JP6845781B2 - 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法 - Google Patents

樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法 Download PDF

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Publication number
JP6845781B2
JP6845781B2 JP2017206004A JP2017206004A JP6845781B2 JP 6845781 B2 JP6845781 B2 JP 6845781B2 JP 2017206004 A JP2017206004 A JP 2017206004A JP 2017206004 A JP2017206004 A JP 2017206004A JP 6845781 B2 JP6845781 B2 JP 6845781B2
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JP
Japan
Prior art keywords
platen
resin molded
molded product
mold
resin
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Active
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JP2017206004A
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English (en)
Japanese (ja)
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JP2019077106A (ja
JP2019077106A5 (enrdf_load_stackoverflow
Inventor
秀男 市橋
秀男 市橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
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Towa Corp
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Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2017206004A priority Critical patent/JP6845781B2/ja
Priority to SG10201808664WA priority patent/SG10201808664WA/en
Priority to KR1020180126477A priority patent/KR102209919B1/ko
Priority to CN201811244494.2A priority patent/CN109702944B/zh
Priority to TW107137595A priority patent/TWI736804B/zh
Publication of JP2019077106A publication Critical patent/JP2019077106A/ja
Publication of JP2019077106A5 publication Critical patent/JP2019077106A5/ja
Application granted granted Critical
Publication of JP6845781B2 publication Critical patent/JP6845781B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2017206004A 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法 Active JP6845781B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017206004A JP6845781B2 (ja) 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法
SG10201808664WA SG10201808664WA (en) 2017-10-25 2018-10-02 Resin molded product manufacturing apparatus, resin molding system, and resin molded product manufacturing method
KR1020180126477A KR102209919B1 (ko) 2017-10-25 2018-10-23 수지 성형품의 제조 장치, 수지 성형 시스템, 및 수지 성형품의 제조 방법
CN201811244494.2A CN109702944B (zh) 2017-10-25 2018-10-24 树脂成形品的制造装置及制造方法、以及树脂成形系统
TW107137595A TWI736804B (zh) 2017-10-25 2018-10-24 樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017206004A JP6845781B2 (ja) 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法

Publications (3)

Publication Number Publication Date
JP2019077106A JP2019077106A (ja) 2019-05-23
JP2019077106A5 JP2019077106A5 (enrdf_load_stackoverflow) 2019-12-05
JP6845781B2 true JP6845781B2 (ja) 2021-03-24

Family

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Family Applications (1)

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JP2017206004A Active JP6845781B2 (ja) 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法

Country Status (5)

Country Link
JP (1) JP6845781B2 (enrdf_load_stackoverflow)
KR (1) KR102209919B1 (enrdf_load_stackoverflow)
CN (1) CN109702944B (enrdf_load_stackoverflow)
SG (1) SG10201808664WA (enrdf_load_stackoverflow)
TW (1) TWI736804B (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785896B2 (ja) * 2019-01-28 2020-11-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236038U (enrdf_load_stackoverflow) * 1988-09-02 1990-03-08
JPH0631736A (ja) * 1992-07-14 1994-02-08 Apic Yamada Kk 成形装置
JPH0929747A (ja) * 1995-07-19 1997-02-04 Ricoh Co Ltd 金型断熱装置
JP4625488B2 (ja) * 2007-09-10 2011-02-02 三菱重工プラスチックテクノロジー株式会社 型盤、型締め装置、射出成形機
TW201028274A (en) * 2009-01-22 2010-08-01 Yung Shin Entpr Co Ltd Method for making PVC board
JP6066889B2 (ja) * 2013-11-25 2017-01-25 Ｔｏｗａ株式会社 圧縮成形装置および圧縮成形方法
CN204011392U (zh) * 2014-07-01 2014-12-10 比亚迪股份有限公司 汽车、igbt模块及其底板组件
JP6440599B2 (ja) * 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6012893B1 (ja) * 2016-01-27 2016-10-25 エムテックスマツムラ株式会社 樹脂成形装置

Also Published As

Publication number Publication date
CN109702944B (zh) 2021-05-04
KR102209919B1 (ko) 2021-02-01
TWI736804B (zh) 2021-08-21
CN109702944A (zh) 2019-05-03
JP2019077106A (ja) 2019-05-23
TW201916997A (zh) 2019-05-01
SG10201808664WA (en) 2019-05-30
KR20190046661A (ko) 2019-05-07

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