JP6901863B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6901863B2 JP6901863B2 JP2017020245A JP2017020245A JP6901863B2 JP 6901863 B2 JP6901863 B2 JP 6901863B2 JP 2017020245 A JP2017020245 A JP 2017020245A JP 2017020245 A JP2017020245 A JP 2017020245A JP 6901863 B2 JP6901863 B2 JP 6901863B2
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Images
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- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
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- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
- G09G2310/0264—Details of driving circuits
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
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Description
本実施の形態では、複数の異なる電源電圧を出力する電源回路として機能する半導体装置の構成について、図1乃至図5を用いて説明する。
本実施の形態では、図1で説明した電源制御回路とは異なる構成について説明する。具体的には、帰還制御機能を持つ電源制御回路について、図6を用いて説明する。
本実施の形態では、アナログの入出力機能をもつ電源制御装置について、図7を用いて説明する。
本実施の形態では、アナログの入出力機能をもつ半導体装置について、図8を用いて説明する。
本実施の形態では、タイミング制御可能なアナログ入出力端子をもつ半導体装置について、図9を用いて説明する。
本実施の形態では、半導体装置1000tが、制御装置、表示装置、およびタッチパネル装置等を有した例について、図10を用いて説明する。
本実施の形態では、図14乃至図16を参照して、表示パネルの構成例について説明する。
本実施の形態では、半導体装置の一例として、ICチップ、電子部品、電子機器等について説明する。
図17(A)は、電子部品の作製方法例を示すフローチャートである。電子部品は、半導体パッケージ、またはIC用パッケージともいう。この電子部品は、端子取り出し方向や、端子の形状に応じて、複数の規格や名称が存在する。そこで、本実施の形態では、その一例について説明することにする。
回路領域7102には、本発明の形態に係る半導体装置(例えば、記憶装置、撮像装置、MCU等)が設けられている。
本実施の形態では、酸化物半導体トランジスタ等について説明する。
図20(A)はOSトランジスタの構成例を示す上面図である。図20(B)は、図20(A)のX1−X2線断面図であり、図20(C)はY1−Y2線断面図である。ここでは、X1−X2線の方向をチャネル長方向と、Y1−Y2線方向をチャネル幅方向と呼称する場合がある。図20(B)は、OSトランジスタのチャネル長方向の断面構造を示す図であり、図20(C)は、OSトランジスタのチャネル幅方向の断面構造を示す図である。なお、デバイス構造を明確にするため、図20(A)では、一部の構成要素が省略されている。
導電層550―553に用いられる導電材料には、リン等の不純物元素をドーピングした多結晶シリコンに代表される半導体、ニッケルシリサイド等のシリサイド、モリブデン、チタン、タンタル、タングステン、アルミニウム、銅、クロム、ネオジム、スカンジウム等の金属、または上述した金属を成分とする金属窒化物(窒化タンタル、窒化チタン、窒化モリブデン、窒化タングステン)等がある。また、インジウム錫酸化物、酸化タングステンを含むインジウム酸化物、酸化タングステンを含むインジウム亜鉛酸化物、酸化チタンを含むインジウム酸化物、酸化チタンを含むインジウム錫酸化物、インジウム亜鉛酸化物、酸化ケイ素を添加したインジウム錫酸化物などの導電性材料を用いることができる。
絶縁層521乃至529に用いられる絶縁材料には、窒化アルミニウム、酸化アルミニウム、窒化酸化アルミニウム、酸化窒化アルミニウム、酸化マグネシウム、窒化シリコン、酸化シリコン、窒化酸化シリコン、酸化窒化シリコン、酸化ガリウム、酸化ゲルマニウム、酸化イットリウム、酸化ジルコニウム、酸化ランタン、酸化ネオジム、酸化ハフニウム、酸化タンタル、アルミニウムシリケートなどがある。絶縁層521乃至529はこれらの絶縁材料でなる単層、または積層して構成される。絶縁層521乃至529を構成する層は、複数の絶縁材料を含んでいてもよい。
金属酸化物層511乃至513の各厚さは3nm以上500nm以下であり、3nm以上100nm以下が好ましく、3nm以上60nm以下がさらに好ましい。
図27を参照して、金属酸化物層511乃至513の積層によって得られる効果を説明する。図27は、OSトランジスタ501のチャネル形成領域のエネルギーバンド構造の模式図である。ここでは、OSトランジスタ501を例に説明するが、金属酸化物層511乃至513の積層による効果は、後述するOSトランジスタ502、503でも同様である。
図21(A)乃至図21(C)に示すOSトランジスタ502は、OSトランジスタ501の変形例である。OSトランジスタ502の導電層550は、導電層550a、導電層550b、導電層550cを有する。
図22(A)乃至図22(C)に示すOSトランジスタ503は、OSトランジスタ501の変形例である。OSトランジスタ503では、導電層550をエッチングマスクに用いて、金属酸化物層513および絶縁層527がエッチングされている。
図23(A)乃至図23(C)に示すOSトランジスタ504は、OSトランジスタ501の変形例である。
図24(A)乃至図24(C)に示すOSトランジスタ505は、OSトランジスタ501の変形例である。
図25(A)乃至図25(C)に示すOSトランジスタ506は、OSトランジスタ501の変形例であり、主に、ゲート電極の構造が異なる。
図26(A)乃至図26(C)に示すOSトランジスタ507は、OSトランジスタ506の変形例である。
図28を参照して、OSトランジスタとSiトランジスタとで構成されている半導体装置の構成例を説明する。
本実施の形態では、酸化物半導体について説明する。酸化物半導体は、単結晶酸化物半導体と、それ以外の非単結晶酸化物半導体と、に分けられる。非単結晶酸化物半導体としては、CAAC−OS(c−axis−aligned crystalline oxide semiconductor)、多結晶酸化物半導体、nc−OS(nanocrystalline oxide semiconductor)、擬似非晶質酸化物半導体(a−like OS:amorphous−like oxide semiconductor)および非晶質酸化物半導体などがある。
CAAC−OSは、c軸配向した複数の結晶部(ペレットともいう。)を有する酸化物半導体の一種である。
nc−OSは、微小な領域(例えば、1nm以上10nm以下の領域、特に1nm以上3nm以下の領域)において原子配列に周期性を有する。nc−OSは、異なる結晶部間で結晶方位に規則性が見られない。そのため、膜全体で配向性が見られない。結晶部(ナノ結晶)間で結晶方位が規則性を有さないことから、nc−OSを、RANC(Random Aligned nanocrystals)を有する酸化物半導体、またはNANC(Non−Aligned nanocrystals)を有する酸化物半導体と呼ぶこともできる。
次に、酸化物半導体のキャリア密度について説明する。酸化物半導体のキャリア密度に影響を与える因子としては、酸化物半導体中の酸素欠損(VO)、または酸化物半導体中の不純物などが挙げられる。
V2 出力電圧
V3 出力電圧
10 制御装置
11 信号生成回路
20 表示装置
21 表示ユニット
22 走査ドライバ
23 ソースドライバ
24 画素部
25 電流検出回路
26 スイッチ回路
30 タッチセンサユニット
31 センサアレイ
32 センス回路
33 ドライブ線ドライバ回路
41 表示コントローラ
42 メモリ
43 タイミングコントローラ
44 画像処理回路
45 コントローラ
46 メモリ
47 タイミングコントローラ
48 信号処理回路
72 ダイシング工程
100 電源制御回路
100A 電源制御回路
100B 電源制御回路
100C 電源制御回路
110 基準電圧生成回路
110A 基準電圧生成回路
111 パルス幅変調回路
112 直流電圧変換回路
113 アンテナ回路
114 整流器
115 バッテリ
120 安定化電源回路
120A 安定化電源回路
120B 安定化電源回路
121 サンプルホールド回路
122 増幅回路
124 容量素子
125 トランジスタ
126 トランジスタ
127 インバータ
128 インバータ
130 安定化電源回路
131 サンプルホールド回路
134 容量素子
135 トランジスタ
140 安定化電源回路
140−IC 半導体装置
140A 安定化電源回路
140B 安定化電源回路
150 安定化電源回路
180 安定化電源回路
180A 安定化電源回路
180B 安定化電源回路
190 安定化電源回路
200 制御回路
200A 制御回路
200B 制御回路
200C 制御回路
200D 制御回路
201 プロセッサ
202 デコーダ回路
203 デジタルアナログ変換回路
204 アナログデジタル変換回路
210 スイッチ
211 スイッチ
220 アドレスバス
221 データバス
300 入出力端子
400 回路
400A 回路
401 スイッチ
402 スイッチ
403 トランジスタ
404 トランジスタ
405 トランジスタ
410 容量素子
420 反転回路
421 バッファ
501 OSトランジスタ
502 OSトランジスタ
503 OSトランジスタ
504 OSトランジスタ
505 OSトランジスタ
506 OSトランジスタ
507 OSトランジスタ
510 酸化物層
511 金属酸化物層
512 金属酸化物層
513 金属酸化物層
514 金属酸化物層
521 絶縁層
522 絶縁層
523 絶縁層
524 絶縁層
525 絶縁層
526 絶縁層
527 絶縁層
528 絶縁層
529 絶縁層
530 絶縁層
550 導電層
550a 導電層
550b 導電層
550c 導電層
551 導電層
551a 導電層
551b 導電層
552 導電層
552a 導電層
552b 導電層
553 導電層
553a 導電層
553b 導電層
560 単結晶シリコンウエハ
570 CMOS層
571 OSFET層
700 表示装置
701 タッチパネル装置
702 タッチパネル装置
711 上部カバー
712 下部カバー
713 バッテリ
714 プリント基板
715 フレーム
720 表示ユニット
721 表示パネル
722 素子基板
723 対向基板
728 FPC
730 タッチセンサユニット
731 タッチセンサパネル
732 基板
734 センサアレイ
739 FPC
740 タッチパネルユニット
741 表示パネル
742 素子基板
743 対向基板
744 センサアレイ
745 タッチパネルユニット
746 表示パネル
747 素子基板
748 対向基板
750 タッチパネルユニット
751 表示パネル
752 素子基板
753 対向基板
763 ドライバIC
770 ソースドライバIC
771 ドライバIC
780 ドライブ線ドライバIC
781 センス回路SN−IC
782 ドライバIC
783 ドライバIC
795 TS−DRU
796 TS−SNU
1000 半導体装置
1000A 半導体装置
1000B 半導体装置
1000C 半導体装置
1000D 半導体装置
1000E 半導体装置
2010 情報端末
2011 筐体
2012 表示部
2013 操作ボタン
2014 外部接続ポート
2015 スピーカ
2016 マイクロフォン
2020 無線信号
2021 無線信号
2030 情報端末
2031 筐体
2032 表示部
2033 リュウズ
2034 ベルト
2035 検知部
2040 情報端末
2041 装着部
2042 筐体
2045 ケーブル
2046 バッテリ
2047 表示部
2051 筐体
2052 表示部
2053 キーボード
2054 ポインティングデバイス
2070 ビデオカメラ
2071 筐体
2072 表示部
2073 筐体
2074 操作キー
2075 レンズ
2076 接続部
2110 携帯型遊技機
2111 筐体
2112 表示部
2113 スピーカ
2114 LEDランプ
2115 操作キーボタン
2116 接続端子
2117 カメラ
2118 マイクロフォン
2119 記録媒体読込部
2150 電気冷凍冷蔵庫
2151 筐体
2152 冷蔵室用扉
2153 冷凍室用扉
2170 自動車
2171 車体
2172 車輪
2173 ダッシュボード
2174 ライト
4001 基板
4005 シール材
4006 基板
4010 トランジスタ
4011 トランジスタ
4014 導電層
4015 導電層
4018 FPC
4019 異方性導電層
4020 容量素子
4021 導電層
4030 導電層
4031 導電層
4102 絶縁層
4103 絶縁層
4110 絶縁層
4111 絶縁層
4112 絶縁層
4120 画素アレイ
4125 ゲートドライバ回路
4126 端子部
4150 導電層
4151 導電層
4152 半導体層
4156 導電層
4157 導電層
4201 表示パネル
4202 表示パネル
4203 表示パネル
4204 表示パネル
4510 隔壁
4511 発光層
4513 EL素子
4514 充填材
4600 LC素子
4601 対向電極
7000 電子部品
7001 リード
7002 プリント基板
7004 回路基板
7100 半導体ウエハ
7102 回路領域
7104 分離領域
7106 分離線
7110 チップ
Claims (8)
- 電源制御回路と、制御回路と、を有し、
前記電源制御回路は、基準電圧生成回路と、複数の安定化電源回路を有し、前記複数の安定化電源回路から複数の異なる電源電圧を出力する機能を有し、
前記複数の安定化電源回路のそれぞれは、第1のサンプルホールド回路と、第1の増幅回路と、を有し、
前記第1のサンプルホールド回路は、第1のトランジスタと、第1の容量素子を有し、
前記制御回路は、プロセッサと、デジタルアナログ変換回路と、デコーダ回路と、第1のスイッチを有し、
前記基準電圧生成回路は、前記第1の増幅回路の電源となる基準電圧を生成する機能を有し、
前記デコーダ回路は、前記第1のトランジスタのゲートに電気的に接続され、前記プロセッサの制御に応じて、前記第1のトランジスタの導通状態または非導通状態を制御する信号を出力する機能を有し、
前記第1のスイッチは、前記基準電圧生成回路および前記デジタルアナログ変換回路と電気的に接続され、前記プロセッサの制御に応じてオンまたはオフし、オンのときに前記デジタルアナログ変換回路の電源となる前記基準電圧を与える機能を有し、
前記デジタルアナログ変換回路は、前記第1のトランジスタのソースまたはドレインの一方に電気的に接続され、前記第1のスイッチがオンのとき、前記プロセッサの制御に応じて、第1の電圧を前記第1のトランジスタのソースまたはドレインの一方に与える機能を有し、
前記第1のトランジスタのソースまたはドレインの他方は、前記第1の増幅回路の入力端子および前記第1の容量素子の一方の電極に電気的に接続され、
前記第1のトランジスタは導通状態のとき、前記第1の電圧を前記第1の増幅回路の入力端子および前記第1の容量素子の一方の電極に与える機能を有し、
前記第1の増幅回路は、前記第1の電圧を増幅して、出力端子から前記電源電圧として第2の電圧を出力する機能を有し、
前記第1のトランジスタは、チャネル形成領域に酸化物半導体を有することを特徴とする半導体装置。 - 請求項1において、
前記第1のスイッチがオフのとき、前記デジタルアナログ変換回路の電源は遮断されることを特徴とする半導体装置。 - 請求項1または2において、
前記安定化電源回路は、第2のサンプルホールド回路を有し、
前記第2のサンプルホールド回路は、第2のトランジスタと、第2の容量素子を有し、
前記制御回路は、アナログデジタル変換回路を有し、
前記デコーダ回路は、前記第2のトランジスタのゲートに電気的に接続され、前記プロセッサの制御に応じて、前記第2のトランジスタの導通状態または非導通状態を制御する信号を出力する機能を有し、
前記第2のトランジスタのソースまたはドレインの一方は、前記第1の増幅回路の出力端子および前記第2の容量素子の一方の電極に電気的に接続され、ソースまたはドレインの他方は、前記アナログデジタル変換回路に電気的に接続され、
前記第2のトランジスタのソースまたはドレインの一方、および前記第2の容量素子の一方の電極には、前記第2の電圧が与えられ、
前記第2のトランジスタは導通状態のとき、前記第2の電圧を前記アナログデジタル変換回路に与える機能を有し、
前記第2のトランジスタは、チャネル形成領域に酸化物半導体を有することを特徴とする半導体装置。 - 請求項3において、
前記制御回路は、第2のスイッチを有し、
前記第2のスイッチは、前記基準電圧生成回路および前記アナログデジタル変換回路と電気的に接続され、前記プロセッサの制御に応じてオンまたはオフし、オンのときに前記アナログデジタル変換回路の電源となる前記基準電圧を与える機能を有し、
前記アナログデジタル変換回路は、前記第2のスイッチがオンのとき、前記第2の電圧をデジタルデータに変換する機能を有し、
前記プロセッサは、前記デジタルデータを取り込んで前記第2の電圧を監視する機能を有することを特徴とする半導体装置。 - 請求項4において、
前記第2のスイッチがオフのとき、前記アナログデジタル変換回路の電源は遮断されることを特徴とする半導体装置。 - 請求項1または2において、
前記制御回路は、アナログデジタル変換回路を有し、
前記安定化電源回路は、切り替え回路を有し、
前記切り替え回路は、入出力端子を有し、
前記切り替え回路は、第2のスイッチと、第3のスイッチと、を有し
前記第2のスイッチの一方の端子は、前記第1の増幅回路の出力端子に電気的に接続され、
前記第3のスイッチの一方の端子は、前記アナログデジタル変換回路に電気的に接続され、
前記第2のスイッチの他方の端子は、前記入出力端子に電気的に接続され、
前記第3のスイッチの他方の端子は、前記入出力端子に電気的に接続され、
前記切り替え回路は、第1の機能乃至第3の機能を切り替える機能を有し、
前記第1の機能は、前記第2のスイッチを導通させることによって、前記第2の電圧を前記入出力端子に与える機能を有し、
前記第2の機能は、前記第2のスイッチと、前記第3のスイッチと、を、導通させることによって、前記第2の電圧を、前記入出力端子を介して前記アナログデジタル変換回路に与える機能を有し、
前記第3の機能は、
前記第2のスイッチと、前記第3のスイッチと、を、排他的に導通させる機能と、
前記第2のスイッチが導通、及び前記第3のスイッチが非導通のとき、前記第2の電圧を出力する機能と、
前記第2のスイッチが非導通、及び前記第3のスイッチが導通のとき、前記入出力端子に与えられた第3の電圧を監視する機能を有することを特徴とする半導体装置。 - 請求項6において、
前記デコーダ回路は、前記プロセッサの制御に応じて前記第2のスイッチおよび第3のスイッチを選択する機能を有し、
前記制御回路は、第4のスイッチを有し、
前記第4のスイッチは、前記基準電圧生成回路および前記アナログデジタル変換回路と電気的に接続され、前記プロセッサの制御に応じてオンまたはオフし、オンのときに前記アナログデジタル変換回路の電源となる前記基準電圧を与える機能を有し、
前記アナログデジタル変換回路は、前記第4のスイッチがオンのとき、前記第3のスイッチから与えられた電圧をデジタルデータに変換する機能を有し、
前記プロセッサは、前記デジタルデータを取り込んで前記第3のスイッチから与えられた電圧を監視する機能を有することを特徴とする半導体装置。 - 請求項7において、
前記第4のスイッチがオフのとき、前記アナログデジタル変換回路の電源は遮断されることを特徴とする半導体装置。
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CN112868182A (zh) * | 2018-10-18 | 2021-05-28 | 株式会社半导体能源研究所 | 半导体装置 |
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- 2017-01-30 US US15/419,500 patent/US9933806B2/en not_active Expired - Fee Related
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