JPWO2017221347A1 - Circuit forming method and circuit forming apparatus - Google Patents

Abstract

In the circuit forming method and the circuit forming apparatus of the present invention, the temperature at the expected discharge position of the curable resin or the metal-containing liquid is measured, and the temperature change with the passage of time at the expected discharge position is based on the measured temperature. Presumed. That is, a linear expression indicating the relationship between the measurement time X and the measurement temperature Y is estimated. Then, based on the estimated primary expression, the curable resin or the metal-containing liquid is discharged to the planned discharge position at a timing (t1) at which the temperature of the planned discharge position is predicted to become the predetermined temperature T1. Thereby, it becomes possible to make the temperature of the ejection scheduled position when the curable resin or the metal-containing liquid is ejected constant, and it is possible to suitably suppress the difference in the landing diameter.

Description

  The present invention relates to a circuit forming method and a circuit forming apparatus for forming a circuit using a first discharge device that discharges a curable resin and a second discharge device that discharges a metal-containing liquid containing metal fine particles.

  In recent years, as described in the following patent documents, a technique for forming a three-dimensional structure using a curable resin that is cured by irradiation with ultraviolet rays or the like has been developed. Using such a technique, a resin layer is formed from a curable resin, and a circuit is formed using the resin layer.

JP 2013-043338 A

  When a circuit is formed using the technique described in the above-mentioned patent document, not only a resin layer is formed by a curable resin, but also a wiring is formed by a metal-containing liquid containing metal fine particles. . As described above, when the circuit is formed using the curable resin and the metal-containing liquid, each of the curable resin and the metal-containing liquid is discharged by the discharge device. The landing diameters of the resin, the metal-containing liquid, and each may differ depending on the temperature at the expected discharge position. The difference in the landing diameter is not desirable because it may cause nonuniformity in the width of the wiring, nonuniformity in the thickness of the resin layer, and the like. This invention is made | formed in view of such a situation, and the subject of this invention is suppressing the difference in the landing diameter of curable resin or a metal containing liquid.

  In order to solve the above problems, a circuit forming method of the present invention forms a circuit using a first discharge device that discharges a curable resin and a second discharge device that discharges a metal-containing liquid containing metal fine particles. A circuit forming method for measuring a temperature of one of a planned discharge position of the curable resin by the first discharge device and a predetermined discharge position of the metal-containing liquid by the second discharge device, and the measurement Based on the measured value measured in the step, the estimation step for estimating the temperature change with the passage of time of the scheduled discharge position, and the discharge based on the temperature change of the planned discharge position estimated in the estimation step A discharge execution step of performing discharge to the predetermined discharge position at a timing at which the temperature at the predetermined position is predicted to become a predetermined temperature.

  The circuit forming apparatus of the present invention includes a first discharge device that discharges a curable resin, a second discharge device that discharges a metal-containing liquid containing metal fine particles, and a discharge of the curable resin by the first discharge device. A measuring device that measures one of a predetermined position and a predetermined discharge position of the metal-containing liquid by the second discharge device; and a control device that controls the operation of the first discharge device and the second discharge device. The control device estimates a temperature change with the passage of time of the scheduled discharge position based on the measurement value measured by the measurement device, and the estimated discharge position estimated by the estimation unit. And a discharge execution unit that executes discharge to the planned discharge position at a timing at which the temperature of the planned discharge position is predicted to become a predetermined temperature based on a temperature change.

  In the circuit forming method and the circuit forming apparatus of the present invention, the temperature at the expected discharge position of the curable resin or the metal-containing liquid is measured, and the temperature change with the passage of time at the expected discharge position is based on the measured temperature. Presumed. Then, based on the estimated temperature change of the planned discharge position, the curable resin or the metal-containing liquid is discharged to the planned discharge position at a timing at which the temperature of the planned discharge position is predicted to become a predetermined temperature. Thereby, it becomes possible to make the temperature of the ejection scheduled position when the curable resin or the metal-containing liquid is ejected constant, and it is possible to suitably suppress the difference in the landing diameter.

It is a figure which shows the circuit formation apparatus of 1st Example. It is a block diagram which shows the control apparatus of the circuit formation apparatus of FIG. It is sectional drawing which shows the circuit of the state in which the resin laminated body was formed. It is sectional drawing which shows the circuit of the state by which wiring was formed on the resin laminated body. It is a top view which shows the circuit of the state by which the metal ink was discharged on the resin laminated body. It is a top view which shows the circuit of the state by which the metal ink was discharged on the resin laminated body according to the conventional method. It is a graph which shows the relationship between measurement time and measurement temperature. It is a top view which shows the circuit of the state by which the metal ink was discharged on the resin laminated body according to the method of this invention. It is a figure which shows the circuit formation apparatus of 2nd Example. It is a block diagram which shows the control apparatus of the circuit formation apparatus of FIG.

First Embodiment Configuration of Circuit Forming Apparatus FIG. 1 shows a circuit forming apparatus 10. The circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a measurement unit 26, and a control device (see FIG. 2) 27. The conveying device 20, the first modeling unit 22, the second modeling unit 24, and the measurement unit 26 are disposed on the base 28 of the circuit forming device 10. The base 28 has a generally rectangular shape. In the following description, the longitudinal direction of the base 28 is orthogonal to the X-axis direction, and the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.

  The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. The Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

  The stage 52 includes a base 60, a holding device 62, a lifting device (see FIG. 2) 64, and a temperature maintaining device (see FIG. 2) 66. The base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. The both edges in the X-axis direction of the substrate placed on the base 60 are sandwiched between the holding devices 62, so that the substrate is fixedly held. The lifting device 64 is disposed below the base 60 and lifts the base 60. The temperature maintaining device 66 is built in the base 60 and maintains the substrate placed on the base 60 at a predetermined temperature.

  The first modeling unit 22 is a unit that models wiring on a substrate (see FIG. 3) 70 placed on the base 60 of the stage 52, and includes a first printing unit 72 and a firing unit 74. ing. The first printing unit 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink in a linear manner onto the substrate 70 placed on the base 60. The metal ink is obtained by dispersing metal fine particles in a solvent. The inkjet head 76 discharges a conductive material from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.

  The firing unit 74 includes a laser irradiation device (see FIG. 2) 78. The laser irradiation device 78 is a device that irradiates a metal ink discharged onto the substrate 70 with a laser, and the metal ink irradiated with the laser is baked to form a wiring. The firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal fine particle protective film is decomposed, etc., and the metal fine particles are contacted or fused to increase the conductivity. is there. And metal wiring is formed by baking metal ink.

  The second modeling unit 24 is a unit that models a resin layer on the substrate 70 placed on the base 60 of the stage 52, and includes a second printing unit 84 and a curing unit 86. . The second printing unit 84 has an inkjet head (see FIG. 2) 88 and discharges an ultraviolet curable resin onto the substrate 70 placed on the base 60. The ink jet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle.

  The curing unit 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 is for flattening the upper surface of the ultraviolet curable resin discharged onto the substrate 70 by the inkjet head 88. By scraping with a blade, the thickness of the UV curable resin is made uniform. The irradiation device 92 includes a mercury lamp or LED as a light source, and irradiates the ultraviolet curable resin discharged onto the substrate 70 with ultraviolet rays. Thereby, the ultraviolet curable resin discharged on the board | substrate 70 hardens | cures, and a resin layer is modeled.

  Further, the measurement unit 26 has a measurement unit 100. The measuring unit 100 includes a temperature sensor (see FIG. 2) 110, and the temperature sensor 110 measures the temperature at an arbitrary position on the substrate 70 placed on the stage 52. The temperature sensor 110 includes a contact type temperature sensor and a non-contact type temperature sensor, but it is preferable to employ a non-contact type temperature sensor. Examples of the non-contact type temperature sensor include a pyroelectric temperature sensor, a thermopile, and a radiation thermometer.

  Further, as shown in FIG. 2, the control device 27 includes a controller 120 and a plurality of drive circuits 122. The plurality of drive circuits 122 are connected to the electromagnetic motors 38 and 56, the holding device 62, the elevating device 64, the temperature maintaining device 66, the ink jet head 76, the laser irradiation device 78, the ink jet head 88, the flattening device 90, and the irradiation device 92. Has been. The controller 120 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 122. Thereby, the operation of the transport device 20, the first modeling unit 22, and the second modeling unit 24 is controlled by the controller 120. Further, the controller 120 is connected to the temperature sensor 110 of the measurement unit 26, and a detection value by the temperature sensor 110 is input to the controller 120.

Operation of Circuit Forming Device In the circuit forming device 10, a circuit pattern is formed on the substrate 70 with the above-described configuration. Specifically, the substrate 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the second modeling unit 24. And in the 2nd modeling unit 24, as shown in FIG. 3, the resin laminated body 130 is formed on the board | substrate 70. As shown in FIG. The resin laminate 130 is formed by repeating the discharge of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92 to the discharged ultraviolet curable resin.

  In detail, in the 2nd printing part 84 of the 2nd modeling unit 24, the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the board | substrate 70 in thin film form. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 132 is formed on the substrate 70.

  Subsequently, the inkjet head 88 discharges an ultraviolet curable resin in a thin film form on the thin resin layer 132. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 132 is formed on the thin film resin layer 132. A thin resin layer 132 is laminated. In this manner, the discharge of the ultraviolet curable resin onto the thin resin layer 132 and the irradiation with the ultraviolet rays are repeated, and the resin laminate 132 is formed by laminating the plurality of resin layers 132.

  When the resin laminate 130 is formed by the above-described procedure, the stage 52 is moved below the first modeling unit 22. And in the 1st printing part 72, the inkjet head 76 discharges a metal ink on the upper surface of the resin laminated body 130 according to a circuit pattern at linear form. Next, in the baking part 74, the laser irradiation apparatus 78 irradiates a metal ink with a laser. As a result, the metal ink is baked, and the wiring 136 is formed on the resin laminate 130 as shown in FIG. As described above, in the circuit forming apparatus 10, the resin laminate 130 is formed of the ultraviolet curable resin, and the wiring 136 is formed of the metal ions, whereby a circuit pattern is formed on the substrate 70.

  Note that the metal ink for forming the wiring 136 contains a volatile component, a curing component, and the like, and therefore depends on the temperature at which the metal ink is ejected (hereinafter sometimes referred to as “scheduled ejection position”). The landing diameter of the metal ink may be different. Incidentally, the landing diameter of the metal ink means the diameter of the droplet of the metal ink when the metal ink discharged by the inkjet head 76 has landed on the planned discharge position. Specifically, when the metal ink is ejected to the intended ejection position, the volatile component is dried or the cured component is cured simultaneously with the landing. For this reason, when the temperature at the expected discharge position is high, the drying or curing of the metal ink proceeds rapidly, so that the fluidity of the metal ink is lowered before the metal ink is wet and spread, and the landing diameter is reduced. On the other hand, when the temperature at the planned discharge position is low, the drying or curing of the metal ink proceeds slowly, so that the metal ink wets and spreads, and the landing diameter increases. Thus, if the landing diameters are different, the width of the wiring 136 formed by firing the metal ink cannot be made constant, which is not desirable.

  For this reason, in the circuit forming apparatus 10, the temperature maintaining device 66 is built in the base 60, and the temperature of the substrate 70 placed on the base 60 is kept constant. As a result, the temperature of the substrate 70 is kept constant, so that the temperature of the upper surface of the resin laminate 130 formed on the substrate 70, that is, the temperature at the planned discharge position can be kept constant. It is possible to make the landing diameter of the ink uniform. However, the resin laminate 130 from which the metal ink is ejected is composed of a plurality of resin layers 132, and the surface temperature of the resin laminate 130 differs depending on the number of resin layers 132 constituting the resin laminate 130. There is.

  Specifically, since the resin layer 132 constituting the resin laminate 130 is formed by irradiation with ultraviolet rays, the resin laminate 130 may be higher than the ambient temperature. For this reason, for example, the resin laminate 130 is cooled by the temperature maintaining device 66, but when the resin laminate 130 is constituted by one resin layer 132, the surface temperature of the resin laminate 130 is compared. In a short time, the temperature is maintained at a predetermined temperature by the temperature maintaining device 66. For this reason, the metal ink ejected on the surface of the resin laminate 130 is a metal ink having a relatively large landing diameter. Note that, in FIG. 5, the metal ink 138 discharged to the resin laminate 130 constituted by one resin layer 132 is indicated by a dotted line.

  On the other hand, for example, when the resin laminate 130 is constituted by ten resin layers 132, the surface temperature of the resin laminate 130 is cooled to a predetermined temperature by the temperature maintaining device 66. Takes a long time. For this reason, the metal ink may be discharged onto the surface of the resin laminate 130 before the surface temperature of the resin laminate 130 is cooled to a predetermined temperature by the temperature maintaining device 66. In such a case, the surface temperature of the resin laminate 130 is higher than that of the resin laminate 130 constituted by one resin layer 132. The metal ink discharged to the surface of the resin laminate 130 becomes a metal ink having a relatively small landing diameter. In FIG. 5, the metal ink 138 discharged to the resin laminate 130 including the ten resin layers 132 is indicated by a one-dot chain line. As described above, the surface temperature of the resin laminate 130 is different depending on the number of the resin layers 132 constituting the resin laminate 130, and the landing diameter of the metal ink may be different.

  Even when metal ink is ejected onto one resin laminate 130, the landing diameter may differ depending on the ejection position. Specifically, the closer to the outer edge of the resin laminate 130, the higher the heat dissipation effect to the outside air. Therefore, the surface temperature of the resin laminate 130 becomes lower as the outer edge of the resin laminate 130 is closer. The closer to the center, the higher. For this reason, as shown in FIG. 6, the landing diameter of the metal ink 138 discharged onto the surface of the resin laminate 130 increases as it approaches the outer edge of the resin laminate 130, and as it approaches the center of the resin laminate 130. , Get smaller. Thus, even when metal ink is ejected onto one resin laminate 130, the landing diameter may differ depending on the ejection position.

  In view of such a situation, in the circuit forming apparatus 10, the measurement unit 26 measures the surface temperature of the resin laminate 130, and based on the measured temperature, the time of the surface temperature of the resin laminate 130 elapses. The accompanying temperature change is estimated. Then, based on the estimated temperature change, the metal ink is ejected at a timing when the temperature of the metal ink ejection scheduled position becomes a predetermined temperature. Specifically, after the resin laminate 130 is formed on the substrate 70, the stage 52 is moved below the measurement unit 26, and the temperature at the expected discharge position of the resin laminate 130 is set by the temperature sensor 110 for a predetermined time. It is measured several times every time. Then, the measured temperature is transmitted to the controller 120 and stored in the controller 120. Since the metal ink is ejected linearly, the temperatures of a plurality of planned ejection positions located in a linear shape are measured and transmitted to the controller 120. The controller 120 also stores the measured time along with the measured temperature.

Then, when the temperature measurement at the planned discharge position of the resin laminate 130 is completed, the controller 120 performs regression analysis based on the stored measured temperature and measurement time, thereby allowing the time at the planned discharge position to elapse. Estimate temperature change. Specifically, for example, by applying a linear regression model between the measurement time X and the measurement temperature Y, a linear expression indicating the relationship between the measurement time X and the measurement temperature Y is estimated as shown in FIG. At this time, the slope and intercept of the linear expression indicating the relationship between the measurement time X and the measurement temperature Y are estimated using, for example, the least square method. In addition, the linear expression which shows the relationship between the measurement time X and the measurement temperature Y is estimated for every several discharge scheduled position by which the temperature was measured. When a primary expression indicating the relationship between the measurement time X and the measurement temperature Y is estimated for each of the plurality of scheduled discharge positions, the time t corresponding to the preset set temperature T ₁ based on the primary expression. ₁ is calculated. That is, for each of a plurality of ejection predetermined position, the time t ₁ is calculated the temperature of the discharge scheduled position becomes the set temperature T _1.

Further, the stage 52 is moved below the first modeling unit 22 while the calculation is performed in the controller 120, that is, after the temperature measurement at the expected discharge position of the resin laminate 130 is completed. In the first modeling unit 22, the metal ink is sequentially ejected to the plurality of scheduled ejection positions by the inkjet head 76 at the timing t ₁ calculated by the controller 120 for each of the plurality of scheduled ejection positions. . That is, for each of a plurality of ejection predetermined position, at the timing when the temperature of the discharge scheduled position becomes the set temperature T _1, the plurality of ejection predetermined position, the metal ink is sequentially spot discharged. This makes it possible to keep the temperature at the expected discharge position when the metal ink is discharged, and as shown in FIG. 8, the landing diameter of the metal ink is made uniform regardless of the discharge position of the metal ink. It becomes possible. Further, by adopting the above-described method, it is possible to make the landing diameter of the metal ink uniform even when the number of the resin layers 132 constituting the resin laminate 130 is different. When the discharge of the metal ink to the resin laminate 130 is completed, the firing of the metal ink is performed in the firing unit 74. As a result, the wiring 136 having a uniform width is formed.

The controller 120 of the control device 27 includes a measurement unit 180, an estimation unit 182 and a discharge execution unit 184, as shown in FIG. The measurement unit 180 is a functional unit for measuring the temperature at the planned discharge position by the temperature sensor 110. The estimation unit 182 is a functional unit for estimating a temperature change with the passage of time at the scheduled discharge position, that is, a linear expression indicating the relationship between the measurement time X and the measurement temperature Y. The ejection execution unit 184 is a functional unit for ejecting the metal ink at the time t ₁ predicted based on the estimated linear expression.

Second Embodiment FIG. 9 shows a circuit forming apparatus 200 according to a second embodiment. The circuit forming apparatus 200 according to the second embodiment is the same as the circuit forming apparatus 10 according to the first embodiment, except that the measurement unit 26 includes the temperature adjustment unit 102. Therefore, only the temperature adjustment unit 102 will be described, and the same components as those of the circuit forming apparatus 10 are denoted by the same reference numerals as those of the circuit forming apparatus 10 and description thereof is omitted.

  The temperature adjustment unit 102 adjusts the surface temperature of the resin laminate 130 and has a spot cooler 112 as shown in FIG. The spot cooler 112 is a device that blows cool air toward an arbitrary position, and is arranged side by side with the temperature sensor 110 of the measurement unit 100. For this reason, the spot cooler 112 can cool an arbitrary position on the surface of the resin laminate 130 measured by the temperature sensor 110 with cold air.

In the circuit forming apparatus 200 having the above-described structure, after the surface temperature of the resin laminate 130 is made uniform by the spot cooler 112, the time t when the temperature at the expected discharge position becomes the set temperature T ₁ as in the first embodiment. ₁ is calculated, and metal ink is ejected to the intended ejection position at the time t ₁ . Specifically, also in the circuit forming apparatus 200 of the second embodiment, the resin laminate 130 is formed by laminating a plurality of resin layers 132 on the upper surface of the substrate 70. When the resin laminate 130 is formed on the substrate 70, the stage 52 is moved below the measurement unit 26.

In the measurement unit 26, first, the temperature sensor 110 measures the temperatures of a plurality of scheduled discharge positions of the resin laminate 130. Then, the cool air is blown by the spot cooler 112 to each scheduled discharge position so that the temperature of each of the plurality of scheduled discharge positions becomes a temperature T ₂ slightly higher than the set temperature T ₁ . At this time, the temperature measurement of the planned ejection position by the temperature sensor 110 is continuously performed, and the measured temperature is input to the controller 120. Then, the feedback control, the temperature of the discharge scheduled position is such that the temperature T _2, the controller 120 controls the operation of the spot cooler 112. Thus, the temperature of the plurality of ejection predetermined position of the resin laminate 130 becomes uniform at all temperatures T _2.

  Next, when the temperatures at the plurality of scheduled discharge positions of the resin laminate 130 become uniform, the temperature at any position among the temperatures at the plurality of planned discharge positions is changed a plurality of times at predetermined time intervals by the temperature sensor 110. , Measured. Then, the measured temperature is transmitted to the controller 120, and the transmitted measured temperature is stored in the controller 120 together with the measurement time. Then, when the temperature measurement at the planned discharge position of the resin laminate 130 is completed, the controller 120 performs regression analysis based on the stored measured temperature and measurement time, thereby allowing the time at the planned discharge position to elapse. A linear expression indicating a temperature change, that is, a relationship between the measurement time X and the measurement temperature Y is estimated. The primary method for estimating the relationship between the measurement time X and the measurement temperature Y is the same as that in the first embodiment, and a description thereof will be omitted.

When the primary expression showing the relationship between measurement time X and the measurement temperature Y is estimated, based on the linear expression, the time t ₁ is calculated corresponding to the set temperature T _1. In other words, the time t ₁ at which the temperature of the discharge predetermined position at an arbitrary position among the plurality of ejection scheduled position is set temperatures T ₁ is calculated. However, before the temperature measurement by the temperature sensor 110 is started, the temperature of the plurality of ejection predetermined position of the resin laminate 130, because it is the temperature of all uniform by spot cooler 112, the time t ₁ has a plurality of It is considered the time that all of the temperature of the discharge plan position reaches the set temperature T _1.

Further, the stage 52 is moved below the first modeling unit 22 while the calculation is performed in the controller 120, that is, after the temperature measurement at the expected discharge position of the resin laminate 130 is completed. In the first modeling unit 22, metal ink is continuously ejected by the inkjet head 76 to all of the plurality of scheduled ejection positions at the time t ₁ calculated by the controller 120. Thus, it is possible to set temperature T ₁ of the temperature of the discharge scheduled position when the metal ink is ejected, the ejection position of the metal ink, irrespective of the number of stacked resin layer 132 constituting the resin laminate 130 In addition, the landing diameter of the metal ink can be made uniform. When the discharge of the metal ink to the resin laminate 130 is completed, the firing of the metal ink is performed in the firing unit 74. As a result, the wiring 136 having a uniform width is formed.

Thus, in the circuit forming apparatus 200 of the second embodiment, estimates a timing when the temperature of the discharge expected position is the set temperature T _1, by ejecting the metallic ink at that timing, the circuit of the first embodiment Similar to the forming apparatus 10, it is possible to make the landing diameter of the metal ink uniform. Further, in the circuit forming apparatus 200 according to the second embodiment, the spot cooler 112 forcibly cools the temperature at the planned ejection position to a temperature T ₂ that is slightly higher than the set temperature T ₁ . Accordingly, time until the temperature of the discharge expected position is the set temperature T _1, that is, shortens the waiting time until the eject metallic ink, it is possible to shorten the tact time. Furthermore, in the circuit forming apparatus 200 of the second embodiment, all temperatures at a plurality of scheduled discharge positions are made uniform by the spot cooler 112. For this reason, it is possible to continuously eject the metal ink to the plurality of scheduled ejection positions, and it is possible to shorten the tact time.

  As shown in FIG. 10, the controller 120 of the control device 27 includes a measurement unit 180, an estimation unit 182, a discharge execution unit 184, and an adjustment unit 186. The measurement unit 180, the estimation unit 182 and the discharge execution unit 184 are the same functional units as those in the first embodiment. The adjustment unit 186 is a functional unit for adjusting the temperature at the planned discharge position to an arbitrary temperature by the spot cooler 112.

  Incidentally, in the above-described embodiment, the circuit forming apparatus 10 is an example of a circuit forming apparatus. The control device 27 is an example of a control device. The inkjet head 76 is an example of a second ejection device. The inkjet head 88 is an example of a first discharge device. The temperature sensor 110 is an example of a measuring device. The spot cooler 112 is an example of a temperature adjustment device. The estimation unit 182 is an example of an estimation unit. The discharge execution unit 184 is an example of a discharge execution unit. The circuit forming apparatus 200 is an example of a circuit forming apparatus. Moreover, the process performed by the measurement part 180 is an example of a measurement process. The process executed by the estimation unit 182 is an example of the estimation process. The process executed by the discharge execution unit 184 is an example of a discharge execution process. The process executed by the adjustment unit 186 is an example of the adjustment process.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. For example, in the above-described embodiment, the method for ejecting the metal ink has been described. However, the above method can be applied to the method for ejecting the ultraviolet curable resin. Further, the method is not limited to the ultraviolet curable resin, and the above method can be applied to a method of discharging a curable resin that is cured by heat or the like.

  In addition, when the wiring 136 is formed, the metal ink 138 is stacked, and the stacked metal ink 138 is baked, whereby the wiring 136 may be formed. In such a case, the temperature change with the passage of time at the expected ejection position is estimated in consideration of the number of metal ink layers. That is, based on the number of stacked metal inks and the relationship between the measurement time X and the measurement temperature Y, a temperature change with the passage of time at the scheduled discharge position is estimated. In addition, when the present invention is applied to a method of discharging a curable resin, based on the number of laminated curable resins such as an ultraviolet curable resin and the relationship between the measurement time X and the measurement temperature Y, the expected discharge position The temperature change with the passage of time is estimated.

  In the above embodiment, the linear regression model is used when the temperature change with the passage of time at the scheduled discharge position is used. However, a nonlinear regression model may be used. Moreover, you may estimate the regression equation which shows the relationship between the measurement time X and the measurement temperature Y using not only the least squares method but various methods.

  DESCRIPTION OF SYMBOLS 10: Circuit formation apparatus 27: Control apparatus 76: Inkjet head (2nd discharge apparatus) 88: Inkjet head (1st discharge apparatus) 110: Temperature sensor (measurement apparatus) 112: Spot cooler (temperature adjustment apparatus) 180: Measurement part (Measurement step) 182: Estimating unit (estimating step) 184: Discharge executing unit (discharge executing step) 186: Adjusting unit (adjusting step) 200: Circuit forming apparatus

Claims (5)

A circuit forming method for forming a circuit using a first discharge device that discharges a curable resin and a second discharge device that discharges a metal-containing liquid containing metal fine particles,
A measurement step of measuring one temperature of a planned discharge position of the curable resin by the first discharge device and a predetermined discharge position of the metal-containing liquid by the second discharge device;
Based on the measurement value measured in the measurement step, an estimation step for estimating a temperature change with the passage of time of the scheduled discharge position;
A discharge execution step of executing discharge to the planned discharge position at a timing at which the temperature of the planned discharge position is predicted to become a predetermined temperature based on the temperature change of the planned discharge position estimated in the estimation step; A circuit forming method comprising:   The estimation step also utilizes one of the number of laminations of the curable resin by the first ejection device at the planned ejection position and the number of laminations of the metal-containing liquid by the second ejection device at the planned ejection position. The method of forming a circuit according to claim 1, wherein a temperature change with the passage of time at the scheduled discharge position is estimated. The measuring step measures the temperature of a plurality of the planned discharge positions;
3. The discharge execution step sequentially executes discharge to the plurality of scheduled discharge positions at a timing at which the temperature of each of the plurality of predetermined discharge positions is predicted to be a predetermined temperature. Circuit forming method. Before the temperature at the planned discharge position is measured in the measurement step, including the adjustment step of adjusting the temperature at the planned discharge position by a temperature adjustment device,
4. The circuit forming method according to claim 1, wherein the measuring step measures a temperature of the scheduled ejection position whose temperature has been adjusted in the adjusting step. 5. A first discharge device for discharging a curable resin;
A second discharge device for discharging a metal-containing liquid containing metal fine particles;
A measuring device for measuring one of a planned discharge position of the curable resin by the first discharge device and a planned discharge position of the metal-containing liquid by the second discharge device; the first discharge device and the second discharge device; And a control device for controlling the operation of
The control device is
Based on the measurement value measured by the measurement device, an estimation unit that estimates a temperature change with the passage of time of the scheduled discharge position;
A discharge execution unit that executes discharge to the planned discharge position at a timing at which the temperature of the planned discharge position is predicted to be a predetermined temperature based on a temperature change of the planned discharge position estimated by the estimation unit; A circuit forming apparatus.

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