JP6860266B2 - 脆性材料加工液 - Google Patents

脆性材料加工液 Download PDF

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Publication number
JP6860266B2
JP6860266B2 JP2017053529A JP2017053529A JP6860266B2 JP 6860266 B2 JP6860266 B2 JP 6860266B2 JP 2017053529 A JP2017053529 A JP 2017053529A JP 2017053529 A JP2017053529 A JP 2017053529A JP 6860266 B2 JP6860266 B2 JP 6860266B2
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JP
Japan
Prior art keywords
mass
processing liquid
component
brittle material
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017053529A
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English (en)
Japanese (ja)
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JP2018154762A (ja
Inventor
友彦 北村
友彦 北村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
Original Assignee
Idemitsu Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co Ltd filed Critical Idemitsu Kosan Co Ltd
Priority to JP2017053529A priority Critical patent/JP6860266B2/ja
Priority to CN201880018018.0A priority patent/CN110382673B/zh
Priority to PCT/JP2018/010249 priority patent/WO2018169008A1/ja
Priority to TW107109079A priority patent/TWI780130B/zh
Publication of JP2018154762A publication Critical patent/JP2018154762A/ja
Application granted granted Critical
Publication of JP6860266B2 publication Critical patent/JP6860266B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/08—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen
    • C10M105/10—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M105/14—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms polyhydroxy
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M105/00—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound
    • C10M105/08—Lubricating compositions characterised by the base-material being a non-macromolecular organic compound containing oxygen
    • C10M105/18—Ethers, e.g. epoxides
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M129/00—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing oxygen
    • C10M129/02—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing oxygen having a carbon chain of less than 30 atoms
    • C10M129/04—Hydroxy compounds
    • C10M129/06—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M129/08—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least 2 hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M145/00—Lubricating compositions characterised by the additive being a macromolecular compound containing oxygen
    • C10M145/18—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M145/24—Polyethers
    • C10M145/26—Polyoxyalkylenes
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Lubricants (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Detergent Compositions (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2017053529A 2017-03-17 2017-03-17 脆性材料加工液 Active JP6860266B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017053529A JP6860266B2 (ja) 2017-03-17 2017-03-17 脆性材料加工液
CN201880018018.0A CN110382673B (zh) 2017-03-17 2018-03-15 脆性材料加工液
PCT/JP2018/010249 WO2018169008A1 (ja) 2017-03-17 2018-03-15 脆性材料加工液
TW107109079A TWI780130B (zh) 2017-03-17 2018-03-16 脆性材料加工液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017053529A JP6860266B2 (ja) 2017-03-17 2017-03-17 脆性材料加工液

Publications (2)

Publication Number Publication Date
JP2018154762A JP2018154762A (ja) 2018-10-04
JP6860266B2 true JP6860266B2 (ja) 2021-04-14

Family

ID=63522271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017053529A Active JP6860266B2 (ja) 2017-03-17 2017-03-17 脆性材料加工液

Country Status (4)

Country Link
JP (1) JP6860266B2 (zh)
CN (1) CN110382673B (zh)
TW (1) TWI780130B (zh)
WO (1) WO2018169008A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116981759A (zh) * 2021-03-29 2023-10-31 出光兴产株式会社 水性加工液
JP2022157907A (ja) 2021-03-31 2022-10-14 出光興産株式会社 加工液、加工液用組成物及び脆性材料加工液組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002053788A (ja) * 2000-08-09 2002-02-19 Mitsubishi Pencil Co Ltd 水性ボールペン用インキ組成物
JP3807492B2 (ja) * 2001-12-18 2006-08-09 日信化学工業株式会社 インキ吸収剤組成物
KR20130001210A (ko) * 2009-11-12 2013-01-03 팰리스 카가쿠 가부시기가이샤 고정 저립 와이어 톱용 수용성 절단액, 그것을 이용한 잉곳의 절단방법, 그 리사이클 방법 및 절단에 의해서 얻어진 웨이퍼
JP2012201750A (ja) * 2011-03-24 2012-10-22 Nicca Chemical Co Ltd 水性切削加工剤及びそれを用いた固体材料の切削加工方法
JP2014159529A (ja) * 2013-02-20 2014-09-04 Nicca Chemical Co Ltd 固定砥粒ワイヤソー用水溶性加工液及び切削加工方法
JP6204029B2 (ja) * 2013-03-06 2017-09-27 出光興産株式会社 水性加工液
WO2014162945A1 (ja) * 2013-04-05 2014-10-09 パレス化学株式会社 固定砥粒ワイヤーソー用水溶性切断液、それを用いたインゴットの切断方法及びそれによって得られた電子材料用基板

Also Published As

Publication number Publication date
CN110382673A (zh) 2019-10-25
TW201842175A (zh) 2018-12-01
WO2018169008A1 (ja) 2018-09-20
CN110382673B (zh) 2022-05-31
TWI780130B (zh) 2022-10-11
JP2018154762A (ja) 2018-10-04

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