JP6817167B2 - 耐湿性チップスケールパッケージ発光素子 - Google Patents

耐湿性チップスケールパッケージ発光素子 Download PDF

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Publication number
JP6817167B2
JP6817167B2 JP2017151954A JP2017151954A JP6817167B2 JP 6817167 B2 JP6817167 B2 JP 6817167B2 JP 2017151954 A JP2017151954 A JP 2017151954A JP 2017151954 A JP2017151954 A JP 2017151954A JP 6817167 B2 JP6817167 B2 JP 6817167B2
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layer
photoluminescent
light emitting
moisture
polymer matrix
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Japanese (ja)
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JP2018056552A (ja
JP2018056552A5 (enrdf_load_stackoverflow
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チェン チェー
チェン チェー
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Maven Optronics Co Ltd
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Maven Optronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

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JP2017151954A 2016-08-05 2017-08-04 耐湿性チップスケールパッケージ発光素子 Active JP6817167B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105124965 2016-08-05
TW105124965A TWI599078B (zh) 2016-08-05 2016-08-05 具濕氣阻隔結構之晶片級封裝發光裝置

Related Child Applications (1)

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JP2020174343A Division JP7100383B2 (ja) 2016-08-05 2020-10-16 耐湿性チップスケールパッケージ発光素子

Publications (3)

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JP2018056552A JP2018056552A (ja) 2018-04-05
JP2018056552A5 JP2018056552A5 (enrdf_load_stackoverflow) 2019-03-28
JP6817167B2 true JP6817167B2 (ja) 2021-01-20

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JP2017151954A Active JP6817167B2 (ja) 2016-08-05 2017-08-04 耐湿性チップスケールパッケージ発光素子
JP2020174343A Active JP7100383B2 (ja) 2016-08-05 2020-10-16 耐湿性チップスケールパッケージ発光素子

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JP (2) JP6817167B2 (enrdf_load_stackoverflow)
KR (1) KR101942042B1 (enrdf_load_stackoverflow)
TW (1) TWI599078B (enrdf_load_stackoverflow)

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US11335842B2 (en) 2018-02-14 2022-05-17 Maven Optronics Co., Ltd. Chip-scale packaging light-emitting device with electrode polarity identifier and method of manufacturing the same
KR102555238B1 (ko) 2018-09-13 2023-07-14 주식회사 루멘스 퀀텀닷 엘이디 패키지 및 이를 포함하는 퀀텀닷 엘이디 모듈
JP7054005B2 (ja) 2018-09-28 2022-04-13 日亜化学工業株式会社 発光装置
JP6940776B2 (ja) 2018-11-05 2021-09-29 日亜化学工業株式会社 発光装置及びその製造方法
CN113841238A (zh) 2019-03-18 2021-12-24 英特曼帝克司公司 Led灯丝
EP3942620A1 (en) * 2019-03-18 2022-01-26 Intematix Corporation Packaged white light emitting device comprising photoluminescence layered structure
US11781714B2 (en) 2019-03-18 2023-10-10 Bridgelux, Inc. LED-filaments and LED-filament lamps
KR102140993B1 (ko) * 2019-04-01 2020-08-05 (주)라이타이저 발광다이오드 칩 스케일 패키지 및 그의 제조 방법
US12317543B2 (en) 2019-04-25 2025-05-27 Applied Materials, Inc. Moisture barrier film having low refraction index and low water vapor transmission rate
KR102677646B1 (ko) * 2019-05-22 2024-06-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자패키지 및 광원장치
JP6864875B2 (ja) 2019-08-30 2021-04-28 日亜化学工業株式会社 発光モジュール及びその製造方法

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JP2007317787A (ja) * 2006-05-24 2007-12-06 Citizen Electronics Co Ltd 発光装置およびその製造方法
US8947619B2 (en) * 2006-07-06 2015-02-03 Intematix Corporation Photoluminescence color display comprising quantum dots material and a wavelength selective filter that allows passage of excitation radiation and prevents passage of light generated by photoluminescence materials
JP2008066462A (ja) * 2006-09-06 2008-03-21 Fujikura Ltd イルミネーションランプ及びイルミネーションランプユニット
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JP5521325B2 (ja) * 2008-12-27 2014-06-11 日亜化学工業株式会社 発光装置及びその製造方法
JPWO2010123059A1 (ja) * 2009-04-22 2012-10-25 シーシーエス株式会社 Ｌｅｄ発光デバイスの製造方法
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KR101265094B1 (ko) * 2011-08-09 2013-05-16 한국과학기술연구원 백색 발광 다이오드 및 그 제조 방법
JP2013172041A (ja) * 2012-02-22 2013-09-02 Sharp Corp 発光装置
JP2015516691A (ja) * 2012-05-14 2015-06-11 コーニンクレッカ フィリップス エヌ ヴェ ナノ構造蛍光体を有する発光装置
JP6272638B2 (ja) * 2012-07-27 2018-01-31 株式会社カネカ 光半導体装置
JP2014216622A (ja) * 2013-04-30 2014-11-17 日亜化学工業株式会社 発光装置の製造方法
US9484504B2 (en) * 2013-05-14 2016-11-01 Apple Inc. Micro LED with wavelength conversion layer
KR102323289B1 (ko) * 2014-01-07 2021-11-08 루미리즈 홀딩 비.브이. 인광체 변환기를 갖는 비접착식 발광 디바이스
US9660151B2 (en) * 2014-05-21 2017-05-23 Nichia Corporation Method for manufacturing light emitting device
JP6303805B2 (ja) * 2014-05-21 2018-04-04 日亜化学工業株式会社 発光装置及びその製造方法
JP6582382B2 (ja) * 2014-09-26 2019-10-02 日亜化学工業株式会社 発光装置の製造方法
TWI543394B (zh) * 2014-12-05 2016-07-21 Electroluminescence and Photoluminescence Multiband White Light Emitting Diodes
KR102353095B1 (ko) * 2014-12-26 2022-01-19 엔에스 마테리얼스 아이엔씨. 파장 변환 부재 및 그 제조 방법
US9620686B2 (en) * 2015-01-28 2017-04-11 Apple Inc. Display light sources with quantum dots

Also Published As

Publication number Publication date
KR101942042B1 (ko) 2019-01-25
JP2018056552A (ja) 2018-04-05
TW201806189A (zh) 2018-02-16
TWI599078B (zh) 2017-09-11
JP2021044554A (ja) 2021-03-18
JP7100383B2 (ja) 2022-07-13

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