JP6818973B2 - 半田処理装置 - Google Patents
半田処理装置 Download PDFInfo
- Publication number
- JP6818973B2 JP6818973B2 JP2016241323A JP2016241323A JP6818973B2 JP 6818973 B2 JP6818973 B2 JP 6818973B2 JP 2016241323 A JP2016241323 A JP 2016241323A JP 2016241323 A JP2016241323 A JP 2016241323A JP 6818973 B2 JP6818973 B2 JP 6818973B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- hole
- tip
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 claims description 158
- 238000005476 soldering Methods 0.000 claims description 74
- 239000012530 fluid Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 description 44
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 229910001873 dinitrogen Inorganic materials 0.000 description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 229910052742 iron Inorganic materials 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 238000009736 wetting Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000000155 melt Substances 0.000 description 4
- 101000680096 Homo sapiens Transmembrane emp24 domain-containing protein 1 Proteins 0.000 description 3
- 102100022243 Transmembrane emp24 domain-containing protein 1 Human genes 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 235000000396 iron Nutrition 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016241323A JP6818973B2 (ja) | 2016-12-13 | 2016-12-13 | 半田処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016241323A JP6818973B2 (ja) | 2016-12-13 | 2016-12-13 | 半田処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018094595A JP2018094595A (ja) | 2018-06-21 |
| JP2018094595A5 JP2018094595A5 (enExample) | 2019-11-28 |
| JP6818973B2 true JP6818973B2 (ja) | 2021-01-27 |
Family
ID=62634176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016241323A Active JP6818973B2 (ja) | 2016-12-13 | 2016-12-13 | 半田処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6818973B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020006405A (ja) * | 2018-07-09 | 2020-01-16 | 株式会社パラット | 半田付け装置および半田付け方法 |
-
2016
- 2016-12-13 JP JP2016241323A patent/JP6818973B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018094595A (ja) | 2018-06-21 |
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