TWI730254B - 攝影機 - Google Patents
攝影機 Download PDFInfo
- Publication number
- TWI730254B TWI730254B TW107135153A TW107135153A TWI730254B TW I730254 B TWI730254 B TW I730254B TW 107135153 A TW107135153 A TW 107135153A TW 107135153 A TW107135153 A TW 107135153A TW I730254 B TWI730254 B TW I730254B
- Authority
- TW
- Taiwan
- Prior art keywords
- camera
- holder
- base
- lens
- sensor
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 36
- 239000004020 conductor Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- CJDNEKOMKXLSBN-UHFFFAOYSA-N 1-chloro-3-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1 CJDNEKOMKXLSBN-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/26—Holders for containing light sensitive material and adapted to be inserted within the camera
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Aviation & Aerospace Engineering (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17195692.3A EP3471391B1 (en) | 2017-10-10 | 2017-10-10 | A camera |
| EP17195692.3 | 2017-10-10 | ||
| ??17195692.3 | 2017-10-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201925897A TW201925897A (zh) | 2019-07-01 |
| TWI730254B true TWI730254B (zh) | 2021-06-11 |
Family
ID=60083783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107135153A TWI730254B (zh) | 2017-10-10 | 2018-10-05 | 攝影機 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10692906B2 (enExample) |
| EP (1) | EP3471391B1 (enExample) |
| JP (1) | JP6910998B2 (enExample) |
| KR (1) | KR102180795B1 (enExample) |
| CN (1) | CN109660704B (enExample) |
| TW (1) | TWI730254B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI753255B (zh) * | 2019-05-14 | 2022-01-21 | 群光電子股份有限公司 | 電子裝置及其鏡頭模組 |
| USD1086263S1 (en) * | 2022-11-04 | 2025-07-29 | Flir Systems Ab | Camera |
| US20250365488A1 (en) * | 2024-05-24 | 2025-11-27 | Raytheon Company | Structural support beams used as electrical conductors in cooled infrared camera housings |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008211378A (ja) * | 2007-02-23 | 2008-09-11 | Auto Network Gijutsu Kenkyusho:Kk | 撮像装置 |
| US20090239338A1 (en) * | 2007-11-08 | 2009-09-24 | Nanyang Technological University | Method of Forming an Interconnect on a Semiconductor Substrate |
| EP2124431A2 (en) * | 2008-05-09 | 2009-11-25 | Mitsumi Electric Co., Ltd. | Camera module comprising three members |
| US20100033647A1 (en) * | 2008-08-08 | 2010-02-11 | Sharp Kabushiki Kaisha | Display element and electronic element module, manufacturing method of the display element and electronic element module,and electronic information device |
| US20130128100A1 (en) * | 2011-11-23 | 2013-05-23 | Lg Innotek Co., Ltd. | Camera module |
| JP2014092572A (ja) * | 2012-10-31 | 2014-05-19 | Mitsumi Electric Co Ltd | レンズホルダ駆動装置及び携帯機器 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001309216A (ja) * | 2000-04-24 | 2001-11-02 | Olympus Optical Co Ltd | 電子カメラ |
| TWI437301B (zh) * | 2006-02-03 | 2014-05-11 | Hitachi Maxell | Camera module |
| WO2008023894A1 (en) * | 2006-08-22 | 2008-02-28 | Lg Innotek Co., Ltd | Camera module |
| US7734171B2 (en) * | 2008-01-29 | 2010-06-08 | Autoliv Asp, Inc. | Snap-in retainer for a sensor system |
| JP2009246932A (ja) * | 2008-03-13 | 2009-10-22 | Olympus Imaging Corp | 撮影レンズユニット及びそれを用いた電子機器 |
| CN101609836B (zh) * | 2008-06-19 | 2012-07-18 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器模组及相机模组 |
| JP2010145616A (ja) * | 2008-12-17 | 2010-07-01 | Nikon Corp | カメラボディ、レンズ鏡筒及びカメラシステム |
| CN101924081A (zh) | 2009-06-15 | 2010-12-22 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器封装体及影像感测器模组 |
| JP2012029028A (ja) * | 2010-07-23 | 2012-02-09 | Panasonic Corp | センサパッケージ、撮像装置及び携帯電子機器 |
| WO2012015965A1 (en) | 2010-07-27 | 2012-02-02 | Flir Systems, Inc. | Infrared camera architecture systems and methods |
| CN103168264B (zh) | 2010-08-09 | 2015-10-14 | 剑桥机电有限公司 | 摄像装置 |
| CN102377949B (zh) * | 2010-08-13 | 2015-01-21 | 鸿富锦精密工业(深圳)有限公司 | 影像感测模组及相机模组 |
| US8947797B2 (en) * | 2010-11-15 | 2015-02-03 | DigitalOptics Corporation MEMS | Miniature MEMS actuator assemblies |
| DE102011011527A1 (de) | 2011-02-17 | 2012-08-23 | Conti Temic Microelectronic Gmbh | Kameramodul |
| CN102854714A (zh) | 2012-08-16 | 2013-01-02 | 浙江宇视科技有限公司 | 一种变焦摄像机散热装置 |
| US20140168507A1 (en) * | 2012-12-17 | 2014-06-19 | Integrated Micro-Electronics, Inc. | Camera Module With Enhanced Heat Dissipation |
| KR101391176B1 (ko) * | 2013-04-29 | 2014-05-07 | 주식회사 뷰웍스 | 영상촬영장치 |
| EP3919977B1 (en) * | 2013-07-29 | 2025-04-02 | Lg Innotek Co. Ltd | Camera module |
| US10054757B2 (en) * | 2013-09-03 | 2018-08-21 | Veoneer Sweden Ab | Camera module for a motor vehicle and method of mounting a camera module |
| US9429750B2 (en) * | 2013-09-12 | 2016-08-30 | Sunming Technologies (Hk) Limited | Dust-free lens driving apparatus |
| DE102014212016A1 (de) * | 2014-06-23 | 2015-12-24 | Robert Bosch Gmbh | Kamera, insbesondere in einem Fahrzeug einsetzbar, sowie ein Verfahren zum Herstellen einer derartigen Kamera |
| JP6638151B2 (ja) | 2014-07-04 | 2020-01-29 | 日本電産コパル株式会社 | 撮像装置 |
| CN205179197U (zh) * | 2015-11-23 | 2016-04-20 | 深圳市大疆创新科技有限公司 | 影像撷取模组及航拍飞行器 |
| CN205142363U (zh) * | 2015-12-04 | 2016-04-06 | 苏州中德宏泰电子科技股份有限公司 | 一种摄像组件 |
-
2017
- 2017-10-10 EP EP17195692.3A patent/EP3471391B1/en active Active
-
2018
- 2018-08-28 KR KR1020180101230A patent/KR102180795B1/ko active Active
- 2018-09-28 CN CN201811138155.6A patent/CN109660704B/zh active Active
- 2018-10-03 US US16/150,791 patent/US10692906B2/en active Active
- 2018-10-04 JP JP2018189377A patent/JP6910998B2/ja active Active
- 2018-10-05 TW TW107135153A patent/TWI730254B/zh active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008211378A (ja) * | 2007-02-23 | 2008-09-11 | Auto Network Gijutsu Kenkyusho:Kk | 撮像装置 |
| US20090239338A1 (en) * | 2007-11-08 | 2009-09-24 | Nanyang Technological University | Method of Forming an Interconnect on a Semiconductor Substrate |
| EP2124431A2 (en) * | 2008-05-09 | 2009-11-25 | Mitsumi Electric Co., Ltd. | Camera module comprising three members |
| US20100033647A1 (en) * | 2008-08-08 | 2010-02-11 | Sharp Kabushiki Kaisha | Display element and electronic element module, manufacturing method of the display element and electronic element module,and electronic information device |
| US8704961B2 (en) * | 2008-08-08 | 2014-04-22 | Sharp Kabushiki Kaisha | Display element having a lens being formed as part of a translucent support substrate having a display disposed thereon |
| US20130128100A1 (en) * | 2011-11-23 | 2013-05-23 | Lg Innotek Co., Ltd. | Camera module |
| JP2014092572A (ja) * | 2012-10-31 | 2014-05-19 | Mitsumi Electric Co Ltd | レンズホルダ駆動装置及び携帯機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019091016A (ja) | 2019-06-13 |
| KR102180795B1 (ko) | 2020-11-19 |
| JP6910998B2 (ja) | 2021-07-28 |
| TW201925897A (zh) | 2019-07-01 |
| EP3471391B1 (en) | 2020-08-12 |
| CN109660704B (zh) | 2021-06-25 |
| KR20190040447A (ko) | 2019-04-18 |
| CN109660704A (zh) | 2019-04-19 |
| US20190109166A1 (en) | 2019-04-11 |
| US10692906B2 (en) | 2020-06-23 |
| EP3471391A1 (en) | 2019-04-17 |
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