JP6926075B2 - 基材の表面上のミリメートル、マイクロメートルまたはナノメートル構造を処理するための方法 - Google Patents
基材の表面上のミリメートル、マイクロメートルまたはナノメートル構造を処理するための方法 Download PDFInfo
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- JP6926075B2 JP6926075B2 JP2018519898A JP2018519898A JP6926075B2 JP 6926075 B2 JP6926075 B2 JP 6926075B2 JP 2018519898 A JP2018519898 A JP 2018519898A JP 2018519898 A JP2018519898 A JP 2018519898A JP 6926075 B2 JP6926075 B2 JP 6926075B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C2063/006—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor of surfaces having irregularities or roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/44—Number of layers variable across the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1361—Coating by immersion in coating bath
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1366—Spraying coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- Condensed Matter Physics & Semiconductors (AREA)
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Description
・パラフィン、特に
・ペトロラタム
・ワックス
・セレシン
・ポリマー、特に
・フォトレジスト全般
・ポリ(メチルメタクリレート)
・ポリ(メチルグルタルイミド)
・フェノールホルムアルデヒド樹脂、特に
・ベークライト
・エポキシド、特に
・SU−8
・ポリイミド
・ポリアミド
・シラン
・シリコーン
・PDMS(保護フィルムおよび除去材料)
・PFPE
・アクリレート。
・ポリビニルアルコール
・ポリエーテル、特に
・ポリエチレングリコール
・セルロースエーテル
・ポリ(2−エチル−2−オキサゾリン)
・アルコール、特に
・グリセリン、特に
・脂肪、特に
・トリアシルグリセリン
・糖
・合成樹脂中のカルボン酸化合物(Carbonsaeureverbindungen in Kunststoffen)
・ベンゾトリアゾール。
・アルカン
・アルケン
・アルキン
・芳香族化合物、特に
・ベンゼン
・カルボン酸エステル
・エーテル、特に
・ジエチルエーテル
・テトラメチルシラン
・四塩化炭素
・二硫化炭素
・ベンジン
・クロロホルム
・気体、特に
・一酸化炭素。
・水
・アルコール、特に
・メタノール、エタノール
・ケトン、特に
・アセトン
・アミン、特に
・第一級および第二級アミン
・ラクトン
・ラクタム
・ニトリル
・ニトロ化合物
・第三級カルボン酸アミド
・尿素誘導体
・スルホキシド
・スルホン、特に
・スルホラン
・炭酸エステル、特に
・ジメチルカーボネート
・エチレンカーボネート
・酸、特に
・鉱酸、特に
・硫酸
・ハロゲン化水素酸
・有機酸、特に
・カルボン酸、特に
・ギ酸、酢酸
・塩基、特に
・NaOH、KOH
・気体
・水素
・酸素
・窒素。
a)基材を固定するための固定装置と、
b)少なくとも1つの保護材料を構造上に適用するための適用手段、特に1つ以上のノズルを有するノズル装置および/または浸漬浴と
を有し、ここで、少なくとも1つの保護材料は、溶媒に溶解可能である、設備に関する。
a)搬送ユニットで基材を搬送する工程と、
b)特に基材の両面で、ミリメートルおよび/またはマイクロメートルおよび/またはナノメートル構造を基材上に適用および/または配置する工程と、
c)特に基材の両面で、少なくとも1つの保護材料を、特に上記実施形態の1つに従う方法により構造に適用する工程であって、ここで、少なくとも1つの保護材料は、溶媒に溶解可能である工程と、
d)貯蔵ユニットで基材を収容する工程と
を有する、基材、特にフィルムを加工するための方法に関する。
a)基材を搬送するための搬送ユニットと、
b)ミリメートルおよび/またはマイクロメートルおよび/またはナノメートル構造を基材上に適用および/または配置するための加工ユニットと、
c)少なくとも1つの保護材料を、特に上記実施形態の1つに従う方法により構造上に適用するための適用手段であって、ここで、少なくとも1つの保護材料は、溶媒に溶解可能である適用手段と、
d)基材を収容するための貯蔵ユニットと
を有する、基材、特にフィルムを加工するための設備に関する。
・コーティング設備、特に
・遠心コーティング設備
・スプレーコーティング設備
・接合装置、特に
・融着装置
・熱圧着装置
・陽極接合装置
・ダイサー
・グラインダー
・アライナー
・ロールインプリント設備、特に国際公開第2014/037044号(WO2014/037044A1)
・その他
において処理される。
・遠心コーティング
・スプレーコーティング
・ラミネーション
・浸漬。
・硬化であって、特に
・ポリマーの架橋であって、特に
・電磁波、特にUV光による電磁波
・熱エネルギー
・気体、特に雰囲気気体
・蒸気によるポリマーの架橋による硬化
・粘度増加であって、特に
・ポリマーの架橋であって、特に
・電磁波、特にUV光による電磁波
・熱エネルギーによるポリマーの架橋
・溶媒の蒸発による粘度増加
・弾性増加であって、特に
・ポリマーの架橋であって、特に
・電磁波、特にUV光による電磁波
・熱エネルギーによるポリマーの架橋による弾性増加。
本発明による第1のプロセス工程では、フィルム基材が、第1の貯蔵ユニット、特にロールから巻き戻される。
2,2’ 基材
2o,2o’ 基材表面
2o1,2o2 基材表面
3 構造
4,4’ 保護材料
4o 保護材料表面
5 サンプルホルダー
5o サンプルホルダー表面
6 固定手段
7,7’ 処理(塗布)手段
8,8’ ロール・ツー・ロール設備
9,9’,9’’,9’’’,9IV ロール
Claims (14)
- 第1の基材表面(2o1)と第2の基材表面(2o2)とを有する基材(2)を処理するための方法であって、
少なくとも前記第1の基材表面(2o1)にミリメートルおよび/またはマイクロメートルおよび/またはナノメートルの3D構造(3)をインプリントプロセスによって作製し、
前記第1の基材表面(2o1)の前記3D構造(3)上に少なくとも1つの保護材料(4)を塗布し、前記少なくとも1つの保護材料(4)は、溶媒に溶解可能であり、
前記少なくとも1つの保護材料(4)を硬化させた後、該少なくとも1つの保護材料(4)を有する前記第1の基材表面(2o1)をサンプルホルダ(5)に固定し、この場合に、前記少なくとも1つの保護材料(4)を前記サンプルホルダ(5)に直接固定し、
前記サンプルホルダ(5)に前記第1の基材表面(2o1)を固定している間に前記第2の基材表面(2o2)を処理する、
ことを特徴とする、方法。 - 前記3D構造(3)上に前記少なくとも1つの保護材料(4)を少なくとも1つの保護層(4)として配置し、前記少なくとも1つの保護材料(4)は、前記3D構造(3)を完全に覆う、請求項1記載の方法。
- 前記3D構造(3)上に前記少なくとも1つの保護材料(4)を、遠心コーティング、スプレーコーティング、ラミネーションおよび/または浸漬によって塗布する、請求項1記載の方法。
- 前記3D構造(3)上への前記少なくとも1つの保護材料(4)の前記塗布後に前記少なくとも1つの保護材料(4)を化学的および/または物理的に改質し、この改質は、前記少なくとも1つの保護材料(4)の硬化、粘度増加および/または弾性増加を含む、請求項1記載の方法。
- 前記少なくとも1つの保護材料(4)に、前記保護材料(4)とは異なる第2の保護材料(4’)を塗布する、請求項1記載の方法。
- 前記少なくとも1つの保護材料(4)とは異なる保護材料(4’)を有する、重ねて配置された複数の保護層(4,4’)を前記3D構造(3)上に配置する、請求項1記載の方法。
- 前記少なくとも1つの保護材料(4)が、以下の物質の1つまたは以下の物質の混合物を含む、請求項1記載の方法:
・パラフィン
・ポリマー。 - 前記ポリマーは、フォトレジスト全般、ポリ(メチルメタクリレート)、ポリ(メチルグルタルイミド)、フェノールホルムアルデヒド樹脂、エポキシド、ポリイミド、ポリアミド、シラン、シリコーン、PDMS、PFPE、および、アクリレートのグループから選択されている、請求項7記載の方法。
- 前記少なくとも1つの保護材料(4)が、以下の物質の1つまたは以下の物質の混合物を含む、請求項1記載の方法:
・ポリビニルアルコール
・ポリエーテル
・セルロースエーテル
・ポリ(2−エチル−2−オキサゾリン)
・アルコール
・糖
・合成樹脂中のカルボン酸化合物
・ベンゾトリアゾール。 - 前記少なくとも1つの保護材料(4)が、以下の溶媒の1つまたは以下の溶媒の溶媒混合物によって溶解可能である、請求項1記載の方法:
・アルカン
・アルケン
・アルキン
・芳香族化合物
・カルボン酸エステル
・エーテル
・テトラメチルシラン
・四塩化炭素
・二硫化炭素
・ベンジン
・クロロホルム。 - 前記少なくとも1つの保護材料(4)が、以下の溶媒の1つまたは以下の溶媒の溶媒混合物によって溶解可能である、請求項1記載の方法:
・水
・アルコール
・ケトン
・アミン
・ラクトン
・ラクタム
・ニトリル
・ニトロ化合物
・第三級カルボン酸アミド
・尿素誘導体
・スルホキシド
・スルホン
・炭酸エステル
・酸
・ギ酸、酢酸
・塩基。 - 請求項1から11までのいずれか1項記載の方法を実施するための、ミリメートル、マイクロメートルおよび/またはナノメートルの3D構造(3)を有する基材(2)を処理するための設備であって、
a)前記基材(2)を固定するための固定装置(5,6)と、
b)前記3D構造(3)上に少なくとも1つの保護材料(4)を塗布するための処理手段(7,7’)としての1つ以上のノズルを有するノズル装置(7)および/または浸漬浴(7’)と
を有し、前記少なくとも1つの保護材料(4)は、溶媒に溶解可能である設備において、前記3D構造(3)は、インプリントプロセスによって作製されることを特徴とする、設備。 - 請求項1から12までのいずれか1項記載の方法および/または設備により製造された、ミリメートルおよび/またはマイクロメートルおよび/またはナノメートルの3D構造(3)を有する基材(2)と、前記3D構造(3)上の少なくとも1つの保護材料(4)からなる少なくとも1つのコーティングとを有する製品(1,1’,1’’,1’’’)であって、前記少なくとも1つの保護材料(4)は、溶媒に溶解可能である製品において、前記3D構造(3)は、インプリントプロセスによって作製されることを特徴とする、製品。
- 前記少なくとも1つの保護材料(4)を有する前記第1の基材表面(2o1)をサンプルホルダ(5)に固定することは、前記サンプルホルダ(5)に向かって前記第1の基材表面(2o1)を配置し、前記サンプルホルダ(5)とは逆向きに前記第2の基材表面(2o2)を配置することを含む、請求項1記載の方法。
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PCT/EP2016/075638 WO2017076689A1 (de) | 2015-11-05 | 2016-10-25 | Verfahren zur behandlung von millimeter-, mikrometer- oder nanometerstrukturen auf einer oberfläche eines substrats |
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US10612834B2 (en) * | 2016-07-26 | 2020-04-07 | Whirlpool Corporation | Method for manufacturing an insulated structure for a refrigerator |
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EP3371823B1 (de) | 2023-06-21 |
KR20180080192A (ko) | 2018-07-11 |
DE102015118991A1 (de) | 2017-05-11 |
TWI735474B (zh) | 2021-08-11 |
TW201728689A (zh) | 2017-08-16 |
WO2017076689A1 (de) | 2017-05-11 |
SG11201803160XA (en) | 2018-05-30 |
US11027481B2 (en) | 2021-06-08 |
US20180311889A1 (en) | 2018-11-01 |
KR102613222B1 (ko) | 2023-12-12 |
CN108292624A (zh) | 2018-07-17 |
EP3371823A1 (de) | 2018-09-12 |
CN108292624B (zh) | 2022-11-01 |
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