JP6857931B2 - 設置容易な半導体及びlcd製造工程の排気ガス加熱用三重配管加熱装置 - Google Patents
設置容易な半導体及びlcd製造工程の排気ガス加熱用三重配管加熱装置 Download PDFInfo
- Publication number
- JP6857931B2 JP6857931B2 JP2020509403A JP2020509403A JP6857931B2 JP 6857931 B2 JP6857931 B2 JP 6857931B2 JP 2020509403 A JP2020509403 A JP 2020509403A JP 2020509403 A JP2020509403 A JP 2020509403A JP 6857931 B2 JP6857931 B2 JP 6857931B2
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- exhaust gas
- heating
- heat
- inner bellows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010438 heat treatment Methods 0.000 title claims description 75
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 239000004743 Polypropylene Substances 0.000 claims description 12
- -1 polypropylene Polymers 0.000 claims description 12
- 229920001155 polypropylene Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000005856 abnormality Effects 0.000 claims description 4
- 229910021485 fumed silica Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 230000008602 contraction Effects 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 52
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 20
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 7
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 238000013021 overheating Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L53/00—Heating of pipes or pipe systems; Cooling of pipes or pipe systems
- F16L53/30—Heating of pipes or pipe systems
- F16L53/35—Ohmic-resistance heating
- F16L53/38—Ohmic-resistance heating using elongate electric heating elements, e.g. wires or ribbons
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L9/00—Rigid pipes
- F16L9/18—Double-walled pipes; Multi-channel pipes or pipe assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L11/00—Hoses, i.e. flexible pipes
- F16L11/20—Double-walled hoses, i.e. two concentric hoses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L27/00—Adjustable joints, Joints allowing movement
- F16L27/10—Adjustable joints, Joints allowing movement comprising a flexible connection only, e.g. for damping vibrations
- F16L27/107—Adjustable joints, Joints allowing movement comprising a flexible connection only, e.g. for damping vibrations the ends of the pipe being interconnected by a flexible sleeve
- F16L27/11—Adjustable joints, Joints allowing movement comprising a flexible connection only, e.g. for damping vibrations the ends of the pipe being interconnected by a flexible sleeve the sleeve having the form of a bellows with multiple corrugations
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Pipe Accessories (AREA)
- Thermal Insulation (AREA)
- Exhaust Silencers (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
Description
120 内側ベローズ管
130 外側ベローズ管
140 ヒーティング部材
150 センサモジュール
160 ストッパモジュール
Claims (5)
- 半導体及びLCD製造工程の真空ポンプとスクラバーとの間で移送される排気ガスを加熱して排気ガスの固形化を防止する加熱装置であって、
真空ポンプとスクラバーとの間に連結されて排気ガスを内部に流通させ、両端部の一部を除いた残りの部分が伸縮及び屈曲自在にリング状の多数の短管が連続的に結束されてなる連結管と、
前記連結管の両端部を除いた残りの部分の外周面を密着するように包み込む形で設けられ、前記連結管と共に伸縮及び屈曲自在にした内側ベローズ管と、
前記内側ベローズ管の外周面に密着するように設けられ、前記内側ベローズ管を介して前記連結管を加熱するヒーティング部材と、
前記内側ベローズ管を空間を挟んで離間して包み込むと共に外気を遮断して保温雰囲気を作り出し、前記連結管および内側ベローズ管に対応して伸縮及び屈曲自在にした外側ベローズ管と、を備え、
前記ヒーティング部材は、所定幅を有する長く平らな帯状を呈し、前記内側ベローズ管の外周面に螺旋状に巻かれて設けられるとともに、前記ヒーティング部材の側端部が互いに重ならないように離間して巻回されて、前記内側ベローズ管の伸縮及び屈曲の際に干渉されないようになっており、
前記ヒーティング部材は、
電気を供給されて発熱する熱線と、
前記熱線を内包した状態に成形されて、下面が前記内側ベローズ管と接するようにし、
ポリプロピレン樹脂と、前記ポリプロピレン樹脂に対して20〜30重量%の微細カーボン粒子とが混合されてなり、前記熱線から発生した熱をスムーズに放出できるようにした下層部と、
前記下層部の上面及び側面を包み込む逆U字型に成形され、ポリプロピレン樹脂と、前記ポリプロピレン樹脂に対して50〜60重量%の微細水酸化アルミニウム粒子とが混合されてなり、前記熱線から発生する熱が、前記下層部の下面を除いた他の部位に放出されないように遮断する上層部と、
前記下層部と上層部の中間境界面上に微細なヒュームドシリカ粒子からなり、前記熱線から発生する熱が、前記下層部の下面を除いた他の部位に放出されないように、前記上層部と共に二重に遮断する中層部と、を備えてなり、
前記熱線から発生した熱が前記内側ベローズ管を介して前記連結管側を向くように誘導することを特徴とする排気ガス加熱用三重配管加熱装置。 - 前記連結管の、前記内側ベローズ管が包み込まない先端部外周面と後端部外周面とをそれぞれ離間して包み込む形で設けられて内部空間を形成した状態で、前記外側ベローズ管の開放された先端部及び後端部を塞いで密閉する第1ストッパ部材及び第2ストッパ部材をさらに備え、
前記外側ベローズ管の先端部を密閉する第1ストッパ部材の内部には第1温度センサを設けて前記外側ベローズ管の密閉された内部空間の温度を測定できるようにし、制御器は、前記第1温度センサが測定した温度に基づいて前記熱線を制御して適正温度を維持するようにしたことを特徴とする請求項1に記載の排気ガス加熱用三重配管加熱装置。 - 前記第1ストッパ部材を貫通して前記連結管の先端部に連結される連結短管をさらに備え、
前記連結短管の先端部とスクラバー側の配管の連結部位と、前記連結管の後端部と真空ポンプ側の配管の連結部位とを、それぞれ密閉するように包み込んでその内部に小規模の温度測定空間を形成するが、二分割された半本体が左側と右側で結合してなる密閉ボックスと、各密閉ボックスの内部空間の温度を測定する第2温度センサと、をさらに備えて、前記第2温度センサが測定した密閉ボックスの内部空間の温度に基づいて、制御器が熱線の異常有無および排気ガスの漏れ有無を判断できるようにしたことを特徴とする請求項2に記載の排気ガス加熱用三重配管加熱装置。 - 前記連結短管の先端部の連結部位および前記連結管の後端部の連結部位にそれぞれ設けられた密閉ボックスと前記第1ストッパ部材には、漏れた排気ガスを前記スクラバーに案内するための漏洩ガスポートが設けられ、
前記連結管の後端部と真空ポンプ側の配管、前記連結短管の先端部とスクラバー側の配管は、それぞれフランジ結合し、各フランジ結合はリング状のクランプによって行われ、
前記外側ベローズ管の先端部と第1ストッパ部材、前記外側ベローズ管の後端部と第2ストッパ部材は、それぞれフランジ結合し、各フランジ結合は、複数の爪状のクランプによって行われることを特徴とする請求項3に記載の排気ガス加熱用三重配管加熱装置。 - 前記内側ベローズ管は、前記外側ベローズ管の折り畳みよりも小さい折り畳みを有して前記連結管の外周面に密着するようにしたことを特徴と請求項1〜4のいずれか1項に記載の排気ガス加熱用三重配管加熱装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170081339A KR101820821B1 (ko) | 2017-06-27 | 2017-06-27 | 설치가 용이한 반도체 및 lcd 제조공정의 배기가스 가열용 3중 배관 가열장치 |
KR10-2017-0081339 | 2017-06-27 | ||
PCT/KR2018/003617 WO2019004566A1 (ko) | 2017-06-27 | 2018-03-27 | 설치가 용이한 반도체 및 lcd 제조공정의 배기가스 가열용 3중 배관 가열장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020519035A JP2020519035A (ja) | 2020-06-25 |
JP6857931B2 true JP6857931B2 (ja) | 2021-04-14 |
Family
ID=61094730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020509403A Active JP6857931B2 (ja) | 2017-06-27 | 2018-03-27 | 設置容易な半導体及びlcd製造工程の排気ガス加熱用三重配管加熱装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11480285B2 (ja) |
JP (1) | JP6857931B2 (ja) |
KR (1) | KR101820821B1 (ja) |
CN (1) | CN110800094B (ja) |
TW (1) | TWI682478B (ja) |
WO (1) | WO2019004566A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102023117B1 (ko) * | 2018-02-12 | 2019-11-04 | 강태근 | 배관유닛 및 이를 포함하는 히팅 시스템 |
KR102032408B1 (ko) * | 2019-03-14 | 2019-10-15 | 주식회사 유니온기업 | 플렉시블 파이프 및 그가 적용되는 배기 히팅 시스템 |
KR102143515B1 (ko) * | 2019-05-23 | 2020-08-11 | 동주에이피 주식회사 | 반도체 제조설비용 히팅파이프 |
KR102149400B1 (ko) * | 2019-10-10 | 2020-08-31 | 주식회사 유니온기업 | 플렉시블 파이프 및 그의 제조방법 |
KR102310853B1 (ko) * | 2021-06-03 | 2021-10-12 | (주)제이솔루션 | 히터 착탈형 회전유로 관을 구비한 질소가스 가열 공급장치 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4214147A (en) * | 1978-06-19 | 1980-07-22 | Kraver Richard A | Electric heating system for controlling temperature of pipes to prevent freezing and condensation |
US5829483A (en) * | 1992-10-30 | 1998-11-03 | Toyoda Gosei Co., Ltd. | Hose |
JP2746015B2 (ja) * | 1992-10-30 | 1998-04-28 | 豊田合成株式会社 | 燃料ホース |
JPH10199818A (ja) * | 1997-01-13 | 1998-07-31 | Kokusai Electric Co Ltd | 半導体製造装置の排気配管 |
JP4185194B2 (ja) * | 1997-07-31 | 2008-11-26 | コバレントマテリアル株式会社 | カーボンヒータ |
JP2000150387A (ja) * | 1998-11-18 | 2000-05-30 | Applied Materials Inc | 配管系構造及び配管系ユニット |
JP4210395B2 (ja) * | 1999-08-10 | 2009-01-14 | 住友精化株式会社 | ドライエッチング排ガス処理装置 |
CN1257999C (zh) * | 2001-01-09 | 2006-05-31 | 应用材料有限公司 | 基片处理过程中用于消除废白粉的装置 |
DE10319387A1 (de) * | 2003-04-30 | 2004-11-18 | Nexans | Flexible Leitung |
JP2006080291A (ja) * | 2004-09-09 | 2006-03-23 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP4594065B2 (ja) * | 2004-12-21 | 2010-12-08 | ローム株式会社 | 半導体製造プロセスからの排気ガスに含まれるフッ素化合物の処理装置及び処理方法 |
JP5315631B2 (ja) * | 2007-06-13 | 2013-10-16 | 富士通セミコンダクター株式会社 | 半導体製造装置及び半導体装置の製造方法 |
KR101094814B1 (ko) * | 2008-12-31 | 2011-12-16 | 주식회사성심 | 벨로우즈 히터장치 |
KR100958112B1 (ko) * | 2009-09-15 | 2010-05-18 | 박영수 | 배기라인용 히팅 파이프 및 반도체 공정의 배기라인 구조 |
JP4815522B2 (ja) * | 2009-09-30 | 2011-11-16 | 本田技研工業株式会社 | フレキシブルチューブ |
KR101075170B1 (ko) * | 2011-02-01 | 2011-10-19 | 주식회사 에스엠아이 | 반도체 제조공정의 배기라인용 히팅 파이프 |
KR101206535B1 (ko) | 2011-03-08 | 2012-11-30 | (주)제이솔루션 | 혼합유도체를 구비한 질소가스 이젝터장치 |
KR101329785B1 (ko) * | 2012-04-20 | 2013-11-15 | 김태우 | 반도체 공정의 부산물 가스를 배기하는 공정 배기관 |
CN102700120A (zh) * | 2012-05-17 | 2012-10-03 | 谈刚强 | 一种大口径电熔承插式钢带增强螺旋双壁波纹管的承口和插口的制造技术 |
KR101401853B1 (ko) * | 2012-11-07 | 2014-05-29 | 최성귀 | 반도체 제조장치의 히팅 파이프 |
KR101530612B1 (ko) * | 2014-07-15 | 2015-06-22 | 주식회사 에스엠아이 | 히팅 파이프의 온도제어 시스템 |
KR101562643B1 (ko) * | 2014-11-13 | 2015-10-26 | 국제엘렉트릭코리아 주식회사 | 히터 어셈블리 |
-
2017
- 2017-06-27 KR KR1020170081339A patent/KR101820821B1/ko active IP Right Grant
-
2018
- 2018-03-27 JP JP2020509403A patent/JP6857931B2/ja active Active
- 2018-03-27 WO PCT/KR2018/003617 patent/WO2019004566A1/ko active Application Filing
- 2018-03-27 CN CN201880026687.2A patent/CN110800094B/zh active Active
- 2018-03-27 US US16/607,023 patent/US11480285B2/en active Active
- 2018-05-15 TW TW107116473A patent/TWI682478B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN110800094B (zh) | 2023-05-23 |
TWI682478B (zh) | 2020-01-11 |
KR101820821B1 (ko) | 2018-01-22 |
US20200049297A1 (en) | 2020-02-13 |
US11480285B2 (en) | 2022-10-25 |
CN110800094A (zh) | 2020-02-14 |
JP2020519035A (ja) | 2020-06-25 |
TW201911450A (zh) | 2019-03-16 |
WO2019004566A1 (ko) | 2019-01-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6857931B2 (ja) | 設置容易な半導体及びlcd製造工程の排気ガス加熱用三重配管加熱装置 | |
JP6924042B2 (ja) | 排熱回収蒸気発生器の構成部品を加熱するためのシステムおよび方法 | |
JP2023017951A (ja) | 基板処理装置および方法 | |
JP2013160381A (ja) | バルブシステム | |
JPWO2014010262A1 (ja) | 蓄熱式排ガス浄化装置 | |
KR101689307B1 (ko) | 보일러용 배관 연결장치 | |
JP6908114B2 (ja) | 燃料電池システム | |
CN203172712U (zh) | 一种汽车电动助力转向系统用透气装置 | |
WO2020214045A3 (en) | Flexible piping and process for capturing accidental pressurized fluid leaks from a damaged pipe | |
CN102502493B (zh) | 一种适用于co变换装置的热氮气置换系统 | |
KR20140081180A (ko) | 보일러 하이드로 테스트용 유체 가열장치 | |
JP2016014382A (ja) | 排熱回収器 | |
TW201643580A (zh) | 恆溫流體控制裝置及使用方法 | |
CN107246600B (zh) | 一种快速蒸汽发生器 | |
JPS587866B2 (ja) | コウオンコウアツリユウタイヨウベン | |
CN204373792U (zh) | 铠装热电偶的安装装置和温差测量装置 | |
CN108233317A (zh) | 保护套、穿管电缆装置和使用保护套进行封堵的方法 | |
KR101420323B1 (ko) | 반도체 제조설비용 가스박스의 가스누출 차단장치 | |
JP2007198482A (ja) | 高温流体加熱弁 | |
KR101266469B1 (ko) | 배관 실링장치 | |
JPH0464794A (ja) | 管溶接接合部の漏洩防止構造 | |
KR200201178Y1 (ko) | 보일러의 파이프 구조 | |
ITBS20140188A1 (it) | Metodo ed apparato per ridurre la pressione di un carburante gassoso | |
KR101590730B1 (ko) | 이중 배관 마개 구조체 및 이를 이용한 시공 방법 | |
KR20200137530A (ko) | 집열 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191029 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20201119 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201124 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210210 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210302 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210316 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6857931 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |