JP6908223B2 - 被覆された可撓性部品 - Google Patents

被覆された可撓性部品 Download PDF

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Publication number
JP6908223B2
JP6908223B2 JP2018527118A JP2018527118A JP6908223B2 JP 6908223 B2 JP6908223 B2 JP 6908223B2 JP 2018527118 A JP2018527118 A JP 2018527118A JP 2018527118 A JP2018527118 A JP 2018527118A JP 6908223 B2 JP6908223 B2 JP 6908223B2
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Japan
Prior art keywords
coating
flexible
electronic component
molybdenum
atomic
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JP2018527118A
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English (en)
Japanese (ja)
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JP2018538571A (ja
JP2018538571A5 (enrdf_load_stackoverflow
Inventor
ケステンバウアー、ハラルト
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Plansee SE
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Plansee SE
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Publication of JP2018538571A5 publication Critical patent/JP2018538571A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Photovoltaic Devices (AREA)
  • Laminated Bodies (AREA)
JP2018527118A 2015-11-27 2016-10-24 被覆された可撓性部品 Active JP6908223B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM350/2015 2015-11-27
ATGM350/2015U AT15048U1 (de) 2015-11-27 2015-11-27 Beschichtetes flexibles Bauteil
PCT/AT2016/000094 WO2017087998A1 (de) 2015-11-27 2016-10-24 Beschichtetes flexibles bauteil

Publications (3)

Publication Number Publication Date
JP2018538571A JP2018538571A (ja) 2018-12-27
JP2018538571A5 JP2018538571A5 (enrdf_load_stackoverflow) 2019-11-07
JP6908223B2 true JP6908223B2 (ja) 2021-07-21

Family

ID=57227195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018527118A Active JP6908223B2 (ja) 2015-11-27 2016-10-24 被覆された可撓性部品

Country Status (6)

Country Link
JP (1) JP6908223B2 (enrdf_load_stackoverflow)
KR (1) KR102578294B1 (enrdf_load_stackoverflow)
CN (1) CN108292667B (enrdf_load_stackoverflow)
AT (1) AT15048U1 (enrdf_load_stackoverflow)
TW (1) TWI701346B (enrdf_load_stackoverflow)
WO (1) WO2017087998A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT15574U3 (de) 2017-05-11 2018-05-15 Plansee Se Flexibles Bauteil mit Schichtaufbau mit metallischer Lage
WO2020263628A1 (en) 2019-06-26 2020-12-30 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays
US11550364B2 (en) * 2019-11-01 2023-01-10 Motorola Mobility Llc Flexible display with preformed curvilinear foldable substrate and corresponding electronic devices and methods
CN116855888A (zh) * 2023-07-25 2023-10-10 北京师范大学 一种柔性高熵合金涂层及其制备方法和应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4228405B2 (ja) * 1998-01-22 2009-02-25 東洋紡績株式会社 金属薄膜積層フィルムおよび該フィルムを用いたフレキシブルプリント配線板
JP4197206B2 (ja) * 1998-12-25 2008-12-17 シャープ株式会社 積層金属配線及び薄膜トランジスタ基板、並びにそれらの製造方法
JP2001174613A (ja) * 1999-12-21 2001-06-29 Mitsui Chemicals Inc 反射部材
JP2003099917A (ja) * 2001-09-21 2003-04-04 Fuji Photo Film Co Ltd 磁気記録媒体
US20030134151A1 (en) * 2001-09-14 2003-07-17 Fuji Photo Film Co., Ltd. Magnetic recording medium
ES2402364T3 (es) * 2006-01-27 2013-05-03 European Central Bank Medios de seguridad electrónicos para documentos de seguridad que utilizan un generador de energía termoeléctrica
AT11941U1 (de) 2010-02-12 2011-07-15 Plansee Metall Gmbh Berührungssensoranordnung
KR20130082234A (ko) * 2012-01-11 2013-07-19 도레이첨단소재 주식회사 자성체를 포함하는 플렉시블 기판 및 이를 사용한 플렉시블 디스플레이의 제조방법
JP5685558B2 (ja) * 2012-04-19 2015-03-18 株式会社東芝 表示装置
US9121100B2 (en) 2012-12-14 2015-09-01 Intermolecular, Inc. Silver based conductive layer for flexible electronics
US9299472B2 (en) * 2013-06-06 2016-03-29 H.C. Starck Inc. Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displays
US20150014663A1 (en) * 2013-07-11 2015-01-15 Korea Institute Of Science And Technology Organic light emitting display apparatus and the method for manufacturing the same

Also Published As

Publication number Publication date
AT15048U1 (de) 2016-11-15
CN108292667A (zh) 2018-07-17
CN108292667B (zh) 2022-06-14
TWI701346B (zh) 2020-08-11
KR20180087267A (ko) 2018-08-01
TW201728766A (zh) 2017-08-16
WO2017087998A1 (de) 2017-06-01
KR102578294B1 (ko) 2023-09-13
JP2018538571A (ja) 2018-12-27

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