TWI730254B - 攝影機 - Google Patents

攝影機 Download PDF

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Publication number
TWI730254B
TWI730254B TW107135153A TW107135153A TWI730254B TW I730254 B TWI730254 B TW I730254B TW 107135153 A TW107135153 A TW 107135153A TW 107135153 A TW107135153 A TW 107135153A TW I730254 B TWI730254 B TW I730254B
Authority
TW
Taiwan
Prior art keywords
camera
holder
base
lens
sensor
Prior art date
Application number
TW107135153A
Other languages
English (en)
Chinese (zh)
Other versions
TW201925897A (zh
Inventor
寛之 井手
Original Assignee
瑞典商安訊士有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞典商安訊士有限公司 filed Critical 瑞典商安訊士有限公司
Publication of TW201925897A publication Critical patent/TW201925897A/zh
Application granted granted Critical
Publication of TWI730254B publication Critical patent/TWI730254B/zh

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/804Containers or encapsulations
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • G03B17/12Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/26Holders for containing light sensitive material and adapted to be inserted within the camera
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/55Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/52Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
TW107135153A 2017-10-10 2018-10-05 攝影機 TWI730254B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17195692.3A EP3471391B1 (en) 2017-10-10 2017-10-10 A camera
EP17195692.3 2017-10-10
??17195692.3 2017-10-10

Publications (2)

Publication Number Publication Date
TW201925897A TW201925897A (zh) 2019-07-01
TWI730254B true TWI730254B (zh) 2021-06-11

Family

ID=60083783

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107135153A TWI730254B (zh) 2017-10-10 2018-10-05 攝影機

Country Status (6)

Country Link
US (1) US10692906B2 (enExample)
EP (1) EP3471391B1 (enExample)
JP (1) JP6910998B2 (enExample)
KR (1) KR102180795B1 (enExample)
CN (1) CN109660704B (enExample)
TW (1) TWI730254B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI753255B (zh) * 2019-05-14 2022-01-21 群光電子股份有限公司 電子裝置及其鏡頭模組
USD1086263S1 (en) * 2022-11-04 2025-07-29 Flir Systems Ab Camera
US20250365488A1 (en) * 2024-05-24 2025-11-27 Raytheon Company Structural support beams used as electrical conductors in cooled infrared camera housings

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211378A (ja) * 2007-02-23 2008-09-11 Auto Network Gijutsu Kenkyusho:Kk 撮像装置
US20090239338A1 (en) * 2007-11-08 2009-09-24 Nanyang Technological University Method of Forming an Interconnect on a Semiconductor Substrate
EP2124431A2 (en) * 2008-05-09 2009-11-25 Mitsumi Electric Co., Ltd. Camera module comprising three members
US20100033647A1 (en) * 2008-08-08 2010-02-11 Sharp Kabushiki Kaisha Display element and electronic element module, manufacturing method of the display element and electronic element module,and electronic information device
US20130128100A1 (en) * 2011-11-23 2013-05-23 Lg Innotek Co., Ltd. Camera module
JP2014092572A (ja) * 2012-10-31 2014-05-19 Mitsumi Electric Co Ltd レンズホルダ駆動装置及び携帯機器

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JP2001309216A (ja) * 2000-04-24 2001-11-02 Olympus Optical Co Ltd 電子カメラ
TWI437301B (zh) * 2006-02-03 2014-05-11 Hitachi Maxell Camera module
WO2008023894A1 (en) * 2006-08-22 2008-02-28 Lg Innotek Co., Ltd Camera module
US7734171B2 (en) * 2008-01-29 2010-06-08 Autoliv Asp, Inc. Snap-in retainer for a sensor system
JP2009246932A (ja) * 2008-03-13 2009-10-22 Olympus Imaging Corp 撮影レンズユニット及びそれを用いた電子機器
CN101609836B (zh) * 2008-06-19 2012-07-18 鸿富锦精密工业(深圳)有限公司 影像感测器模组及相机模组
JP2010145616A (ja) * 2008-12-17 2010-07-01 Nikon Corp カメラボディ、レンズ鏡筒及びカメラシステム
CN101924081A (zh) 2009-06-15 2010-12-22 鸿富锦精密工业(深圳)有限公司 影像感测器封装体及影像感测器模组
JP2012029028A (ja) * 2010-07-23 2012-02-09 Panasonic Corp センサパッケージ、撮像装置及び携帯電子機器
WO2012015965A1 (en) 2010-07-27 2012-02-02 Flir Systems, Inc. Infrared camera architecture systems and methods
CN103168264B (zh) 2010-08-09 2015-10-14 剑桥机电有限公司 摄像装置
CN102377949B (zh) * 2010-08-13 2015-01-21 鸿富锦精密工业(深圳)有限公司 影像感测模组及相机模组
US8947797B2 (en) * 2010-11-15 2015-02-03 DigitalOptics Corporation MEMS Miniature MEMS actuator assemblies
DE102011011527A1 (de) 2011-02-17 2012-08-23 Conti Temic Microelectronic Gmbh Kameramodul
CN102854714A (zh) 2012-08-16 2013-01-02 浙江宇视科技有限公司 一种变焦摄像机散热装置
US20140168507A1 (en) * 2012-12-17 2014-06-19 Integrated Micro-Electronics, Inc. Camera Module With Enhanced Heat Dissipation
KR101391176B1 (ko) * 2013-04-29 2014-05-07 주식회사 뷰웍스 영상촬영장치
EP3919977B1 (en) * 2013-07-29 2025-04-02 Lg Innotek Co. Ltd Camera module
US10054757B2 (en) * 2013-09-03 2018-08-21 Veoneer Sweden Ab Camera module for a motor vehicle and method of mounting a camera module
US9429750B2 (en) * 2013-09-12 2016-08-30 Sunming Technologies (Hk) Limited Dust-free lens driving apparatus
DE102014212016A1 (de) * 2014-06-23 2015-12-24 Robert Bosch Gmbh Kamera, insbesondere in einem Fahrzeug einsetzbar, sowie ein Verfahren zum Herstellen einer derartigen Kamera
JP6638151B2 (ja) 2014-07-04 2020-01-29 日本電産コパル株式会社 撮像装置
CN205179197U (zh) * 2015-11-23 2016-04-20 深圳市大疆创新科技有限公司 影像撷取模组及航拍飞行器
CN205142363U (zh) * 2015-12-04 2016-04-06 苏州中德宏泰电子科技股份有限公司 一种摄像组件

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211378A (ja) * 2007-02-23 2008-09-11 Auto Network Gijutsu Kenkyusho:Kk 撮像装置
US20090239338A1 (en) * 2007-11-08 2009-09-24 Nanyang Technological University Method of Forming an Interconnect on a Semiconductor Substrate
EP2124431A2 (en) * 2008-05-09 2009-11-25 Mitsumi Electric Co., Ltd. Camera module comprising three members
US20100033647A1 (en) * 2008-08-08 2010-02-11 Sharp Kabushiki Kaisha Display element and electronic element module, manufacturing method of the display element and electronic element module,and electronic information device
US8704961B2 (en) * 2008-08-08 2014-04-22 Sharp Kabushiki Kaisha Display element having a lens being formed as part of a translucent support substrate having a display disposed thereon
US20130128100A1 (en) * 2011-11-23 2013-05-23 Lg Innotek Co., Ltd. Camera module
JP2014092572A (ja) * 2012-10-31 2014-05-19 Mitsumi Electric Co Ltd レンズホルダ駆動装置及び携帯機器

Also Published As

Publication number Publication date
JP2019091016A (ja) 2019-06-13
KR102180795B1 (ko) 2020-11-19
JP6910998B2 (ja) 2021-07-28
TW201925897A (zh) 2019-07-01
EP3471391B1 (en) 2020-08-12
CN109660704B (zh) 2021-06-25
KR20190040447A (ko) 2019-04-18
CN109660704A (zh) 2019-04-19
US20190109166A1 (en) 2019-04-11
US10692906B2 (en) 2020-06-23
EP3471391A1 (en) 2019-04-17

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