JPWO2019235118A1 - 真空蒸着装置用の蒸着源 - Google Patents
真空蒸着装置用の蒸着源 Download PDFInfo
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- JPWO2019235118A1 JPWO2019235118A1 JP2020523574A JP2020523574A JPWO2019235118A1 JP WO2019235118 A1 JPWO2019235118 A1 JP WO2019235118A1 JP 2020523574 A JP2020523574 A JP 2020523574A JP 2020523574 A JP2020523574 A JP 2020523574A JP WO2019235118 A1 JPWO2019235118 A1 JP WO2019235118A1
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- 238000000151 deposition Methods 0.000 title claims abstract description 6
- 230000008021 deposition Effects 0.000 title claims description 4
- 238000001771 vacuum deposition Methods 0.000 title description 3
- 239000000463 material Substances 0.000 claims abstract description 73
- 238000007740 vapor deposition Methods 0.000 claims abstract description 55
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 238000000427 thin-film deposition Methods 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 3
- 239000011368 organic material Substances 0.000 abstract description 26
- 230000008022 sublimation Effects 0.000 abstract description 11
- 238000000859 sublimation Methods 0.000 abstract description 11
- 239000008186 active pharmaceutical agent Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 239000000758 substrate Substances 0.000 description 20
- 125000006850 spacer group Chemical group 0.000 description 6
- -1 aluminum quinolinol Chemical compound 0.000 description 5
- 150000004984 aromatic diamines Chemical class 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (2)
- 真空チャンバ内に配置され、昇華性の材料を昇華させて被蒸着物に対して蒸着するための真空蒸着装置用の蒸着源において、
被蒸着物に向けて昇華した材料を噴出する噴出口を有する外容器と、この外容器にその壁面から間隔を置いて内挿されて昇華性の材料を収容する内容器と、内容器内の材料の加熱を可能とする加熱手段とを備え、
内容器に、昇華した材料の連通を許容する複数の透孔が開設されることを特徴とする真空蒸着装置用の蒸着源。 - 請求項1記載の真空蒸着装置用の蒸着源であって、前記外容器が鉛直方向上面を開口した坩堝で構成されるものにおいて、
前記内容器は、上面を開口した有底の筒状体で構成され、この筒状体の外底壁に脚片が設けられることを特徴とする真空蒸着装置用の蒸着源。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018110671 | 2018-06-08 | ||
JP2018110671 | 2018-06-08 | ||
PCT/JP2019/018352 WO2019235118A1 (ja) | 2018-06-08 | 2019-05-08 | 真空蒸着装置用の蒸着源 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019235118A1 true JPWO2019235118A1 (ja) | 2020-12-17 |
JP6918233B2 JP6918233B2 (ja) | 2021-08-11 |
Family
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JP2020523574A Active JP6918233B2 (ja) | 2018-06-08 | 2019-05-08 | 真空蒸着装置用の蒸着源 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6918233B2 (ja) |
KR (1) | KR102453030B1 (ja) |
CN (1) | CN111108230A (ja) |
TW (1) | TW202000955A (ja) |
WO (1) | WO2019235118A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7444843B2 (ja) | 2021-12-02 | 2024-03-06 | キヤノントッキ株式会社 | 蒸着用坩堝及び蒸着装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140103583A (ko) * | 2013-02-18 | 2014-08-27 | (주)와이에스썸텍 | 선형증발원 |
JP2017186603A (ja) * | 2016-04-05 | 2017-10-12 | 株式会社アルバック | 蒸発源、真空蒸着装置および真空蒸着方法 |
KR20180047087A (ko) * | 2016-10-31 | 2018-05-10 | 한국표준과학연구원 | 유도 가열 증발 증착 장치 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010001529A (ja) | 2008-06-20 | 2010-01-07 | Seiko Epson Corp | 蒸着源、および蒸着装置 |
JP4468474B1 (ja) * | 2008-12-24 | 2010-05-26 | 三菱重工業株式会社 | 真空蒸着装置及び温度調整方法 |
JP2013209696A (ja) * | 2012-03-30 | 2013-10-10 | Samsung Display Co Ltd | 真空蒸着装置およびその蒸着源 |
CN205662589U (zh) * | 2016-05-16 | 2016-10-26 | 鄂尔多斯市源盛光电有限责任公司 | 一种蒸镀源及蒸镀装置 |
-
2019
- 2019-05-08 WO PCT/JP2019/018352 patent/WO2019235118A1/ja active Application Filing
- 2019-05-08 KR KR1020207033597A patent/KR102453030B1/ko active IP Right Grant
- 2019-05-08 CN CN201980004684.3A patent/CN111108230A/zh active Pending
- 2019-05-08 JP JP2020523574A patent/JP6918233B2/ja active Active
- 2019-05-17 TW TW108117013A patent/TW202000955A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140103583A (ko) * | 2013-02-18 | 2014-08-27 | (주)와이에스썸텍 | 선형증발원 |
JP2017186603A (ja) * | 2016-04-05 | 2017-10-12 | 株式会社アルバック | 蒸発源、真空蒸着装置および真空蒸着方法 |
KR20180047087A (ko) * | 2016-10-31 | 2018-05-10 | 한국표준과학연구원 | 유도 가열 증발 증착 장치 |
Also Published As
Publication number | Publication date |
---|---|
WO2019235118A1 (ja) | 2019-12-12 |
JP6918233B2 (ja) | 2021-08-11 |
KR20210002607A (ko) | 2021-01-08 |
CN111108230A (zh) | 2020-05-05 |
KR102453030B1 (ko) | 2022-10-11 |
TW202000955A (zh) | 2020-01-01 |
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