JP6833331B2 - Al-Mg-Si based alloy plate - Google Patents

Description

The present invention relates to an Al—Mg—Si based alloy plate, particularly an Al—Mg—Si based alloy plate having a thickness of less than 0.9 mm, which is excellent in thermal conductivity, conductivity, strength and workability.

Flat-screen TVs, flat-screen monitors for personal computers, laptops, tablet computers, car navigation systems, portable navigation systems, chassis of products such as mobile terminals such as smartphones and mobile phones, metal-based printed boards, heating elements such as inner covers The member material to be built in or mounted is required to have excellent thermal conductivity, strength and workability for quick heat dissipation.

Pure aluminum alloys such as JIS1100, 1050, and 1070 have excellent thermal conductivity, but have low strength. Al-Mg alloys (5000 series alloys) such as JIS5052 used as high-strength materials are significantly inferior in thermal conductivity and conductivity to pure aluminum alloys.

On the other hand, the Al-Mg-Si-based alloy (6000-based alloy) has good thermal conductivity and conductivity, and the strength can be improved by aging curing. Therefore, the Al-Mg-Si-based alloy is used to increase the strength. A method for obtaining an aluminum alloy rolled plate having excellent thermal conductivity and workability is being studied.

For example, Patent Document 1 contains 0.1 to 0.34% by mass of Mg, 0.2 to 0.8% by mass of Si, 0.22 to 1.0% by mass of Cu, and the balance is Al and An Al-Mg-Si alloy composed of unavoidable impurities and having a Si / Mg content ratio of 1.3 or more is semi-continuously cast into an ingot having a thickness of 250 mm or more, and preheated at a temperature of 400 to 540 ° C. A method for producing an Al—Mg—Si alloy rolled plate, which comprises hot rolling, cold rolling at a rolling reduction of 50 to 85%, and then annealing at a temperature of 140 to 280 ° C. It is disclosed.

Patent Document 2 contains Si: 0.2 to 1.5% by mass, Mg: 0.2 to 1.5% by mass, Fe: 0.3% by mass or less, and Mn: 0.02 to 0.02 to It contains one or two kinds of 0.15% by mass and Cr: 0.02 to 0.15%, and the balance is Al and Ti in unavoidable impurities is regulated to 0.2% or less, or to this. An aluminum alloy plate having a composition containing 1 or 2 types of Cu: 0.01 to 1% by mass or rare earth element: 0.01 to 0.2% by mass is produced by continuous casting and rolling, and then cold-rolled. Then, solution treatment at 500 to 570 ° C. is performed, then cold rolling is further performed at a cold rolling rate of 5 to 40%, and after cold rolling, aging treatment is performed in which the material is heated to less than 150 to 190 ° C. A method for producing an aluminum plate having excellent thermal conductivity, strength and bending workability is described.

Patent Document 3 contains Si: 0.2 to 0.8% by mass, Mg: 0.3 to 1% by mass, Fe: 0.5% by mass or less, Cu: 0.5% by mass or less, and further. It contains at least one of Ti: 0.1% by mass or less or B: 0.1% by mass or less, and is composed of the balance Al and unavoidable impurities, or Mn and Cr as impurities are Mn: 0.1% by mass. % Or less, Cr: 0.1% by mass or less is a method for producing an alloy plate, which comprises a step of hot rolling an Al—Mg—Si based alloy ingot and further cold rolling. A method for producing an Al—Mg—Si based alloy plate, which comprises performing a heat treatment by holding at 200 to 400 ° C. for 1 hour or more after the inter-rolling until the end of the cold rolling is shown.

As described in Patent Document 3, in the JIS1000 series to 7000 series aluminum alloys, the thermal conductivity and the conductivity show a good correlation, and the aluminum alloy plate having excellent thermal conductivity has excellent conductivity. Can be used as a conductive member material as well as a heat radiating member material.

Japanese Unexamined Patent Publication No. 2012-62517 Japanese Unexamined Patent Publication No. 2007-9262 Japanese Unexamined Patent Publication No. 2003-321755

As mentioned above, the Al-Mg-Si alloy plate has been improved, but with the improvement of high performance, miniaturization, and thinning of products using aluminum alloy member materials, in addition to high conductivity and workability, it is more than before. While the Al—Mg—Si alloy plate is required to have higher strength, the methods described in Patent Document 1, Patent Document 2 and Patent Document 3 maintain high conductivity and workability. It was difficult to obtain the required strength, and improvement studies on a relatively thin Al-Mg-Si alloy plate were insufficient.

In view of the above-mentioned technical background, an object of the present invention is to provide an Al-Mg-Si based alloy plate having a thickness of less than 0.9 mm, which has high conductivity and good workability and further high strength. To do.

The above problem is solved by the following means.
(1) The chemical composition contains Si: 0.2 to 0.8% by mass, Mg: 0.3 to 1% by mass, Fe: 0.5% by mass or less, and Cu: 0.5% by mass or less. Further, it contains at least one of Ti: 0.1% by mass or less or B: 0.1% by mass or less, is composed of the balance Al and unavoidable impurities, has a tensile strength of 280 MPa or more, and a conductivity of 54% IACS or more. An Al-Mg-Si alloy plate with a thickness of less than 0.9 mm.
(2) The Al—Mg—Si based alloy plate according to item 1 above, wherein Mn, Cr, and Zn as impurities are each regulated to 0.1% by mass or less.
(3) The Al—Mg—Si alloy plate according to item 1 or 2, wherein Ni, V, Ga, Pb, Sn, Bi and Zr as impurities are regulated to 0.05% by mass or less, respectively.
(4) The Al—Mg—Si based alloy plate according to any one of Items 1 to 3 above, wherein Ag as an impurity is regulated to 0.05% by mass or less.
(5) The Al—Mg—Si alloy plate according to any one of the above items 1 to 4, wherein the total content of rare earth elements as impurities is regulated to 0.1% by mass or less.
(6) The Al-Mg according to any one of the above items 1 to 5, wherein the difference (TS-YS) between the tensile strength TS (MPa) and the 0.2% proof stress YS (MPa) is 0 MPa or more and 30 MPa or less. -Si based alloy plate.

According to the invention described in the previous section (1), the chemical composition is Si: 0.2 to 0.8% by mass, Mg: 0.3 to 1% by mass, Fe: 0.5% by mass or less, and Cu: 0. It contains at least 1 type of Ti: 0.1% by mass or less or B: 0.1% by mass or less, and is composed of the balance Al and unavoidable impurities, and has strength, thermal conductivity, and processing. It can be an Al-Mg-Si based alloy plate having excellent properties and a thickness of less than 0.9 mm.

According to the invention described in the previous section (2), since Mn, Cr, and Zn as impurities are each regulated to 0.1% by mass or less, the thickness is excellent in strength, thermal conductivity, and workability. It can be an Al-Mg-Si based alloy plate of less than 0.9 mm.

According to the invention described in the previous section (3), Ni, V, Ga, Pb, Sn, Bi and Zr as impurities are regulated to 0.05% by mass or less, respectively, so that the strength and thermal conductivity are controlled. It can be an Al-Mg-Si based alloy plate with excellent workability.

According to the invention described in the previous section (4), since Ag as an impurity is regulated to 0.05% by mass or less, the Al-Mg-Si alloy plate having excellent strength, thermal conductivity, and workability can be obtained. It can be done.

According to the invention described in the preceding paragraph (5), since the total content of rare earth elements as impurities is regulated to 0.1% by mass or less, the strength, thermal conductivity, and processability are based on Al-Mg-Si. It can be an alloy plate.

According to the invention described in the preceding paragraph (6), the Al-Mg-Si alloy plate having high tensile strength and proof stress can be obtained.

In the method for producing an Al-Mg-Si based alloy plate in which hot rolling and cold rolling are sequentially performed, the inventor of the present application sets the surface temperature of the alloy plate after hot rolling to a predetermined temperature or lower and is hot. By performing heat treatment as an aging treatment after the end of rolling and before the end of cold rolling, an Al-Mg-Si based alloy plate having high conductivity and good workability and higher strength can be obtained. This led to the invention of the present application.

The Al—Mg—Si alloy plate of the present application will be described in detail below.

In the Al—Mg—Si based alloy composition of the present application, the purpose of adding each element and the reason for limiting the content are as follows.

Mg and Si are elements necessary for developing strength, and their respective contents are Si: 0.2% by mass or more and 0.8% by mass or less, and Mg: 0.3% by mass or more and 1% by mass or less. If the Si content is less than 0.2% by mass or the Mg content is less than 0.3% by mass, sufficient strength cannot be obtained. On the other hand, when the Si content exceeds 0.8% by mass and the Mg content exceeds 1% by mass, the rolling load in hot rolling increases, the productivity decreases, and the molding processability of the obtained aluminum alloy plate also increases. become worse. The Si content is preferably 0.2% by mass or more and 0.6% by mass or less, and more preferably 0.32% by mass or more and 0.60% by mass or less. The Mg content is preferably 0.45% by mass or more and 0.9% by mass or less, and more preferably 0.45% by mass or more and 0.55% by mass or less.

Fe and Cu are necessary components for molding, but if they are contained in a large amount, the corrosion resistance is lowered. In the present application, the Fe content and the Cu content are each regulated to 0.5% by mass or less. The Fe content is preferably regulated to 0.35% by mass or less, and more preferably 0.1% by mass or more and 0.25% by mass or less. The Cu content is preferably 0.1% by mass or less.

Ti and B have the effect of refining crystal grains and preventing solidification cracks when the alloy is cast into a slab. The effect is obtained by the addition of at least one of Ti or B, and both may be added. However, if it is contained in a large amount, a large amount of crystallized products having a large size are produced, so that the processability, thermal conductivity and conductivity of the product are lowered. The Ti content is preferably 0.1% by mass or less, more preferably 0.005% by mass or more and 0.05% by mass or less.

The B content is preferably 0.1% by mass or less, and particularly preferably 0.06% by mass or less.

Further, although various impurity elements are inevitably contained in the alloy element, Mn and Cr reduce the conductivity and conductivity, and the amount of Zn is small because the corrosion resistance of the alloy material is lowered as the content is increased. preferable. The content of each of Mn, Cr, and Zn as impurities is preferably 0.1% by mass or less, and more preferably 0.05% by mass or less.

Examples of other impurity elements other than the above include, but are not limited to, Ni, V, Ga, Pb, Sn, Bi, Zr, Ag, rare earths, etc., and among these other impurity elements, rare earths Other than the above, the content of each element is preferably 0.05% by mass or less. Among the above other impurity elements, the rare earth element may contain one or more kinds of elements, or may be derived from a casting raw material contained in the state of mischmetal, but contains the total amount of rare earth elements. The amount is preferably 0.1% by mass or less, and more preferably 0.05% by mass or less.

Next, a processing step for obtaining the Al—Mg—Si based alloy plate specified in the present application will be described.

The dissolution component is adjusted by a conventional method to obtain an Al—Mg—Si based alloy ingot. It is preferable that the obtained alloy ingot is homogenized as a step prior to heating before hot rolling.

The homogenization treatment is preferably performed at 500 ° C. or higher.

The heating before hot rolling is carried out in order to solid-solve the crystals, Mg and Si in the Al—Mg—Si alloy ingot to form a uniform structure, but if the temperature is too high, the part in the ingot is partially heated. It is preferable to carry out the process at 450 ° C. or higher and 580 ° C. or lower, and particularly preferably at 500 ° C. or higher and 580 ° C. or lower.

The Al—Mg—Si alloy ingot may be homogenized and then cooled and preheated before hot rolling, or homogenized and preheated before hot rolling may be continuously performed. In the preferable temperature range of the homogenization treatment and the pre-hot rolling heating, the homogenization treatment and the pre-hot rolling heating may be combined and heated at the same temperature.

After casting, before hot rolling, before heating, it is preferable to face-cut the ingot in order to remove the impurity layer near the surface of the ingot. The face cutting may be performed after casting and before homogenization treatment, or after homogenization treatment and before hot rolling and before heating.

Before hot rolling Hot rolling is performed on the Al—Mg—Si alloy ingot after heating.

Hot rolling consists of rough hot rolling and finishing hot rolling. After performing rough hot rolling consisting of multiple passes using a rough hot rolling machine, a finishing hot rolling machine different from the rough hot rolling machine Is used for finishing hot rolling. In the present application, when the final pass in the rough hot rolling mill is the final pass for hot rolling, the finishing hot rolling can be omitted.

In the present application, finish hot rolling is performed once by introducing an Al-Mg—Si alloy plate from one direction using a rolling mill in which one set of upper and lower work rolls or two or more sets of work rolls are continuously installed. It is carried out with the pass of.

When cold rolling is carried out with a coil, the Al—Mg—Si based alloy plate after finishing hot rolling may be wound by a winding device to form a hot-rolled coil. When the final hot rolling is omitted and the final pass of the rough hot rolling is the final pass of the hot rolling, the Al—Mg—Si alloy plate is wound by a winding device after the rough hot rolling. It may be a hot-rolled coil.

In rough hot rolling, after the state in which Mg and Si are solid-melted is maintained according to the solution heat treatment, the Al-Mg—Si alloy plate is cooled by the rough hot rolling pass, or the rough hot rolling is performed. The effect of quenching can be obtained by the temperature drop after the pass and due to the forced cooling after the pass.

In the present application, among the plurality of passes of rough hot rolling, the surface temperature of the Al—Mg—Si alloy plate immediately before the pass is 350 ° C. or higher and 470 ° C. or lower, and the Al—Mg—Si alloy plate is cooled by the pass, or A pass and a pass in which the average cooling rate by forced cooling after the pass is 50 ° C./min or more is called a control pass. The surface temperature of the Al-Mg-Si alloy plate immediately before the control pass was set to 350 ° C or higher and 470 ° C or lower because the effect of quenching by quenching in rough hot rolling is small below 350 ° C and the temperature is higher than 470 ° C. This is because it is difficult to quench the Al-Mg-Si alloy plate after passing.

The average cooling rate is the Al-Mg—Si alloy from the start to the end of the control path when forced cooling is not performed in the control path, and from the start to the end of forced cooling when forced cooling is performed after the control pass. It shall be the value obtained by dividing the temperature drop (° C) of the plate by the required time (minutes).

The forced cooling after the control pass may be sequentially performed on the rolled portion while rolling the Al—Mg—Si alloy plate, or after rolling the entire Al—Mg—Si alloy plate. May be good. The method of forced cooling is not limited, but water cooling, air cooling, or coolant may be used.

The control pass is preferably performed at least once, and may be performed a plurality of times. When the control path is executed a plurality of times, it is possible to select whether or not to perform forced cooling after the control path for each control path. Immediately before the pass If the surface temperature of the Al-Mg—Si alloy plate is 470 to 350 ° C and the cooling rate is 50 ° C / min or more, the control pass can be performed multiple times, but one control pass is required. By lowering the temperature of the Al—Mg—Si based alloy plate to less than 350 ° C., quenching can be performed efficiently and effectively.

In the present application, when forced cooling is not performed after the final pass of the rough hot rolling, the surface temperature of the Al—Mg—Si based alloy plate immediately after the final pass of the hot rolling is set as the rough hot rolling rising temperature, and the rough hot rolling. When forced cooling is performed after the final pass of rolling, the surface temperature of the Al—Mg—Si based alloy plate immediately after the completion of forced cooling is set as the crude hot rolling rise temperature.

In the present application, when the finish hot rolling is carried out, the finish hot rolling is completed, and when the finish hot rolling is not carried out, the end of the final pass of the rough hot rolling is regarded as the end of the hot rolling, and immediately after the end of the hot rolling. The surface temperature of the Al—Mg—Si based alloy plate is preferably 170 ° C. or lower. An effective quenching effect can be obtained by setting the temperature of the alloy plate immediately after the completion of hot rolling to 170 ° C. or lower, and then age hardening and conductivity are improved by the subsequent heat treatment.

If the surface temperature of the Al-Mg-Si alloy plate immediately after the end of hot rolling is too high, the effect of quenching will be insufficient, and the strength will be improved even if heat treatment is performed after the end of hot rolling and before the end of cold rolling. Is insufficient. The surface temperature of the Al—Mg—Si alloy plate immediately after the completion of hot rolling is more preferably 150 ° C. or lower, and particularly preferably 130 ° C. or lower.

When performing hot rolling after rough hot rolling, the surface temperature of the Al-Mg—Si alloy plate immediately before hot rolling is set in order to obtain the quenching effect due to the pass of hot rolling. It is preferably 280 ° C. or lower.

Similarly, when the final pass of rough hot rolling is not the control pass without finish hot rolling, the surface temperature of the Al—Mg—Si alloy plate immediately before the final pass of rough hot rolling is 280 ° C or lower. preferable.

On the other hand, when the final pass of rough hot rolling is the control pass without performing finish hot rolling, the control pass is the final pass of hot rolling, so the Al-Mg-Si system immediately before the final pass of hot rolling. Control path so that the surface temperature of the alloy plate is 470 to 350 ° C and the surface temperature of the alloy plate is 170 ° C or less at a cooling rate of 50 ° C / min or more by rolling or forced cooling after rolling and rolling. To carry out.

After the completion of hot rolling, the Al—Mg—Si alloy plate before the completion of cold rolling is heat-treated to be age-hardened and the conductivity is improved.

In the present application, the heat treatment of the Al—Mg—Si alloy plate after the completion of hot rolling and before the completion of cold rolling is carried out at a temperature of 120 ° C. or higher and lower than 200 ° C. in order to obtain the effects of age hardening and conductivity improvement. The temperature of the heat treatment is preferably 130 ° C. or higher and 190 ° C. or lower, and more preferably 140 ° C. or higher and 180 ° C. or lower.

The heat treatment time of the Al—Mg—Si alloy plate carried out at a temperature of 120 ° C. or higher and lower than 200 ° C. after the completion of the hot rolling and before the completion of the cold rolling is not particularly limited, but the effects of aging hardening and improvement of conductivity can be obtained. The time may be adjusted at a predetermined temperature so as to be obtained, and for example, the heat treatment may be performed by adjusting the time in the range of 1 to 12 hours.

After the heat treatment, cold rolling is performed to work harden and further improve the strength.

The heat treatment is preferably carried out after the completion of hot rolling and before the start of cold rolling in order to enhance the effect of improving the strength of the age-hardened Al—Mg—Si alloy plate by cold rolling.

After the heat treatment, cold rolling is performed to obtain an Al—Mg—Si based alloy plate having a predetermined thickness. Cold rolling after the heat treatment is preferably carried out at a rolling ratio of 60% or more in order to improve the strength and workability. The rolling ratio of the Al—Mg—Si alloy plate by cold rolling after the heat treatment is more preferably 70% or more, and particularly preferably 80% or more.

If necessary, the Al—Mg—Si alloy plate after cold rolling may be washed.

When the workability of the Al—Mg—Si alloy plate is more important, final annealing may be performed after cold rolling. The final annealing is preferably carried out at 180 ° C. or lower, and more preferably 160 ° C. or lower, particularly 140 ° C. or lower, in order to prevent the strength of the Al—Mg—Si alloy plate from becoming too low.

The final annealing time of the Al—Mg—Si alloy plate carried out at a temperature of 180 ° C. or lower may be adjusted so as to obtain the required workability and strength. For example, the final annealing is performed in the range of 1 to 10 hours. It may be selected according to the temperature.

The Al—Mg—Si alloy plate of the present application may be produced by a coil or a single plate. Further, the alloy plate may be cut in an arbitrary step after cold rolling, and the step after cutting may be performed on a single plate, or slits may be formed depending on the application.

According to the above manufacturing method, the strength can be improved while obtaining high conductivity, and the Al-Mg—Si alloy having a thickness of less than 0.9 mm, which has excellent workability despite its high strength. A board is obtained.

The Al-Mg—Si alloy plate of the present application is defined to have a conductivity of 54% IACS or more and a tensile strength of 280 MPa or more. The tensile strength is preferably 285 MPa or more, and more preferably 290 MPa or more. The difference (TS-YS) between the tensile strength TS (MPa) and the 0.2% proof stress YS (MPa) of the Al-Mg—Si alloy plate of the present application is preferably 0 MPa or more and 30 MPa or less, and TS-YS is Further, it is preferably 0 MPa or more and 20 MPa or less.

Examples and comparative examples of the present invention are shown below.

Aluminum alloy slabs having different chemical compositions shown in Table 1 were obtained by a DC casting method.

[Example 1]
The aluminum alloy slab having the chemical composition No. 1 in Table 1 was face-cut. Next, the alloy slab after face cutting was subjected to a homogenization treatment at 570 ° C. for 3 hours in a heating furnace, and then the temperature was changed in the same furnace to perform hot rolling preheating at 540 ° C. for 4 hours. Before hot rolling After heating, the slab at 540 ° C. was taken out from the heating furnace, and rough hot rolling was started. After the thickness of the alloy plate during rough hot rolling is 25 mm, the final pass of rough hot rolling is carried out from the alloy plate temperature of 451 ° C just before the pass to an average cooling rate of 80 ° C / min. An alloy plate having a rise temperature of 222 ° C. and a thickness of 12 mm was used. In the final pass of rough hot rolling, the alloy plate was moved while rolling, and forced cooling was performed by water cooling by sequentially spraying water on the alloy plate from above and below on the rolled alloy plate portion.

After the rough hot rolling, the alloy plate was subjected to the finish hot rolling from the temperature immediately before the finish hot rolling at 220 ° C. to obtain an alloy plate having a thickness of 7.0 mm. The temperature of the alloy plate immediately after hot rolling was 111 ° C. After the alloy plate after the finish hot rolling was heat-treated at 170 ° C. for 5 hours, cold rolling with a rolling ratio of 98% was carried out to obtain an aluminum alloy plate having a product plate thickness of 0.15 mm.

[Examples 2-42, Comparative Examples 1-6]
The aluminum alloy slabs shown in Table 1 were surface-cut and then treated under the conditions shown in Tables 2 to 6 to obtain an aluminum alloy plate. As in Example 1, in all Examples and Comparative Examples, the homogenization treatment and the pre-hot rolling heating were continuously performed in the same furnace, and the forced cooling after the final pass of the rough hot rolling was performed while rolling. Either water cooling, in which the alloy plate was moved and water was sequentially sprayed onto the alloy plate from above and below on the portion of the rolled alloy plate, or air cooling, in which air cooling was performed after the final pass of rough hot rolling was completed, was selected. In some examples, final annealing was performed after cold rolling.

In Example 15, the final pass of the rough hot rolling was set as the final pass of the hot rolling, and the finishing hot rolling was not carried out.

In Comparative Example 1 and Comparative Example 2, a solution treatment was carried out in which heat treatment was performed at 550 ° C. for 1 minute during cold rolling and then cooling was performed at a speed of 5 ° C./sec or higher. In Comparative Example 1 and Comparative Example 2, the cold rolling ratio is the total rolling ratio of the cold rolling after the solution treatment, and the cold rolling after the solution treatment is based on the thickness of the alloy material after the solution treatment. The cold rolling ratio of the above was 30%.

The tensile strength, 0.2% proof stress, conductivity, and workability of the obtained alloy plate were evaluated by the following methods.

Tensile strength and 0.2% proof stress were measured by a conventional method at room temperature for JIS No. 5 test pieces.

The conductivity was determined as internationally adopted have been annealed standard soft copper (volume resistivity 1.7241 × ^{10 -2} μΩm) relative value when the conductivity was set to 100% IACS of (% IACS).

For workability, the bending angle is 90 °, the thickness of each alloy plate is bent inside radius when the thickness of the alloy plate is 0.4 mm or more, and the bending inside when the thickness of the alloy plate is less than 0.4 mm. A bending test was carried out by the 6.3 V block method of the JIS Z 2248 metal material bending test method with the radius set to 0, and those without cracks were evaluated as ◯, and those with cracks were evaluated as ×.

The evaluation results of tensile strength, 0.2% proof stress, conductivity, and workability are shown in Tables 7 and 8.

The Al—Mg—Si based alloy material described in Examples, which satisfies the chemical composition, tensile strength, and conductivity specified in the present application, has good workability. On the other hand, Comparative Example 1 and Comparative Example 2 in which the solution treatment was carried out during the cold rolling were inferior in the conductivity of the present application, and the chemical composition did not satisfy the specified range of the present application. Comparative Examples 3 to 6 had tensile strength. Alternatively, at least one of the conductivitys is inferior to that of the examples, and some are inferior in processability.

Claims (6)

The chemical composition contains Si: 0.2 to 0.8% by mass, Mg: 0.3 to 1% by mass, Fe: 0.5% by mass or less, Cu: 0.5% by mass or less, and Ti: Cold rolling after completion of hot rolling on an Al—Mg—Si alloy ingot containing at least 0.1% by mass or B: 0.1% by mass or less and consisting of the balance Al and unavoidable impurities. The heat treatment is carried out at 120 ° C. or higher and lower than 200 ° C. before the end, and the cold rolling after the heat treatment is carried out at a rolling reduction of 60% or more. The tensile strength is 280 MPa or more and the conductivity is 54%. A method for producing an Al-Mg-Si based alloy plate having an IACS or more and a thickness of less than 0.9 mm. The Al-Mg-Si-based alloy plate according to claim 1, wherein in the Al-Mg-Si-based alloy ingot, Mn, Cr, and Zn as unavoidable impurities are each regulated to 0.1% by mass or less. Manufacturing method. Claim 1 or claim that Ni, V, Ga, Pb, Sn, Bi, and Zr as unavoidable impurities are regulated to 0.05% by mass or less, respectively, in the Al—Mg—Si alloy ingot. 2. The method for producing an Al-Mg-Si based alloy plate according to 2. The Al-Mg-Si-based ingot according to any one of claims 1 to 3, wherein Ag as an unavoidable impurity is regulated to 0.05% by mass or less in the Al-Mg-Si-based alloy ingot. Manufacturing method of alloy plate. The Al according to any one of claims 1 to 4, wherein the total content of rare earth elements as unavoidable impurities in the Al—Mg—Si alloy ingot is regulated to 0.1% by mass or less. -Mg-Si based alloy plate manufacturing method. Any of claims 1 to 3, wherein the difference (TS-YS) between the tensile strength TS (MPa) and the 0.2% proof stress YS (MPa) of the Al-Mg-Si alloy plate is 0 MPa or more and 30 MPa or less. The method for producing an Al-Mg-Si based alloy plate according to item 1.