JP6824773B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP6824773B2
JP6824773B2 JP2017028722A JP2017028722A JP6824773B2 JP 6824773 B2 JP6824773 B2 JP 6824773B2 JP 2017028722 A JP2017028722 A JP 2017028722A JP 2017028722 A JP2017028722 A JP 2017028722A JP 6824773 B2 JP6824773 B2 JP 6824773B2
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JP
Japan
Prior art keywords
substrate
guard
exhaust port
side wall
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017028722A
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English (en)
Japanese (ja)
Other versions
JP2018137263A (ja
Inventor
周武 墨
周武 墨
亨 遠藤
亨 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017028722A priority Critical patent/JP6824773B2/ja
Priority to TW106143193A priority patent/TWI659485B/zh
Priority to KR1020180006450A priority patent/KR102103064B1/ko
Priority to CN201810141286.3A priority patent/CN108461423B/zh
Publication of JP2018137263A publication Critical patent/JP2018137263A/ja
Application granted granted Critical
Publication of JP6824773B2 publication Critical patent/JP6824773B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017028722A 2017-02-20 2017-02-20 基板処理装置および基板処理方法 Active JP6824773B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017028722A JP6824773B2 (ja) 2017-02-20 2017-02-20 基板処理装置および基板処理方法
TW106143193A TWI659485B (zh) 2017-02-20 2017-12-08 基板處理裝置以及基板處理方法
KR1020180006450A KR102103064B1 (ko) 2017-02-20 2018-01-18 기판 처리 장치 및 기판 처리 방법
CN201810141286.3A CN108461423B (zh) 2017-02-20 2018-02-11 基板处理装置和基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017028722A JP6824773B2 (ja) 2017-02-20 2017-02-20 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JP2018137263A JP2018137263A (ja) 2018-08-30
JP6824773B2 true JP6824773B2 (ja) 2021-02-03

Family

ID=63238819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017028722A Active JP6824773B2 (ja) 2017-02-20 2017-02-20 基板処理装置および基板処理方法

Country Status (4)

Country Link
JP (1) JP6824773B2 (ko)
KR (1) KR102103064B1 (ko)
CN (1) CN108461423B (ko)
TW (1) TWI659485B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102635385B1 (ko) * 2020-11-23 2024-02-14 세메스 주식회사 기판 처리 장치
KR102635384B1 (ko) * 2020-11-23 2024-02-14 세메스 주식회사 기판 처리 장치
KR102624576B1 (ko) * 2020-11-23 2024-01-16 세메스 주식회사 기판 처리 장치
KR102573602B1 (ko) * 2020-11-23 2023-09-01 세메스 주식회사 기판 처리 장치
JP2022143191A (ja) * 2021-03-17 2022-10-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990928A (ja) * 1982-11-16 1984-05-25 Dainippon Screen Mfg Co Ltd 回転式表面処理装置
JP4358410B2 (ja) * 2000-06-30 2009-11-04 芝浦メカトロニクス株式会社 スピン処理装置
KR101062253B1 (ko) * 2006-06-16 2011-09-06 도쿄엘렉트론가부시키가이샤 액 처리 장치
JP4803592B2 (ja) * 2006-06-16 2011-10-26 東京エレクトロン株式会社 液処理装置および液処理方法
JP5503435B2 (ja) * 2010-07-02 2014-05-28 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体
JP5596071B2 (ja) * 2012-03-09 2014-09-24 東京エレクトロン株式会社 液処理装置
JP5951444B2 (ja) * 2012-10-25 2016-07-13 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR20140085726A (ko) * 2012-12-27 2014-07-08 세메스 주식회사 기판 처리 장치
JP5909218B2 (ja) * 2013-09-13 2016-04-26 東京エレクトロン株式会社 基板液処理装置

Also Published As

Publication number Publication date
CN108461423B (zh) 2022-03-22
JP2018137263A (ja) 2018-08-30
KR20180096504A (ko) 2018-08-29
KR102103064B1 (ko) 2020-04-21
TW201832307A (zh) 2018-09-01
TWI659485B (zh) 2019-05-11
CN108461423A (zh) 2018-08-28

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