JP6918233B2 - 真空蒸着装置用の蒸着源 - Google Patents
真空蒸着装置用の蒸着源 Download PDFInfo
- Publication number
- JP6918233B2 JP6918233B2 JP2020523574A JP2020523574A JP6918233B2 JP 6918233 B2 JP6918233 B2 JP 6918233B2 JP 2020523574 A JP2020523574 A JP 2020523574A JP 2020523574 A JP2020523574 A JP 2020523574A JP 6918233 B2 JP6918233 B2 JP 6918233B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- vapor deposition
- crucible
- outer container
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000151 deposition Methods 0.000 title description 5
- 230000008021 deposition Effects 0.000 title description 3
- 239000010408 film Substances 0.000 title description 3
- 238000000427 thin-film deposition Methods 0.000 title description 2
- 239000000463 material Substances 0.000 claims description 59
- 238000007740 vapor deposition Methods 0.000 claims description 51
- 239000011368 organic material Substances 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 21
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 238000001771 vacuum deposition Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 20
- 230000008022 sublimation Effects 0.000 description 10
- 238000000859 sublimation Methods 0.000 description 10
- 239000008186 active pharmaceutical agent Substances 0.000 description 6
- -1 aluminum quinolinol Chemical compound 0.000 description 5
- 150000004984 aromatic diamines Chemical class 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018110671 | 2018-06-08 | ||
| JP2018110671 | 2018-06-08 | ||
| PCT/JP2019/018352 WO2019235118A1 (ja) | 2018-06-08 | 2019-05-08 | 真空蒸着装置用の蒸着源 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2019235118A1 JPWO2019235118A1 (ja) | 2020-12-17 |
| JP6918233B2 true JP6918233B2 (ja) | 2021-08-11 |
Family
ID=68770004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020523574A Active JP6918233B2 (ja) | 2018-06-08 | 2019-05-08 | 真空蒸着装置用の蒸着源 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6918233B2 (ko) |
| KR (1) | KR102453030B1 (ko) |
| CN (1) | CN111108230A (ko) |
| TW (1) | TW202000955A (ko) |
| WO (1) | WO2019235118A1 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7444843B2 (ja) | 2021-12-02 | 2024-03-06 | キヤノントッキ株式会社 | 蒸着用坩堝及び蒸着装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010001529A (ja) | 2008-06-20 | 2010-01-07 | Seiko Epson Corp | 蒸着源、および蒸着装置 |
| JP4468474B1 (ja) * | 2008-12-24 | 2010-05-26 | 三菱重工業株式会社 | 真空蒸着装置及び温度調整方法 |
| JP2013209696A (ja) * | 2012-03-30 | 2013-10-10 | Samsung Display Co Ltd | 真空蒸着装置およびその蒸着源 |
| KR20140103583A (ko) * | 2013-02-18 | 2014-08-27 | (주)와이에스썸텍 | 선형증발원 |
| JP6851143B2 (ja) * | 2016-04-05 | 2021-03-31 | 株式会社アルバック | 蒸発源、真空蒸着装置および真空蒸着方法 |
| CN205662589U (zh) * | 2016-05-16 | 2016-10-26 | 鄂尔多斯市源盛光电有限责任公司 | 一种蒸镀源及蒸镀装置 |
| KR20180047087A (ko) * | 2016-10-31 | 2018-05-10 | 한국표준과학연구원 | 유도 가열 증발 증착 장치 |
-
2019
- 2019-05-08 KR KR1020207033597A patent/KR102453030B1/ko active IP Right Grant
- 2019-05-08 WO PCT/JP2019/018352 patent/WO2019235118A1/ja active Application Filing
- 2019-05-08 JP JP2020523574A patent/JP6918233B2/ja active Active
- 2019-05-08 CN CN201980004684.3A patent/CN111108230A/zh active Pending
- 2019-05-17 TW TW108117013A patent/TW202000955A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210002607A (ko) | 2021-01-08 |
| KR102453030B1 (ko) | 2022-10-11 |
| JPWO2019235118A1 (ja) | 2020-12-17 |
| WO2019235118A1 (ja) | 2019-12-12 |
| CN111108230A (zh) | 2020-05-05 |
| TW202000955A (zh) | 2020-01-01 |
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