JP6911140B2 - 半導体製造装置用部材、その製法及び成形型 - Google Patents
半導体製造装置用部材、その製法及び成形型 Download PDFInfo
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- JP6911140B2 JP6911140B2 JP2019550475A JP2019550475A JP6911140B2 JP 6911140 B2 JP6911140 B2 JP 6911140B2 JP 2019550475 A JP2019550475 A JP 2019550475A JP 2019550475 A JP2019550475 A JP 2019550475A JP 6911140 B2 JP6911140 B2 JP 6911140B2
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- disk
- shaft
- unfired
- electrode
- ceramic
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Images
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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Description
電極を内蔵するセラミック製の円板と前記円板を支持するセラミック製のシャフトとを備えた半導体製造装置用部材であって、
前記円板と前記シャフトとは、接合界面のない状態で一体化されている、
ものである。
上述した半導体製造装置用部材を製造するのに用いられる成形型であって、
前記円板のうちシャフト側の円板下層を形成するための空間である円板成形部と、
前記円板成形部に連通し前記シャフトを形成するための空間であるシャフト成形部と、
を備えたものである。
(a)上述した成形型を用いて、前記円板成形部によって成形される未焼成円板下層と前記シャフト成形部によって成形される未焼成シャフトとがつなぎ目のない状態で一体化された基礎成形体を、モールドキャスト法により作製する工程と、
(b)前記基礎成形体の前記未焼成円板下層の上面に、前記未焼成円板下層と平行な電極又はその前駆体が形成された未焼成円板上層を積層して最終成形体を得る工程と、
(c)前記最終成形体を仮焼したあと、前記未焼成円板上層が下、前記未焼成シャフトが上になるように水平支持面に載置した状態で焼成することにより、円板とシャフトとが接合界面のない状態で一体化された半導体製造装置用部材を得る工程と、
を含むものである。
まず、セラミックヒータ10を製造するのに用いられる基礎成形体30を作製する。基礎成形体30は、図3に示すように、未焼成円板下層32と未焼成シャフト34とがつなぎ目のない状態で一体に成形されたものである。未焼成円板下層32は、円板12のうちヒータ電極14の上面よりもシャフト側の円板下層12b(図2参照)に相当する成形体であり、未焼成シャフト34は、シャフト20に相当する成形体である。未焼成円板下層32の上面には、ヒータ電極14を嵌め込むためのヒータ電極用溝33が形成されている。未焼成円板下層32は、中心部に比べて外周縁が反り上がった形状になっている。具体的には、未焼成円板下層32の上面は未焼成シャフト34に向かって円錐状に窪んだ凹面となっており、下面は未焼成シャフト34に向かって円錐状に膨出した凸面となっている。未焼成円板下層32の上下面のそれぞれにおいて、中心位置とその中心位置から半径外方向に150mm離れた位置との高低差dが0.7mm以上2.6mm以下であること、あるいは、中心部と外周縁とを結んだ線分が水平面となす傾斜角度θが0.25°以上1°以下の範囲内の所定角度となっていることが好ましい。
(1)乾燥
最終成形体50に含まれる分散媒を蒸発させる。使用する分散媒種により乾燥温度や乾燥時間は適宜設定すればよい。ただし、乾燥温度が高すぎるとクラックの原因となるため好ましくない。また、雰囲気は大気、不活性雰囲気、真空、水素雰囲気のいずれでもよい。
(2)脱脂
分散媒を蒸発させたあとの最終成形体50に含まれるバインダ、分散剤及び触媒を分解させる。分解温度としては、例えば400〜600℃、雰囲気は大気、不活性雰囲気、真空、水素雰囲気のいずれでもよいが、電極を埋設する場合や非酸化物系セラミックを使用する場合は不活性雰囲気か真空のいずれかとする。
(3)仮焼
脱脂したあとの最終成形体50を750〜1300℃で熱処理(仮焼)を行うことにより仮焼体60(図6(a)参照)を得る。仮焼するのは、強度を高くしてハンドリングしやすくするためである。雰囲気は大気、不活性雰囲気、真空、水素雰囲気のいずれでもよいが、電極を埋設する場合や非酸化物系セラミックを使用する場合は不活性雰囲気か真空のいずれかとする。仮焼体60は、最終成形体50と同様、ヒータ電極14及びRF電極16を含む円板部分と中空のシャフト部分とがつなぎ目のない状態で一体に成形されたものであり、円板部分は中心部に比べて外周縁が反り上がった形状であり、傾斜角度θは0.25°以上1°以下になっている。なお、乾燥後、脱脂と仮焼を一度に行ってもよい。
仮焼体60を円板部分が下、シャフト部分が上になるように配置した状態で、仮焼体60を焼成してセラミックヒータ10を得る。焼成時の最高温度は粉末の種類、粉末の粒子径により適宜設定するが、1000〜2000℃の範囲に設定することが好ましい。仮焼体60のうち中心部に比べて外周縁が反り上がった形状の円板部分は焼成によってほぼフラットになる。雰囲気は大気、不活性雰囲気、真空のいずれでもよい。また、焼成時の変形をより抑制し円板部分をよりフラットにするため、図6(a)のように、フラットな水平支持板70(例えばBN材からなる板)に、仮焼体60の円板部分を下、シャフト部分を上にして載せ、ドーナツ状の錘72を円板部分に載せて荷重を加えた状態で常圧焼成するのが好ましい。こうすることにより、図6(b)に示すセラミックヒータ10が得られる。錘72の重さが重すぎると、加重されている円板部分とフリーのシャフト部分との間に収縮差が生じて割れるおそれがある。そのため、5〜10kgの範囲で適宜設定するのが好ましい。錘72は、装着や脱着を考慮すると、直径に沿って2つ以上に分割可能な形状になっていることが好ましい。
1.成形工程
まず、窒化アルミニウム粉末(純度99.7%)100質量部と、酸化イットリウム5質量部と、分散剤(ポリカルボン酸系共重合体)2質量部と、分散媒(多塩基酸エステル)30質量部とを、ボールミル(トロンメル)を用いて14時間混合することにより、セラミックスラリー前駆体を得た。このセラミックスラリー前駆体に対して、イソシアネート(4,4’−ジフェニルメタンジイソシアネート)4.5質量部、水0.1質量部、触媒(6−ジメチルアミノ−1−ヘキサノール)0.4質量部を加えて混合することにより、セラミックスラリーを得た。このセラミックスラリーを用いて、図5に示した手順にしたがって最終成形体50を作製した。成形型40の傾斜角度θは0.5°とした。成形型40の円形面の中心位置とその中心位置から半径外方向に150mm離れた位置との高低差dは1.3mmであった。また、ヒータ電極14はMoコイルを使用し、RF電極16はMoメッシュを使用した。
得られた最終成形体50を100℃で10時間乾燥し、続いて最高温度500℃で脱脂し、更に最高温度820℃、窒素雰囲気で仮焼することにより、仮焼体60を得た。
図6に示すように、BN製のフラットな水平支持板70に、仮焼体60の円板部分を下、シャフト部分を上にして載せ、ドーナツ状の錘72(10kg)を円板部分に載せて荷重を加えた状態で、窒素ガス中で常圧焼成により1860℃で6時間焼成した。これにより、セラミックヒータ10(円板12の直径は300mm)を得た。
実験例A2〜A7では、実験例A1の傾斜角度θ及び高低差dを変更した以外は、実験例A1と同様にしてセラミックヒータ10を作製した。実験例A2〜A7のセラミックヒータ10も、実験例A1と同様、円板12とシャフト20とが接合界面のない状態で一体化されていた。実験例A2〜A7の傾斜角度θ、高低差d、焼成方法、強度、平均粒子径、焼成後の反り及び気泡の有無を表2にまとめた。
1.成形工程
実験例A1と同様にしてセラミックスラリー前駆体を調製した。このセラミックスラリー前駆体に対して、イソシアネート(ヘキサメチレンジイソシアネート)4.5質量部、水0.1質量部、触媒(6−ジメチルアミノ−1−ヘキサノール)0.4質量部を加えて混合することにより、セラミックスラリーを得た。このセラミックスラリーを用いて、図5に示した手順にしたがって最終成形体50を作製した。成形型40の傾斜角度θは0.5°、高低差dは1.3mmとした。ヒータ電極14及びRF電極16はMoペースト(窒化アルミニウム粉末(純度99.7%)を含む)をスクリーン印刷して形成した。そのため、ヒータ電極用溝33やRF電極用溝35aは省略した。
得られた最終成形体50を100℃で10時間乾燥し、続いて最高温度1300℃、水素雰囲気で脱脂・仮焼することにより、仮焼体60を得た。
実験例A1と同様にして焼成することにより、実験例A8のセラミックヒータ10を得た。その特性を表2に示す。なお、このセラミックヒータ10も実験例A1と同様、接合界面が見られなかった。
1.成形工程
窒化アルミニウム粉末95質量%に、焼結助剤として酸化イットリウム5質量%を加え、ボールミルを用いて混合した。得られた混合粉末に、バインダを添加し、噴霧造粒法により造粒した。得られた造粒粉を脱脂し、金型成形及びCIPにより円板状成形体と管状成形体とを成形した。円板状成形体の内部にはRF電極としてMoメッシュ、ヒータ電極としてMoコイルを埋設した。
円板状成形体を窒素ガス中でホットプレス法により1860℃で6時間焼成し、円板状焼成体とした。これとは別に、管状成形体を窒素ガス中で常圧焼成により1860℃で6時間焼成し、管状焼成体とした。
円板状焼成体と管状焼成体との接合界面に硝酸イットリウムを塗布し、100℃で1時間乾燥した。そして、特開2006−232576号公報の実施例1に記載されている接合方法により、円板状焼成体と管状焼成体とを熱処理して接合し、実験例A9のセラミックヒータを得た。その特性を表2に示す。なお、実験例A9のセラミックヒータは、図14のSEM像に示すように、円板状焼成体と管状焼成体との接合界面が判別できる状態で一体化されていた。
図9にしたがって最終成形体150を作製し、その最終成形体150を仮焼して仮焼体160にしたあと、図10にしたがって実験例B1のセラミックヒータ110を作製した。成形工程のセラミックスラリーは実験例A1と同様にして調製した。また、乾燥・脱脂・仮焼工程及び焼成工程の条件も実験例A1と同様とした。接着剤には、窒化アルミニウム粉末、バインダとしてアクリル樹脂及び分散媒としてテルピネオールを混合したペーストを用いた。その特性を表3に示す。なお、このセラミックヒータ110も接合界面が見られなかった。
図9にしたがって最終成形体150を作製し、その最終成形体150を仮焼して仮焼体160にしたあと、図10にしたがって実験例B2のセラミックヒータ110を作製した。成形工程のセラミックスラリーは実験例A8と同様にして調製した。また、乾燥・脱脂・仮焼工程及び焼成工程の条件も実験例A8と同様とした。接着剤には、窒化アルミニウム粉末、バインダとしてアクリル樹脂及び分散媒としてテルピネオールを混合したペーストを用いた。その特性を表3に示す。なお、このセラミックヒータ110も接合界面が見られなかった。
1.成形工程
窒化アルミニウム粉末95重量%に、焼結助剤として酸化イットリウム5重量%を加え、ボールミルを用いて混合した。得られた混合粉末に、バインダを添加し、噴霧造粒法により造粒した。得られた造粒粉を脱脂し、金型成形及びCIPにより円板状成形体と管状成形体とを成形した。円板状成形体として、内部にヒータ電極(Moコイル)を埋設した第1円板状成形体と、内部にRF電極(メッシュ電極)を埋設した第2円板状成形体を作製した。
第1円板状成形体と第2円板状成形体を、それぞれ個別に窒素ガス中でホットプレス法により1860℃で6時間焼成することにより、第1円板状焼成体と第2円板状焼成体とした。また、管状成形体を窒素ガス中で常圧焼成により1860℃で6時間焼成することにより、管状焼成体とした。
第1円板状焼成体と第2円板状焼成体と管状焼成体との接合界面に硝酸イットリウムを塗布し、100℃で1時間乾燥した。そして、特開2006−232576号公報の実施例1に記載されている接合方法により、第1円板状焼成体と第2円板状焼成体と管状焼成体とを熱処理して接合し、実験例B3のセラミックヒータを得た。その特性を表3に示す。なお、実験例B3のセラミックヒータは、第1円板状焼成体と第2円板状焼成体と管状焼成体との接合界面がSEMで判別できる状態で一体化されていた。
Claims (11)
- 電極を内蔵するセラミック製の円板と前記円板を支持するセラミック製のシャフトとを備えた半導体製造装置用部材であって、
前記円板と前記シャフトとは、接合界面のない状態で一体化されており、
前記円板は、前記円板の側面に開口し前記円板の板面方向に沿って設けられたガス通路を有し、前記シャフトは、上下方向に延びて前記ガス通路にガスを供給するガス供給路を有する、
半導体製造装置用部材。 - 電極を内蔵するセラミック製の円板と前記円板を支持するセラミック製のシャフトとを備えた半導体製造装置用部材であって、
前記円板と前記シャフトとは、接合界面のない状態で一体化されており、
前記シャフトの外面と前記円板のうち前記シャフトが一体化されている面との境界部は、R面又はテーパ面である、
半導体製造装置用部材。 - 電極を内蔵するセラミック製の円板と前記円板を支持するセラミック製のシャフトとを備えた半導体製造装置用部材であって、
前記円板と前記シャフトとは、接合界面のない状態で一体化されており、
前記シャフトは、円筒部材であり、
前記シャフトの内面と前記円板のうち前記シャフトが一体化されている面との境界部は、R面又はテーパ面である、
半導体製造装置用部材。 - 前記電極は、ヒータ電極、RF電極及び静電電極の少なくとも1つである、
請求項1〜3のいずれか1項に記載の半導体製造装置用部材。 - 電極を内蔵するセラミック製の円板と前記円板を支持するセラミック製のシャフトとを備え、前記円板と前記シャフトとは、接合界面のない状態で一体化されている半導体製造装置用部材を製造するか、又は、請求項1〜4のいずれか1項に記載の半導体製造装置用部材を製造するのに用いられる成形型であって、
前記円板のうちシャフト側の円板下層を形成するための空間である円板成形部と、
前記円板成形部に連通し前記シャフトを形成するための空間であるシャフト成形部と、
を備えた成形型。 - 前記円板成形部は、一対の円形面と該一対の円形面に連なる外周面とで囲まれた空間であり、
前記一対の円形面のうち前記シャフト成形部側の円形面は、前記シャフト成形部側に窪んだ凹面であり、前記一対の円形面のうち前記シャフト成形部とは反対側の円形面は、前記シャフト成形部側に膨らんだ凸面である、
請求項5に記載の成形型。 - 前記凹面及び前記凸面は、中心位置とその中心位置から半径外向きに150mm離れた位置との高低差dが0.7mm以上2.6mm以下である、
請求項6に記載の成形型。 - 前記凹面及び前記凸面の傾斜角度θは、0.25°≦θ≦1°である、
請求項6又は7に記載の成形型。 - 前記凹面は、前記シャフト成形部側に円錐状又は円錐台状に窪んだ面であり、前記凸面は、前記シャフト成形部側に円錐状又は円錐台状に膨らんだ面である、
請求項6〜8のいずれか1項に記載の成形型。 - (a)請求項5〜9のいずれか1項に記載の成形型を用いて、前記円板成形部によって成形される未焼成円板下層と前記シャフト成形部によって成形される未焼成シャフトとがつなぎ目のない状態で一体化された基礎成形体を、モールドキャスト法により作製する工程と、
(b)前記基礎成形体の前記未焼成円板下層の上面に、前記未焼成円板下層と平行な電極又はその前駆体が形成された未焼成円板上層を積層して最終成形体を得る工程と、
(c)前記最終成形体を仮焼したあと、前記未焼成円板上層が下、前記未焼成シャフトが上になるように水平支持面に載置した状態で焼成することにより、円板とシャフトとが接合界面のない状態で一体化された半導体製造装置用部材を得る工程と、
を含む半導体製造装置用部材の製法。 - 前記工程(a)では、前記基礎成形体をモールドキャスト法により作製する際に、前記未焼成円板下層の上面にガス通路を側面に開口するように形成しておき、
前記工程(b)では、前記ガス通路の上に、前記未焼成円板上層を接着して最終成形体を得る、
請求項10に記載の半導体製造装置用部材の製法。
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JP3641115B2 (ja) * | 1997-10-08 | 2005-04-20 | 大日本スクリーン製造株式会社 | 基板処理装置 |
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JP4386606B2 (ja) * | 2001-11-08 | 2009-12-16 | 日本碍子株式会社 | 支持装置の製造方法 |
WO2003060973A1 (fr) * | 2002-01-10 | 2003-07-24 | Tokyo Electron Limited | Dispositif de traitement |
JP3520074B2 (ja) * | 2002-03-28 | 2004-04-19 | 日本碍子株式会社 | セラミックサセプターの取付構造、セラミックサセプターの支持構造およびセラミックサセプターの支持部材 |
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WO2005017984A1 (ja) * | 2003-08-18 | 2005-02-24 | Tokyo Electron Limited | 基板保持構造物および基板処理装置 |
JP4439291B2 (ja) * | 2004-02-24 | 2010-03-24 | 京セラ株式会社 | 圧電振動子収納用パッケージおよび圧電装置 |
TW200612512A (en) | 2004-06-28 | 2006-04-16 | Ngk Insulators Ltd | Substrate heating sapparatus |
US20080314320A1 (en) * | 2005-02-04 | 2008-12-25 | Component Re-Engineering Company, Inc. | Chamber Mount for High Temperature Application of AIN Heaters |
JP4739774B2 (ja) | 2005-02-22 | 2011-08-03 | 日本碍子株式会社 | セラミック焼結体接合装置及びセラミック焼結体接合方法 |
TWI297908B (en) * | 2005-03-16 | 2008-06-11 | Ngk Insulators Ltd | Processing device |
JP2007258115A (ja) * | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | 加熱装置 |
US8294069B2 (en) * | 2007-03-28 | 2012-10-23 | Ngk Insulators, Ltd. | Heating device for heating a wafer |
US20080299326A1 (en) * | 2007-05-30 | 2008-12-04 | Asm Japan K.K. | Plasma cvd apparatus having non-metal susceptor |
WO2013130918A1 (en) * | 2012-02-29 | 2013-09-06 | Harris, Jonathan, H. | Transient liquid phase, pressureless joining of aluminum nitride components |
JP5807032B2 (ja) * | 2012-03-21 | 2015-11-10 | 日本碍子株式会社 | 加熱装置及び半導体製造装置 |
US9728437B2 (en) * | 2015-02-03 | 2017-08-08 | Applied Materials, Inc. | High temperature chuck for plasma processing systems |
US10177024B2 (en) * | 2015-05-12 | 2019-01-08 | Lam Research Corporation | High temperature substrate pedestal module and components thereof |
JP6873178B2 (ja) * | 2019-03-26 | 2021-05-19 | 日本碍子株式会社 | 半導体製造装置用部材、その製法及び成形型 |
-
2018
- 2018-10-31 KR KR1020207012611A patent/KR102373076B1/ko active IP Right Grant
- 2018-10-31 CN CN201880070786.0A patent/CN111316418B/zh active Active
- 2018-10-31 WO PCT/JP2018/040588 patent/WO2019088203A1/ja active Application Filing
- 2018-10-31 JP JP2019550475A patent/JP6911140B2/ja active Active
- 2018-11-01 TW TW107138748A patent/TWI726253B/zh active
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2020
- 2020-05-01 US US16/864,282 patent/US20200258769A1/en not_active Abandoned
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Publication number | Publication date |
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CN111316418A (zh) | 2020-06-19 |
TW201922676A (zh) | 2019-06-16 |
US20200258769A1 (en) | 2020-08-13 |
CN111316418B (zh) | 2024-01-30 |
KR102373076B1 (ko) | 2022-03-11 |
TWI726253B (zh) | 2021-05-01 |
WO2019088203A1 (ja) | 2019-05-09 |
JPWO2019088203A1 (ja) | 2020-11-19 |
KR20200061395A (ko) | 2020-06-02 |
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