resin layer 132 is shown by a dotted line.

On the other hand, for example, when the resin laminate 130 is composed of 10 resin layers 132, the surface temperature of the resin laminate 130 is cooled to a predetermined temperature by the temperature maintaining device 66, so that comparison is made. It takes a long time. Therefore, the metal ink may be ejected to the surface of the resin laminate 130 before the surface temperature of the resin laminate 130 is cooled to a predetermined temperature by the temperature maintaining device 66. In such a case, the surface temperature of the resin laminate 130 is higher than that of the resin laminate 130 composed of one resin layer 132, of the resin laminate 130 composed of 10 resin layers 132. The metal ink discharged onto the surface of the resin laminate 130 becomes a metal ink having a relatively small landing diameter. Note that FIG. 5 shows the metal ink 138 discharged to the resin laminate 130 composed of the 10 resin layers 132 by the alternate long and short dash line. As described above, the surface temperature of the resin laminate 130 may differ depending on the number of layers of the resin layer 132 constituting the resin laminate 130, and the impact diameter of the metal ink may differ.

Further, even when the metal ink is ejected onto one resin laminate 130, the impact diameter may differ depending on the ejection position. Specifically, the closer to the outer edge of the resin laminate 130, the higher the heat dissipation effect to the outside air. Therefore, the surface temperature of the resin laminate 130 becomes lower as it is closer to the outer edge of the resin laminate 130. The closer it is to the center, the higher it will be. Therefore, as shown in FIG. 6, the landing diameter of the metal ink 138 ejected on the surface of the resin laminate 130 increases as it is closer to the outer edge of the resin laminate 130 and closer to the center of the resin laminate 130. , Become smaller. In this way, even when the metal ink is ejected onto one resin laminate 130, the impact diameter may differ depending on the ejection position.

In view of this, in the circuit forming apparatus 10, the measurement unit 26 measures the surface temperature of the resin laminate 130, and based on the measured temperature, the surface temperature of the resin laminate 130 elapses over time. The accompanying temperature change is estimated. Then, based on the estimated temperature change, the metal ink is ejected at the timing when the temperature at the scheduled ejection position of the metal ink becomes a predetermined temperature. Specifically, after the resin laminate 130 is formed on the substrate 70, the stage 52 is moved below the measurement unit 26, and the temperature sensor 110 sets the temperature of the resin laminate 130 at the scheduled discharge position for a predetermined time. Measured multiple times each time. Then, the measured temperature is transmitted to the controller 120 and stored in the controller 120. Since the metal ink is ejected linearly, the temperatures of the plurality of scheduled ejection positions located linearly are measured and transmitted to the controller 120. In addition, the controller 120 stores the measured time as well as the measured temperature.

Then, when the temperature measurement at the scheduled discharge position of the resin laminate 130 is completed, the controller 120 performs regression analysis based on the stored measurement temperature and the measurement time, so that the time at the scheduled discharge position elapses. Estimate temperature changes. Specifically, for example, by applying a linear regression model between the measurement time X and the measurement temperature Y, a linear equation showing the relationship between the measurement time X and the measurement temperature Y is estimated as shown in FIG. 7. At this time, the slope and intercept of the linear equation showing the relationship between the measurement time X and the measurement temperature Y are estimated using, for example, the least squares method. The linear expression showing the relationship between the measurement time X and the measurement temperature Y is estimated for each of the plurality of scheduled discharge positions where the temperature has been measured. Then, for each of a plurality of ejection predetermined position, the primary expression showing the relationship between measurement time X and the measurement temperature Y is estimated, based on the linear expression, the time corresponding to the set temperatures T ₁ set in advance t ₁ is calculated. That is, for each of a plurality of ejection predetermined position, the time t ₁ is calculated the temperature of the discharge scheduled position becomes the set temperature T _1.

Further, the stage 52 is moved below the first modeling unit 22 while the above calculation is performed in the controller 120, that is, after the temperature measurement at the scheduled discharge position of the resin laminate 130 is completed. Then, in the first shaping unit 22, for each of a plurality of ejection predetermined position at a timing at time t ₁ which is calculated by the controller 120, a plurality of ejection predetermined position, sequentially ejected metal ink by the inkjet head 76 .. That is, for each of a plurality of ejection predetermined position, at the timing when the temperature of the discharge scheduled position becomes the set temperature T _1, the plurality of ejection predetermined position, the metal ink is sequentially spot discharged. As a result, the temperature of the scheduled ejection position when the metal ink is ejected can be made constant, and as shown in FIG. 8, the landing diameter of the metal ink is made uniform regardless of the ejection position of the metal ink. It becomes possible. Further, by adopting the above method, it is possible to make the landing diameter of the metal ink uniform even when the number of layers of the resin layers 132 constituting the resin laminate 130 is different. Then, when the ejection of the metal ink to the resin laminate 130 is completed, the firing unit 74 fires the metal ink. As a result, wiring 136 having a uniform width is formed.

As shown in FIG. 2, the controller 120 of the control device 27 has a measurement unit 180, an estimation unit 182, and a discharge execution unit 184. The measuring unit 180 is a functional unit for measuring the temperature at the scheduled discharge position by the temperature sensor 110. The estimation unit 182 is a functional unit for estimating a linear expression indicating a temperature change with the passage of time at the scheduled discharge position, that is, a relationship between the measurement time X and the measurement temperature Y. The ejection execution unit 184 is a functional unit for ejecting the metal ink at the timing when _{the time t 1} is predicted based on the estimated linear equation.

Second Example The circuit forming apparatus 200 of the second embodiment is shown in FIG. The circuit forming apparatus 200 of the second embodiment is the same as the circuit forming apparatus 10 of the first embodiment except that the measuring unit 26 has the temperature adjusting unit 102. Therefore, only the temperature adjusting unit 102 will be described, and the same components as those of the circuit forming apparatus 10 will be referred to with the same reference numerals as those of the circuit forming apparatus 10, and the description thereof will be omitted.

The temperature adjusting unit 102 adjusts the surface temperature of the resin laminate 130, and has a spot cooler 112 as shown in FIG. The spot cooler 112 is a device that blows cold air toward an arbitrary position, and is arranged side by side with the temperature sensor 110 of the measuring unit 100. Therefore, the spot cooler 112 can cool any position on the surface of the resin laminate 130 measured by the temperature sensor 110 with cold air.

In the circuit forming apparatus 200 having the above structure, by spot cooler 112, after the surface temperature of the resin laminate 130 is uniform, as in the first embodiment, the time the temperature of the discharge scheduled position becomes the set temperature T ₁ t ₁ is calculated, and at the _{timing when the time t 1} is reached, the metal ink is ejected to the scheduled ejection position. Specifically, also in the circuit forming apparatus 200 of the second embodiment, the resin laminated body 130 is formed by laminating the plurality of resin layers 132 on the upper surface of the substrate 70. Then, when the resin laminate 130 is formed on the substrate 70, the stage 52 is moved below the measurement unit 26.

In the measuring unit 26, first, the temperature sensor 110 measures the temperatures of the plurality of scheduled discharge positions of the resin laminate 130. Then, cold air is blown to each scheduled discharge position by the spot cooler 112 so that the temperature of each of the plurality of scheduled discharge positions _{becomes a temperature T 2} slightly higher than _{the set temperature T 1.} At this time, the temperature of the scheduled discharge position is continuously measured by the temperature sensor 110, and the measured temperature is input to the controller 120. Then, by feedback control, the controller 120 controls the operation of the spot cooler 112 so that the temperature at the scheduled discharge position _{becomes the temperature T 2.} As a result, the temperatures of the plurality of scheduled discharge positions of the resin laminate 130 are all uniform at the _{temperature T 2.}

Next, when the temperatures of the plurality of scheduled discharge positions of the resin laminate 130 become uniform, the temperature of any position among the temperatures of the plurality of scheduled discharge positions is set a plurality of times by the temperature sensor 110 at predetermined time intervals. , Measured. Then, the measured temperature is transmitted to the controller 120, and the transmitted measured temperature is stored in the controller 120 together with the measurement time. Then, when the temperature measurement at the scheduled discharge position of the resin laminate 130 is completed, the controller 120 performs regression analysis based on the stored measurement temperature and the measurement time, so that the time at the scheduled discharge position elapses. A linear equation showing the temperature change, that is, the relationship between the measurement time X and the measurement temperature Y is estimated. Since the method of estimating the linear expression showing the relationship between the measurement time X and the measurement temperature Y is the same as that of the first embodiment, the description thereof will be omitted.

When the primary expression showing the relationship between measurement time X and the measurement temperature Y is estimated, based on the linear expression, the time t ₁ is calculated corresponding to the set temperature T _1. In other words, the time t ₁ at which the temperature of the discharge predetermined position at an arbitrary position among the plurality of ejection scheduled position is set temperatures T ₁ is calculated. However, before the temperature measurement by the temperature sensor 110 is started, the temperature of the plurality of ejection predetermined position of the resin laminate 130, because it is the temperature of all uniform by spot cooler 112, the time t ₁ has a plurality of It is considered the time that all of the temperature of the discharge plan position reaches the set temperature T _1.

Further, the stage 52 is moved below the first modeling unit 22 while the above calculation is performed in the controller 120, that is, after the temperature measurement at the scheduled discharge position of the resin laminate 130 is completed. Then, in the first shaping unit 22, at the timing when the time t ₁ which is calculated by the controller 120, to all of the plurality of ejection predetermined position, the metal ink by the inkjet head 76, is continuously discharged. As a result, the temperature at the scheduled ejection position when the metal ink is ejected can be set to the set temperature T ₁ , regardless of the ejection position of the metal ink and the number of layers of the resin layer 132 constituting the resin laminate 130. , It is possible to make the landing diameter of the metal ink uniform. Then, when the ejection of the metal ink to the resin laminate 130 is completed, the firing unit 74 fires the metal ink. As a result, wiring 136 having a uniform width is formed.

Thus, in the circuit forming apparatus 200 of the second embodiment, estimates a timing when the temperature of the discharge expected position is the set temperature T _1, by ejecting the metallic ink at that timing, the circuit of the first embodiment Similar to the forming device 10, it is possible to make the landing diameter of the metal ink uniform. Further, in the circuit forming apparatus 200 of the second embodiment, the temperature at the scheduled discharge position is forcibly cooled by the spot cooler 112 to _{a temperature T 2} which is a temperature slightly higher than _{the set temperature T 1.} As a result, the time until the temperature at the scheduled ejection position reaches the set temperature T ₁ , that is, the waiting time until the metal ink is ejected is shortened, and the tact time can be shortened. Furthermore, in the circuit forming apparatus 200 of the second embodiment, all the temperatures of the plurality of scheduled discharge positions are made uniform by the spot cooler 112. Therefore, the metal ink can be continuously ejected to the plurality of scheduled ejection positions, and the tact time can be shortened.

As shown in FIG. 10, the controller 120 of the control device 27 has a measurement unit 180, an estimation unit 182, a discharge execution unit 184, and an adjustment unit 186. The measurement unit 180, the estimation unit 182, and the discharge execution unit 184 are the same functional units as those of the first embodiment. The adjusting unit 186 is a functional unit for adjusting the temperature of the scheduled discharge position to an arbitrary temperature by the spot cooler 112.

Incidentally, in the above embodiment, the circuit forming apparatus 10 is an example of the circuit forming apparatus. The control device 27 is an example of the control device. The inkjet head 76 is an example of a second ejection device. The inkjet head 88 is an example of the first ejection device. The temperature sensor 110 is an example of a measuring device. The spot cooler 112 is an example of a temperature control device. The estimation unit 182 is an example of the estimation unit. The discharge execution unit 184 is an example of a discharge execution unit. The circuit forming device 200 is an example of a circuit forming device. Further, the process executed by the measuring unit 180 is an example of the measuring process. The process executed by the estimation unit 182 is an example of the estimation process. The process executed by the discharge execution unit 184 is an example of the discharge execution process. The process executed by the adjusting unit 186 is an example of the adjusting process.

The present invention is not limited to the above examples, and can be carried out in various modes with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above-described embodiment, the method of ejecting the metal ink is described, but the above-mentioned method can be applied to the method of ejecting the ultraviolet curable resin. Further, the above method can be applied not only to the ultraviolet curable resin but also to the method of discharging a curable resin that is cured by heat or the like.

Further, when the wiring 136 is formed, the metal ink 138 is laminated and the laminated metal ink 138 is fired, so that the wiring 136 may be formed. In such a case, the temperature change with the passage of time at the scheduled ejection position is estimated in consideration of the number of laminated metal inks. That is, the temperature change with the passage of time at the scheduled ejection position is estimated based on the number of laminated metal inks and the relationship between the measurement time X and the measurement temperature Y. When the present invention is applied to a method for discharging a curable resin, the planned discharge position is based on the number of layers of the curable resin such as an ultraviolet curable resin and the relationship between the measurement time X and the measurement temperature Y. The temperature change with the passage of time is estimated.

Further, in the above embodiment, the linear regression model is used when the temperature change with the passage of time of the scheduled discharge position is estimated, but a non-linear regression model may be used. Further, not only the least squares method but also various methods may be used to estimate a regression equation showing the relationship between the measurement time X and the measurement temperature Y.

10: Circuit forming device 27: Control device 76: Inkjet head (second ejection device) 88: Inkjet head (first ejection device) 110: Temperature sensor (measuring device) 112: Spot cooler (temperature adjusting device) 180: Measuring unit (Measurement process) 182: Estimate unit (estimation process) 184: Discharge execution unit (discharge execution process) 186: Adjustment unit (adjustment process) 200: Circuit forming device

Claims (5)

A circuit forming method for forming a circuit by using a first discharging device for discharging a curable resin and a second discharging device for discharging a metal-containing liquid containing metal fine particles.
A measurement step of measuring the temperature of one of a plurality of scheduled discharge positions of the curable resin by the first discharge device and a plurality of scheduled discharge positions of the metal-containing liquid by the second discharge device.
Based on the measured values measured in the measurement step, an estimation step of estimating a linear equation showing the relationship between the measurement time and the measurement temperature for each of the plurality of scheduled discharge positions, and an estimation step.
Based on the temperature change for each of the plurality of scheduled discharge positions estimated in the estimation step based on the linear equation, the temperature of the scheduled discharge position is predicted to reach a predetermined temperature, and the temperature is changed to the scheduled discharge position. The discharge execution process that executes discharge and the discharge execution process
A circuit forming method including a curing step of curing one of a curable resin and a metal-containing liquid discharged at a scheduled discharge position with a uniform landing diameter in the discharge execution step. The estimation step utilizes both the number of layers of the curable resin by the first discharge device at the scheduled discharge position and the number of layers of the metal-containing liquid by the second discharge device at the planned discharge position. The circuit forming method according to claim 1, wherein the temperature change with the passage of time at the scheduled discharge position is estimated. The measuring step measures the temperature of the plurality of scheduled discharge positions, and the temperature is measured.
The first or second aspect of the present invention, wherein the discharge execution step sequentially executes discharge to the plurality of scheduled discharge positions at a timing at which the temperature of each of the plurality of scheduled discharge positions is predicted to reach a predetermined temperature. Circuit formation method. The measurement step includes an adjustment step of adjusting the temperature of the scheduled discharge position by a temperature adjusting device before the temperature of the scheduled discharge position is measured.
The circuit forming method according to any one of claims 1 to 3, wherein the measuring step measures the temperature of the scheduled discharge position whose temperature has been adjusted in the adjusting step. The first discharge device that discharges the curable resin and
A second discharge device that discharges a metal-containing liquid containing metal fine particles,
A measuring device for measuring the temperature of one of a plurality of scheduled discharge positions of the curable resin by the first discharge device and a plurality of scheduled discharge positions of the metal-containing liquid by the second discharge device .
A control device for controlling the operation of the first discharge device and the second discharge device is provided.
The control device
Based on the measured values measured by the measuring device, an estimation unit that estimates a linear expression showing the relationship between the measurement time and the measurement temperature for each of the plurality of scheduled discharge positions, and an estimation unit.
Based on the temperature change for each of the plurality of scheduled discharge positions based on the linear equation estimated by the estimation unit, the temperature of the scheduled discharge position is predicted to reach a predetermined temperature, and the temperature is changed to the scheduled discharge position. The discharge execution unit that executes discharge and the discharge execution unit
A circuit forming apparatus having a curing portion that cures one of a curable resin and a metal-containing liquid discharged at a scheduled discharge position with a uniform landing diameter by the discharging execution unit.

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