JP6831133B2 - ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 - Google Patents

ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 Download PDF

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JP6831133B2
JP6831133B2 JP2019502159A JP2019502159A JP6831133B2 JP 6831133 B2 JP6831133 B2 JP 6831133B2 JP 2019502159 A JP2019502159 A JP 2019502159A JP 2019502159 A JP2019502159 A JP 2019502159A JP 6831133 B2 JP6831133 B2 JP 6831133B2
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filter
energy
injection
substrate
ion
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JP2019522326A5 (enExample
JP2019522326A (ja
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クリッペンドルフ,フロリアン
カサト,コンスタンティン
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エムアイツー‐ファクトリー ジーエムビーエイチ
エムアイツー‐ファクトリー ジーエムビーエイチ
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/05Electron or ion-optical arrangements for separating electrons or ions according to their energy or mass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/02Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diaphragms, collimators
    • G21K1/025Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diaphragms, collimators using multiple collimators, e.g. Bucky screens; other devices for eliminating undesired or dispersed radiation
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21KTECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/10Scattering devices; Absorbing devices; Ionising radiation filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147Arrangements for directing or deflecting the discharge along a desired path
    • H01J37/1472Deflecting along given lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H01J37/3172Maskless patterned ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002Cooling arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/047Changing particle velocity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/047Changing particle velocity
    • H01J2237/0475Changing particle velocity decelerating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/05Arrangements for energy or mass analysis
    • H01J2237/057Energy or mass filtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31701Ion implantation
    • H01J2237/31705Impurity or contaminant control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31701Ion implantation
    • H01J2237/31706Ion implantation characterised by the area treated
    • H01J2237/3171Ion implantation characterised by the area treated patterned
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31701Ion implantation
    • H01J2237/31706Ion implantation characterised by the area treated
    • H01J2237/3171Ion implantation characterised by the area treated patterned
    • H01J2237/31711Ion implantation characterised by the area treated patterned using mask

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Physical Vapour Deposition (AREA)
  • Element Separation (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2019502159A 2016-04-04 2017-04-04 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素 Active JP6831133B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016106119.0A DE102016106119B4 (de) 2016-04-04 2016-04-04 Energiefilterelement für Ionenimplantationsanlagen für den Einsatz in der Produktion von Wafern
DE102016106119.0 2016-04-04
PCT/EP2017/058018 WO2017174597A1 (de) 2016-04-04 2017-04-04 Energiefilterelement für ionenimplantationsanlagen für den einsatz in der produktion von wafern

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JP2021003936A Division JP7134508B2 (ja) 2016-04-04 2021-01-14 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素

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JP2019522326A JP2019522326A (ja) 2019-08-08
JP2019522326A5 JP2019522326A5 (enExample) 2020-09-17
JP6831133B2 true JP6831133B2 (ja) 2021-02-17

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JP2019502159A Active JP6831133B2 (ja) 2016-04-04 2017-04-04 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素
JP2021003936A Active JP7134508B2 (ja) 2016-04-04 2021-01-14 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素
JP2022132936A Active JP7384480B2 (ja) 2016-04-04 2022-08-24 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素
JP2023187393A Active JP7572751B2 (ja) 2016-04-04 2023-11-01 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素
JP2024174677A Pending JP2025000985A (ja) 2016-04-04 2024-10-04 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素

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JP2022132936A Active JP7384480B2 (ja) 2016-04-04 2022-08-24 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素
JP2023187393A Active JP7572751B2 (ja) 2016-04-04 2023-11-01 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素
JP2024174677A Pending JP2025000985A (ja) 2016-04-04 2024-10-04 ウェハの製造に使用されるイオン注入システムのためのエネルギーフィルタ要素

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US (5) US10847338B2 (enExample)
EP (4) EP3440690B1 (enExample)
JP (5) JP6831133B2 (enExample)
CN (2) CN109155228B (enExample)
DE (1) DE102016106119B4 (enExample)
WO (1) WO2017174597A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016106119B4 (de) 2016-04-04 2019-03-07 mi2-factory GmbH Energiefilterelement für Ionenimplantationsanlagen für den Einsatz in der Produktion von Wafern
DE102016122791B3 (de) * 2016-11-25 2018-05-30 mi2-factory GmbH Ionenimplantationsanlage, Filterkammer und Implantationsverfahren unter Einsatz eines Energiefilterelements
US11051390B2 (en) * 2017-03-22 2021-06-29 Japan Atomic Energy Agency Functional membrane for ion beam transmission, beam line device and filter device each having the same, and method of adjusting filter device
US10217654B1 (en) * 2018-02-12 2019-02-26 Varian Semiconductor Equipment Associates, Inc. Embedded features for interlocks using additive manufacturing
DE102018114667B3 (de) 2018-06-19 2019-09-19 Infineon Technologies Ag Ionenstrahl-moderatorvorrichtung, ionenstrahl-implantationsgerät und ionen-implantationsverfahren
DE102019112773B4 (de) 2019-05-15 2023-11-30 mi2-factory GmbH Vorrichtung und Verfahren zur Implantation von Teilchen in ein Substrat
DE102019120623B4 (de) * 2019-07-31 2024-01-25 mi2-factory GmbH Energiefilter zur Verwendung bei der Implantation von Ionen in ein Substrat
LU101808B1 (en) * 2020-05-15 2021-11-15 Mi2 Factory Gmbh An ion implantation device comprising energy filter and additional heating element
LU101807B1 (en) * 2020-05-15 2021-11-15 Mi2 Factory Gmbh Ion implantation device with energy filter having additional thermal energy dissipation surface area
CN111634899B (zh) * 2020-06-14 2022-11-18 南开大学 一种基于金属-有机框架衍生合成碳包覆磷酸钛钾纳米花的制备方法
WO2022128593A1 (en) 2020-12-17 2022-06-23 mi2-factory GmbH Energy filter assembly for ion implantation system with at least one coupling element
US20240038491A1 (en) 2020-12-17 2024-02-01 mi2-factory GmbH Ion implantation device with an energy filter and a support element for overlapping at least part of the energy filter
DE102020134222A1 (de) * 2020-12-18 2022-06-23 mi2-factory GmbH Verfahren zur Herstellung eines vorbehandelten Verbundsubstrats und vorbehandeltes Verbundsubstrat
JP7706038B2 (ja) 2021-02-24 2025-07-11 エムイー2-ファクトリー・ゲーエムベーハー エネルギーフィルタイオン注入(efii)のシミュレーションのためのコンピュータ実装方法
JP7706039B2 (ja) 2021-02-24 2025-07-11 エムイー2-ファクトリー・ゲーエムベーハー イオントンネルを使用するエネルギーフィルタイオン注入(efii)のシミュレーションのためのコンピュータ実装方法
US11569063B2 (en) 2021-04-02 2023-01-31 Applied Materials, Inc. Apparatus, system and method for energy spread ion beam
CN114758730B (zh) * 2022-01-05 2024-08-16 西安理工大学 等离子体活性粒子与绝缘材料表面作用的仿真方法
CN118575248A (zh) * 2022-01-21 2024-08-30 艾克塞利斯科技公司 用于具有专用低溅射率离子束的颗粒控制的高入射角石墨
DE102023103315B4 (de) 2023-02-10 2024-11-28 Ernst-Abbe-Hochschule Jena, Körperschaft des öffentlichen Rechts Messvorrichtung, Ionenimplantationsvorrichtung und Verfahren zur ladungsunabhängigen In-Situ-Dosismessung

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4158141A (en) * 1978-06-21 1979-06-12 Hughes Aircraft Company Process for channeling ion beams
US4278475A (en) 1979-01-04 1981-07-14 Westinghouse Electric Corp. Forming of contoured irradiated regions in materials such as semiconductor bodies by nuclear radiation
GB2078441A (en) * 1980-06-17 1982-01-06 Westinghouse Electric Corp Forming impurity regions in semiconductor bodies by high energy ion irradiation
GB2089499A (en) * 1980-12-15 1982-06-23 Ramsey Eng Co X-ray Radiation Analyser
DE3121666A1 (de) * 1981-05-30 1982-12-16 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren und einrichtung zur gegenseitigen ausrichtung von objekten bei roentgenstrahl- und korpuskularstrahl-belichtungsvorgaengen
KR890017790A (ko) * 1988-05-03 1989-12-18 스탠리 젯.코울 이온 주입량의 측정 방법 및 장치
JPH0718584Y2 (ja) 1988-07-18 1995-05-01 本州製紙株式会社 商品底押出し包装体
JP3187043B2 (ja) * 1990-11-09 2001-07-11 株式会社フジクラ 物理蒸着法による酸化物超電導導体の製造方法
KR100221109B1 (ko) 1992-11-06 1999-09-15 다니구찌 이찌로오 이미지 디스플레이 장치
JP2616423B2 (ja) * 1993-12-14 1997-06-04 日本電気株式会社 イオン注入装置
JPH08220298A (ja) * 1995-02-11 1996-08-30 Nissin High Voltage Co Ltd イオンビーム停止部材
DE19652463C2 (de) 1996-12-17 1999-02-25 Univ Schiller Jena Verfahren und Vorrichtung zur Herstellung dreidimensionaler Mikrostrukturen beliebiger Form
US5972728A (en) * 1997-12-05 1999-10-26 Advanced Micro Devices, Inc. Ion implantation feedback monitor using reverse process simulation tool
US6335534B1 (en) 1998-04-17 2002-01-01 Kabushiki Kaisha Toshiba Ion implantation apparatus, ion generating apparatus and semiconductor manufacturing method with ion implantation processes
US6294862B1 (en) * 1998-05-19 2001-09-25 Eaton Corporation Multi-cusp ion source
US6136164A (en) * 1998-07-15 2000-10-24 United Microelectronics Corp. Apparatus for detecting position of collimator in sputtering processing chamber
JP2000306541A (ja) * 1999-04-16 2000-11-02 Nippon Steel Corp イオン注入装置におけるウェーハ温度検出装置
US6639227B1 (en) * 2000-10-18 2003-10-28 Applied Materials, Inc. Apparatus and method for charged particle filtering and ion implantation
DE10201868C1 (de) * 2002-01-18 2003-07-17 Siemens Ag Röntgeneinrichtung
JP4072359B2 (ja) * 2002-02-28 2008-04-09 株式会社日立製作所 荷電粒子ビーム照射装置
DE10239312B4 (de) 2002-08-27 2006-08-17 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauelements mit einer Driftzone und einer Feldstoppzone und Halbleiterbauelement mit einer Driftzone und einer Feldstoppzone
EP1616224B1 (en) 2003-04-24 2007-07-11 Haute Ecole Arc NE-BE-JU Micromachining process
US20060043316A1 (en) * 2003-06-10 2006-03-02 Varian Semiconductor Equipment Associates, Inc. Ion implanter having enhanced low energy ion beam transport
JP2005061663A (ja) * 2003-08-08 2005-03-10 Takata Corp イニシエータ、イニシエータ用着火薬、イニシエータの起動方法及びガス発生器
WO2005078758A1 (en) * 2004-02-18 2005-08-25 Waseda University Ion implantation method and ion implantation apparatus
DE102005061663B4 (de) * 2005-12-22 2008-07-17 RUHR-UNIVERSITäT BOCHUM Ionenimplantationsvorrichtung
US7619229B2 (en) * 2006-10-16 2009-11-17 Varian Semiconductor Equipment Associates, Inc. Technique for matching performance of ion implantation devices using an in-situ mask
US7960708B2 (en) * 2007-03-13 2011-06-14 University Of Houston Device and method for manufacturing a particulate filter with regularly spaced micropores
US8531814B2 (en) 2009-04-16 2013-09-10 Varian Semiconductor Equipment Associates, Inc. Removal of charge between a substrate and an electrostatic clamp
US8461556B2 (en) * 2010-09-08 2013-06-11 Varian Semiconductor Equipment Associates, Inc. Using beam blockers to perform a patterned implant of a workpiece
JP5909654B2 (ja) * 2010-09-24 2016-04-27 パナソニックIpマネジメント株式会社 フィルターデバイス
US8440578B2 (en) * 2011-03-28 2013-05-14 Tel Epion Inc. GCIB process for reducing interfacial roughness following pre-amorphization
DE102011075350A1 (de) 2011-05-05 2012-11-08 Fachhochschule Jena Energiefilteranordnung für Ionenimplantationsanlagen
CN103777227B (zh) * 2012-10-18 2016-06-08 上海原子科兴药业有限公司 一种回旋加速器束流测量装置
JP6253362B2 (ja) * 2013-11-21 2017-12-27 住友重機械イオンテクノロジー株式会社 高エネルギーイオン注入装置、ビーム電流調整装置、及びビーム電流調整方法
JP6207418B2 (ja) * 2014-02-10 2017-10-04 住友重機械イオンテクノロジー株式会社 高エネルギーイオン注入装置、ビーム平行化器、及びビーム平行化方法
US9685298B1 (en) * 2016-02-01 2017-06-20 Varian Semiconductor Equipment Associates, Inc. Apparatus and method for contamination control in ion beam apparatus
DE102016106119B4 (de) * 2016-04-04 2019-03-07 mi2-factory GmbH Energiefilterelement für Ionenimplantationsanlagen für den Einsatz in der Produktion von Wafern
DE102016110429A1 (de) * 2016-06-06 2017-12-07 Infineon Technologies Ag Energiefilter zum Verarbeiten einer Leistungshalbleitervorrichtung
US20240038491A1 (en) * 2020-12-17 2024-02-01 mi2-factory GmbH Ion implantation device with an energy filter and a support element for overlapping at least part of the energy filter

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CN109155228A (zh) 2019-01-04
US20190122850A1 (en) 2019-04-25
EP4546375A3 (de) 2025-08-13
US20220020556A1 (en) 2022-01-20
WO2017174597A1 (de) 2017-10-12
EP3926658A3 (de) 2022-05-11
US11837430B2 (en) 2023-12-05
EP4553855A2 (de) 2025-05-14
JP2023181414A (ja) 2023-12-21
JP2022174091A (ja) 2022-11-22
CN113035676A (zh) 2021-06-25
JP2021073647A (ja) 2021-05-13
US11183358B2 (en) 2021-11-23
EP3440690A1 (de) 2019-02-13
CN109155228B (zh) 2021-10-01
US20210027975A1 (en) 2021-01-28
US10847338B2 (en) 2020-11-24
CN113035676B (zh) 2025-02-11
JP2025000985A (ja) 2025-01-07
JP7572751B2 (ja) 2024-10-24
EP3926658A2 (de) 2021-12-22
EP4553855A3 (de) 2025-08-27
JP7134508B2 (ja) 2022-09-12
EP4546375A2 (de) 2025-04-30
DE102016106119A1 (de) 2017-10-05
US12080510B2 (en) 2024-09-03
US20240055217A1 (en) 2024-02-15
EP3440690B1 (de) 2021-08-11
JP7384480B2 (ja) 2023-11-21
DE102016106119B4 (de) 2019-03-07
JP2019522326A (ja) 2019-08-08
EP3926658B1 (de) 2025-06-04
US20250014854A1 (en) 2025-01-09
EP3926658C0 (de) 2025-06-04

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