JP6894602B2 - 印刷配線板およびその製造方法 - Google Patents
印刷配線板およびその製造方法 Download PDFInfo
- Publication number
- JP6894602B2 JP6894602B2 JP2015039026A JP2015039026A JP6894602B2 JP 6894602 B2 JP6894602 B2 JP 6894602B2 JP 2015039026 A JP2015039026 A JP 2015039026A JP 2015039026 A JP2015039026 A JP 2015039026A JP 6894602 B2 JP6894602 B2 JP 6894602B2
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- printed wiring
- wiring board
- open stub
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title description 9
- 239000010410 layer Substances 0.000 description 40
- 239000010408 film Substances 0.000 description 24
- 239000011347 resin Substances 0.000 description 22
- 229920005989 resin Polymers 0.000 description 22
- 239000000696 magnetic material Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 14
- 229910000859 α-Fe Inorganic materials 0.000 description 14
- 238000007747 plating Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 230000000903 blocking effect Effects 0.000 description 7
- 230000035699 permeability Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 230000001629 suppression Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
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- 239000000203 mixture Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
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- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0236—Electromagnetic band-gap structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/951,606 US10178758B2 (en) | 2014-11-28 | 2015-11-25 | Printed wiring board and method of producing the same |
| CN201510837552.2A CN105657957B (zh) | 2014-11-28 | 2015-11-26 | 印刷线路板及其制造方法 |
| KR1020150166257A KR102162594B1 (ko) | 2014-11-28 | 2015-11-26 | 인쇄 배선판 및 그 제조 방법 |
| TW104139631A TWI705737B (zh) | 2014-11-28 | 2015-11-27 | 印刷線路板及其製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014242125 | 2014-11-28 | ||
| JP2014242125 | 2014-11-28 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019084201A Division JP6829448B2 (ja) | 2014-11-28 | 2019-04-25 | 印刷配線板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016111314A JP2016111314A (ja) | 2016-06-20 |
| JP6894602B2 true JP6894602B2 (ja) | 2021-06-30 |
Family
ID=56124862
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015039026A Active JP6894602B2 (ja) | 2014-11-28 | 2015-02-27 | 印刷配線板およびその製造方法 |
| JP2019084201A Active JP6829448B2 (ja) | 2014-11-28 | 2019-04-25 | 印刷配線板およびその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019084201A Active JP6829448B2 (ja) | 2014-11-28 | 2019-04-25 | 印刷配線板およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6894602B2 (zh) |
| KR (1) | KR102162594B1 (zh) |
| CN (1) | CN105657957B (zh) |
| TW (1) | TWI705737B (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10542622B2 (en) * | 2016-07-27 | 2020-01-21 | National University Corporation Okayama University | Printed wiring board |
| CN109479378B (zh) * | 2016-07-27 | 2021-04-23 | 国立大学法人冈山大学 | 印刷布线板 |
| JP6744201B2 (ja) * | 2016-11-28 | 2020-08-19 | 京セラ株式会社 | 印刷配線板 |
| WO2018141295A1 (zh) * | 2017-02-04 | 2018-08-09 | 宁波舜宇光电信息有限公司 | 摄像模组及其模制电路板组件、电路板以及应用 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003008154A (ja) * | 2001-06-21 | 2003-01-10 | Nec Corp | 印刷配線板、同軸ケーブル及び電子装置 |
| JP3973402B2 (ja) * | 2001-10-25 | 2007-09-12 | 株式会社日立製作所 | 高周波回路モジュール |
| TW200818451A (en) * | 2006-06-02 | 2008-04-16 | Renesas Tech Corp | Semiconductor device |
| JP2008010859A (ja) * | 2006-06-02 | 2008-01-17 | Renesas Technology Corp | 半導体装置 |
| US8514147B2 (en) * | 2006-11-22 | 2013-08-20 | Nec Tokin Corporation | EBG structure, antenna device, RFID tag, noise filter, noise absorptive sheet and wiring board with noise absorption function |
| US20080158840A1 (en) * | 2006-12-27 | 2008-07-03 | Inventec Corporation | DC power plane structure |
| TWI375499B (en) * | 2007-11-27 | 2012-10-21 | Asustek Comp Inc | Improvement method for ebg structures and multi-layer board applying the same |
| WO2009082003A1 (ja) * | 2007-12-26 | 2009-07-02 | Nec Corporation | 電磁バンドギャップ素子及びそれを用いたアンテナ並びにフィルタ |
| JP5326649B2 (ja) * | 2009-02-24 | 2013-10-30 | 日本電気株式会社 | アンテナ、アレイアンテナ、プリント基板、及びそれを用いた電子装置 |
| KR101044203B1 (ko) * | 2009-11-18 | 2011-06-29 | 삼성전기주식회사 | 전자기 밴드갭 구조물 및 이를 포함하는 인쇄회로기판 |
| JP5591587B2 (ja) * | 2010-05-21 | 2014-09-17 | Ｎｅｃトーキン株式会社 | ノイズ抑制伝送路及びそれに用いられるシート状構造体 |
| US9251458B2 (en) | 2011-09-11 | 2016-02-02 | Féinics Amatech Teoranta | Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles |
| JP2013183082A (ja) * | 2012-03-02 | 2013-09-12 | Oki Printed Circuits Co Ltd | 多層プリント配線板 |
| JP2013232613A (ja) * | 2012-04-05 | 2013-11-14 | Sony Corp | 配線基板及び電子機器 |
| JP6497649B2 (ja) * | 2015-01-30 | 2019-04-10 | 国立大学法人 岡山大学 | 印刷配線板およびその製造方法 |
-
2015
- 2015-02-27 JP JP2015039026A patent/JP6894602B2/ja active Active
- 2015-11-26 CN CN201510837552.2A patent/CN105657957B/zh active Active
- 2015-11-26 KR KR1020150166257A patent/KR102162594B1/ko active IP Right Grant
- 2015-11-27 TW TW104139631A patent/TWI705737B/zh active
-
2019
- 2019-04-25 JP JP2019084201A patent/JP6829448B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016111314A (ja) | 2016-06-20 |
| JP2019134185A (ja) | 2019-08-08 |
| CN105657957A (zh) | 2016-06-08 |
| TWI705737B (zh) | 2020-09-21 |
| KR102162594B1 (ko) | 2020-10-07 |
| JP6829448B2 (ja) | 2021-02-10 |
| CN105657957B (zh) | 2020-07-14 |
| TW201630479A (zh) | 2016-08-16 |
| KR20160065008A (ko) | 2016-06-08 |
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