JP6844621B2 - 塗布液、その製造方法、電子デバイス作製用インク、電子デバイス、有機エレクトロルミネッセンス素子、及び光電変換素子 - Google Patents

塗布液、その製造方法、電子デバイス作製用インク、電子デバイス、有機エレクトロルミネッセンス素子、及び光電変換素子 Download PDF

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JP6844621B2
JP6844621B2 JP2018527474A JP2018527474A JP6844621B2 JP 6844621 B2 JP6844621 B2 JP 6844621B2 JP 2018527474 A JP2018527474 A JP 2018527474A JP 2018527474 A JP2018527474 A JP 2018527474A JP 6844621 B2 JP6844621 B2 JP 6844621B2
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organic
coating liquid
layer
carbon dioxide
compound
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JPWO2018012223A1 (ja
Inventor
北　弘志
弘志 北
田中　達夫
達夫 田中
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Konica Minolta Inc
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Konica Minolta Inc
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Photovoltaic Devices (AREA)
JP2018527474A 2016-07-11 2017-06-21 塗布液、その製造方法、電子デバイス作製用インク、電子デバイス、有機エレクトロルミネッセンス素子、及び光電変換素子 Active JP6844621B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016136499 2016-07-11
JP2016136499 2016-07-11
PCT/JP2017/022768 WO2018012223A1 (ja) 2016-07-11 2017-06-21 塗布液、その製造方法、電子デバイス作製用インク、電子デバイス、有機エレクトロルミネッセンス素子、及び光電変換素子

Publications (2)

Publication Number Publication Date
JPWO2018012223A1 JPWO2018012223A1 (ja) 2019-04-25
JP6844621B2 true JP6844621B2 (ja) 2021-03-17

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JP2018527474A Active JP6844621B2 (ja) 2016-07-11 2017-06-21 塗布液、その製造方法、電子デバイス作製用インク、電子デバイス、有機エレクトロルミネッセンス素子、及び光電変換素子

Country Status (5)

Country Link
JP (1) JP6844621B2 (zh)
KR (1) KR102174806B1 (zh)
CN (1) CN109479355B (zh)
TW (1) TWI700343B (zh)
WO (1) WO2018012223A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022130124A (ja) * 2021-02-25 2022-09-06 キオクシア株式会社 半導体製造装置および半導体装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3221574B2 (ja) * 1991-10-30 2001-10-22 三菱化工機株式会社 超臨界流体クロマト分離方法
CN1962810A (zh) 1998-12-28 2007-05-16 出光兴产株式会社 用于有机场致发光装置的材料
CN1239269C (zh) * 1999-11-26 2006-02-01 旭硝子株式会社 有机材料的制膜方法及装置
AU2002220903A1 (en) * 2000-12-06 2002-06-18 Bushra Al-Duri Patterned deposition using compressed carbon dioxide
US7030168B2 (en) * 2001-12-31 2006-04-18 Advanced Technology Materials, Inc. Supercritical fluid-assisted deposition of materials on semiconductor substrates
JP4389494B2 (ja) * 2003-06-13 2009-12-24 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス材料の精製方法
JP4195411B2 (ja) 2004-04-12 2008-12-10 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置の製造方法
JP5760779B2 (ja) 2010-08-06 2015-08-12 株式会社リコー 発光素子及び表示装置
CN104756273B (zh) * 2012-11-20 2017-10-24 默克专利有限公司 用于制造电子器件的高纯度溶剂中的制剂
KR20150101956A (ko) * 2014-02-27 2015-09-04 주식회사 동진쎄미켐 습식 공정에 의해 형성된 유기 반도체 소자의 정제 방법

Also Published As

Publication number Publication date
TW201815999A (zh) 2018-05-01
JPWO2018012223A1 (ja) 2019-04-25
CN109479355A (zh) 2019-03-15
TWI700343B (zh) 2020-08-01
WO2018012223A1 (ja) 2018-01-18
KR20190016090A (ko) 2019-02-15
KR102174806B1 (ko) 2020-11-05
CN109479355B (zh) 2021-07-16

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