JP6910998B2 - カメラ - Google Patents

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Publication number
JP6910998B2
JP6910998B2 JP2018189377A JP2018189377A JP6910998B2 JP 6910998 B2 JP6910998 B2 JP 6910998B2 JP 2018189377 A JP2018189377 A JP 2018189377A JP 2018189377 A JP2018189377 A JP 2018189377A JP 6910998 B2 JP6910998 B2 JP 6910998B2
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JP
Japan
Prior art keywords
holder
mount
camera
lens mount
heat conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018189377A
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English (en)
Japanese (ja)
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JP2019091016A (ja
JP2019091016A5 (enExample
Inventor
寛之 井手
寛之 井手
Original Assignee
アクシス アーベー
アクシス アーベー
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Publication of JP2019091016A5 publication Critical patent/JP2019091016A5/ja
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/26—Holders for containing light sensitive material and adapted to be inserted within the camera
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
JP2018189377A 2017-10-10 2018-10-04 カメラ Active JP6910998B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP17195692.3A EP3471391B1 (en) 2017-10-10 2017-10-10 A camera
EP17195692.3 2017-10-10

Publications (3)

Publication Number Publication Date
JP2019091016A JP2019091016A (ja) 2019-06-13
JP2019091016A5 JP2019091016A5 (enExample) 2020-10-22
JP6910998B2 true JP6910998B2 (ja) 2021-07-28

Family

ID=60083783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018189377A Active JP6910998B2 (ja) 2017-10-10 2018-10-04 カメラ

Country Status (6)

Country Link
US (1) US10692906B2 (enExample)
EP (1) EP3471391B1 (enExample)
JP (1) JP6910998B2 (enExample)
KR (1) KR102180795B1 (enExample)
CN (1) CN109660704B (enExample)
TW (1) TWI730254B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI753255B (zh) * 2019-05-14 2022-01-21 群光電子股份有限公司 電子裝置及其鏡頭模組
USD1086263S1 (en) * 2022-11-04 2025-07-29 Flir Systems Ab Camera
US20250365488A1 (en) * 2024-05-24 2025-11-27 Raytheon Company Structural support beams used as electrical conductors in cooled infrared camera housings

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001309216A (ja) * 2000-04-24 2001-11-02 Olympus Optical Co Ltd 電子カメラ
TWI437301B (zh) * 2006-02-03 2014-05-11 Hitachi Maxell Camera module
WO2008023894A1 (en) * 2006-08-22 2008-02-28 Lg Innotek Co., Ltd Camera module
JP2008211378A (ja) * 2007-02-23 2008-09-11 Auto Network Gijutsu Kenkyusho:Kk 撮像装置
US8647922B2 (en) * 2007-11-08 2014-02-11 Nanyang Technological University Method of forming an interconnect on a semiconductor substrate
US7734171B2 (en) * 2008-01-29 2010-06-08 Autoliv Asp, Inc. Snap-in retainer for a sensor system
JP2009246932A (ja) * 2008-03-13 2009-10-22 Olympus Imaging Corp 撮影レンズユニット及びそれを用いた電子機器
JP2009271405A (ja) * 2008-05-09 2009-11-19 Mitsumi Electric Co Ltd カメラモジュール
CN101609836B (zh) * 2008-06-19 2012-07-18 鸿富锦精密工业（深圳）有限公司 影像感测器模组及相机模组
JP5037450B2 (ja) * 2008-08-08 2012-09-26 シャープ株式会社 表示素子・電子素子モジュールおよび電子情報機器
JP2010145616A (ja) * 2008-12-17 2010-07-01 Nikon Corp カメラボディ、レンズ鏡筒及びカメラシステム
CN101924081A (zh) 2009-06-15 2010-12-22 鸿富锦精密工业（深圳）有限公司 影像感测器封装体及影像感测器模组
JP2012029028A (ja) * 2010-07-23 2012-02-09 Panasonic Corp センサパッケージ、撮像装置及び携帯電子機器
WO2012015965A1 (en) 2010-07-27 2012-02-02 Flir Systems, Inc. Infrared camera architecture systems and methods
CN103168264B (zh) 2010-08-09 2015-10-14 剑桥机电有限公司 摄像装置
CN102377949B (zh) * 2010-08-13 2015-01-21 鸿富锦精密工业（深圳）有限公司 影像感测模组及相机模组
US8947797B2 (en) * 2010-11-15 2015-02-03 DigitalOptics Corporation MEMS Miniature MEMS actuator assemblies
DE102011011527A1 (de) 2011-02-17 2012-08-23 Conti Temic Microelectronic Gmbh Kameramodul
KR101845089B1 (ko) * 2011-11-23 2018-04-03 엘지이노텍 주식회사 카메라 모듈
CN102854714A (zh) 2012-08-16 2013-01-02 浙江宇视科技有限公司 一种变焦摄像机散热装置
JP5488852B1 (ja) * 2012-10-31 2014-05-14 ミツミ電機株式会社 レンズホルダ駆動装置及び携帯機器
US20140168507A1 (en) * 2012-12-17 2014-06-19 Integrated Micro-Electronics, Inc. Camera Module With Enhanced Heat Dissipation
KR101391176B1 (ko) * 2013-04-29 2014-05-07 주식회사 뷰웍스 영상촬영장치
EP3919977B1 (en) * 2013-07-29 2025-04-02 Lg Innotek Co. Ltd Camera module
US10054757B2 (en) * 2013-09-03 2018-08-21 Veoneer Sweden Ab Camera module for a motor vehicle and method of mounting a camera module
US9429750B2 (en) * 2013-09-12 2016-08-30 Sunming Technologies (Hk) Limited Dust-free lens driving apparatus
DE102014212016A1 (de) * 2014-06-23 2015-12-24 Robert Bosch Gmbh Kamera, insbesondere in einem Fahrzeug einsetzbar, sowie ein Verfahren zum Herstellen einer derartigen Kamera
JP6638151B2 (ja) 2014-07-04 2020-01-29 日本電産コパル株式会社 撮像装置
CN205179197U (zh) * 2015-11-23 2016-04-20 深圳市大疆创新科技有限公司 影像撷取模组及航拍飞行器
CN205142363U (zh) * 2015-12-04 2016-04-06 苏州中德宏泰电子科技股份有限公司 一种摄像组件

Also Published As

Publication number Publication date
JP2019091016A (ja) 2019-06-13
KR102180795B1 (ko) 2020-11-19
TW201925897A (zh) 2019-07-01
EP3471391B1 (en) 2020-08-12
CN109660704B (zh) 2021-06-25
KR20190040447A (ko) 2019-04-18
TWI730254B (zh) 2021-06-11
CN109660704A (zh) 2019-04-19
US20190109166A1 (en) 2019-04-11
US10692906B2 (en) 2020-06-23
EP3471391A1 (en) 2019-04-17

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