JP6888812B2 - フレキシブルデバイスの製造装置及び製造方法 - Google Patents

フレキシブルデバイスの製造装置及び製造方法 Download PDF

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Publication number
JP6888812B2
JP6888812B2 JP2017084729A JP2017084729A JP6888812B2 JP 6888812 B2 JP6888812 B2 JP 6888812B2 JP 2017084729 A JP2017084729 A JP 2017084729A JP 2017084729 A JP2017084729 A JP 2017084729A JP 6888812 B2 JP6888812 B2 JP 6888812B2
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Prior art keywords
support substrate
flexible
layered structure
vacuum chuck
film
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JP2017084729A
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Japanese (ja)
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JP2018181815A5 (enExample
JP2018181815A (ja
Inventor
木村　滋
滋 木村
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YODOGAWA MEDEC CO., LTD.
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YODOGAWA MEDEC CO., LTD.
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Application filed by YODOGAWA MEDEC CO., LTD. filed Critical YODOGAWA MEDEC CO., LTD.
Priority to JP2017084729A priority Critical patent/JP6888812B2/ja
Priority to TW107112748A priority patent/TWI744517B/zh
Priority to CN201810361332.0A priority patent/CN108735918B/zh
Priority to KR1020180046170A priority patent/KR102499047B1/ko
Publication of JP2018181815A publication Critical patent/JP2018181815A/ja
Publication of JP2018181815A5 publication Critical patent/JP2018181815A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laser Beam Processing (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2017084729A 2017-04-21 2017-04-21 フレキシブルデバイスの製造装置及び製造方法 Active JP6888812B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017084729A JP6888812B2 (ja) 2017-04-21 2017-04-21 フレキシブルデバイスの製造装置及び製造方法
TW107112748A TWI744517B (zh) 2017-04-21 2018-04-13 可撓性元件之製造裝置及製造方法
CN201810361332.0A CN108735918B (zh) 2017-04-21 2018-04-20 柔性器件的制造装置及制造方法
KR1020180046170A KR102499047B1 (ko) 2017-04-21 2018-04-20 플렉시블 디바이스의 제조 장치 및 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017084729A JP6888812B2 (ja) 2017-04-21 2017-04-21 フレキシブルデバイスの製造装置及び製造方法

Publications (3)

Publication Number Publication Date
JP2018181815A JP2018181815A (ja) 2018-11-15
JP2018181815A5 JP2018181815A5 (enExample) 2020-03-12
JP6888812B2 true JP6888812B2 (ja) 2021-06-16

Family

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JP2017084729A Active JP6888812B2 (ja) 2017-04-21 2017-04-21 フレキシブルデバイスの製造装置及び製造方法

Country Status (4)

Country Link
JP (1) JP6888812B2 (enExample)
KR (1) KR102499047B1 (enExample)
CN (1) CN108735918B (enExample)
TW (1) TWI744517B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020129733A1 (ja) * 2018-12-21 2020-06-25 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN112026331B (zh) * 2019-06-03 2022-05-13 万向一二三股份公司 一种泡棉离型纸剥离机构及其剥离方法
CN114334779A (zh) * 2021-12-28 2022-04-12 深圳市华星光电半导体显示技术有限公司 激光剥离设备以及激光剥离方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004306191A (ja) * 2003-04-07 2004-11-04 Seiko Epson Corp テーブル装置、成膜装置、光学素子、半導体素子及び電子機器
KR101149433B1 (ko) 2009-08-28 2012-05-22 삼성모바일디스플레이주식회사 플렉서블 표시 장치 및 그 제조 방법
KR101097344B1 (ko) * 2010-03-09 2011-12-23 삼성모바일디스플레이주식회사 플렉서블 디스플레이 장치의 제조 방법
JP2011233426A (ja) * 2010-04-28 2011-11-17 Tazmo Co Ltd 有機膜の焼成装置及び該装置によって焼成された有機膜を有する有機素子
JP2012069557A (ja) * 2010-09-21 2012-04-05 Covalent Materials Corp ポーラスチャック及びその製造方法
JP2013191746A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 半導体装置の製造方法、半導体製造装置
JP2013251191A (ja) * 2012-06-01 2013-12-12 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子
JP2014048619A (ja) * 2012-09-04 2014-03-17 Panasonic Corp フレキシブルデバイスの製造方法
KR102025704B1 (ko) * 2012-09-14 2019-09-27 삼성디스플레이 주식회사 필름 검사 장치
KR20140062368A (ko) * 2012-11-14 2014-05-23 엘지디스플레이 주식회사 플렉서블 표시장치의 제조방법
KR102158971B1 (ko) * 2013-03-11 2020-09-24 삼성디스플레이 주식회사 기판 박리 장치, 기판 박리 방법 및 플렉서블 표시 장치 제조 방법
KR102113174B1 (ko) * 2013-04-30 2020-05-21 삼성디스플레이 주식회사 플렉시블 디스플레이 장치의 제조방법
KR102135933B1 (ko) * 2013-12-31 2020-07-21 엘지디스플레이 주식회사 플렉서블 유기발광다이오드 표시장치의 제조방법
US9437839B2 (en) * 2014-06-19 2016-09-06 Panasonic Intellectual Property Management Co., Ltd. Method for manufacturing electronic device and electronic device manufactured thereby
JP5954549B2 (ja) * 2014-08-01 2016-07-20 日東電工株式会社 可撓性薄膜構造の表示セルを取り扱う方法

Also Published As

Publication number Publication date
CN108735918A (zh) 2018-11-02
KR102499047B1 (ko) 2023-02-13
TW201843861A (zh) 2018-12-16
KR20180118556A (ko) 2018-10-31
JP2018181815A (ja) 2018-11-15
TWI744517B (zh) 2021-11-01
CN108735918B (zh) 2023-07-28

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