TWI599078B - 具濕氣阻隔結構之晶片級封裝發光裝置 - Google Patents
具濕氣阻隔結構之晶片級封裝發光裝置 Download PDFInfo
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- TWI599078B TWI599078B TW105124965A TW105124965A TWI599078B TW I599078 B TWI599078 B TW I599078B TW 105124965 A TW105124965 A TW 105124965A TW 105124965 A TW105124965 A TW 105124965A TW I599078 B TWI599078 B TW I599078B
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- photoluminescent
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Led Device Packages (AREA)
- Optical Filters (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105124965A TWI599078B (zh) | 2016-08-05 | 2016-08-05 | 具濕氣阻隔結構之晶片級封裝發光裝置 |
| US15/665,280 US10230027B2 (en) | 2016-08-05 | 2017-07-31 | Moisture-resistant chip scale packaging light-emitting device |
| EP17183965.7A EP3279952A1 (en) | 2016-08-05 | 2017-07-31 | Moisture-resistant chip scale packaging light-emitting device |
| KR1020170097665A KR101942042B1 (ko) | 2016-08-05 | 2017-08-01 | 내습성 칩 스케일 패키징 발광 디바이스 |
| JP2017151954A JP6817167B2 (ja) | 2016-08-05 | 2017-08-04 | 耐湿性チップスケールパッケージ発光素子 |
| JP2020174343A JP7100383B2 (ja) | 2016-08-05 | 2020-10-16 | 耐湿性チップスケールパッケージ発光素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105124965A TWI599078B (zh) | 2016-08-05 | 2016-08-05 | 具濕氣阻隔結構之晶片級封裝發光裝置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI599078B true TWI599078B (zh) | 2017-09-11 |
| TW201806189A TW201806189A (zh) | 2018-02-16 |
Family
ID=60719661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105124965A TWI599078B (zh) | 2016-08-05 | 2016-08-05 | 具濕氣阻隔結構之晶片級封裝發光裝置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP6817167B2 (enrdf_load_stackoverflow) |
| KR (1) | KR101942042B1 (enrdf_load_stackoverflow) |
| TW (1) | TWI599078B (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI659550B (zh) * | 2018-02-14 | 2019-05-11 | 行家光電股份有限公司 | 具電極辨識之晶片級封裝發光裝置及其製造方法 |
| US11335842B2 (en) | 2018-02-14 | 2022-05-17 | Maven Optronics Co., Ltd. | Chip-scale packaging light-emitting device with electrode polarity identifier and method of manufacturing the same |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102555238B1 (ko) * | 2018-09-13 | 2023-07-14 | 주식회사 루멘스 | 퀀텀닷 엘이디 패키지 및 이를 포함하는 퀀텀닷 엘이디 모듈 |
| JP7054005B2 (ja) | 2018-09-28 | 2022-04-13 | 日亜化学工業株式会社 | 発光装置 |
| JP6940776B2 (ja) | 2018-11-05 | 2021-09-29 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| US11781714B2 (en) | 2019-03-18 | 2023-10-10 | Bridgelux, Inc. | LED-filaments and LED-filament lamps |
| EP3942607A1 (en) | 2019-03-18 | 2022-01-26 | Intematix Corporation | Led-filament |
| CN113826225A (zh) * | 2019-03-18 | 2021-12-21 | 英特曼帝克司公司 | 包括光致发光层状结构的封装白色发光装置 |
| KR102140993B1 (ko) * | 2019-04-01 | 2020-08-05 | (주)라이타이저 | 발광다이오드 칩 스케일 패키지 및 그의 제조 방법 |
| KR102766447B1 (ko) * | 2019-04-25 | 2025-02-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 낮은 굴절률 및 낮은 수증기 투과율을 갖는 수분 배리어 막 |
| KR102677646B1 (ko) * | 2019-05-22 | 2024-06-25 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자패키지 및 광원장치 |
| JP6864875B2 (ja) * | 2019-08-30 | 2021-04-28 | 日亜化学工業株式会社 | 発光モジュール及びその製造方法 |
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| TW201027807A (en) * | 2008-11-13 | 2010-07-16 | Maven Optronics Corp | System and method for forming a thin-film phosphor layer for phosphor-converted light emitting devices |
| TW201341899A (zh) * | 2012-02-23 | 2013-10-16 | Intematix Corp | 光致發光彩色顯示器 |
| TW201622171A (zh) * | 2014-12-05 | 2016-06-16 | High Power Optoelectronics Inc | 電致光與光致光多波段白光發光二極體 |
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| JP2007317787A (ja) * | 2006-05-24 | 2007-12-06 | Citizen Electronics Co Ltd | 発光装置およびその製造方法 |
| JP2008066462A (ja) * | 2006-09-06 | 2008-03-21 | Fujikura Ltd | イルミネーションランプ及びイルミネーションランプユニット |
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2016
- 2016-08-05 TW TW105124965A patent/TWI599078B/zh active
-
2017
- 2017-08-01 KR KR1020170097665A patent/KR101942042B1/ko active Active
- 2017-08-04 JP JP2017151954A patent/JP6817167B2/ja active Active
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2020
- 2020-10-16 JP JP2020174343A patent/JP7100383B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200524193A (en) * | 2003-12-02 | 2005-07-16 | Koninkl Philips Electronics Nv | Electroluminescent device |
| TW201022399A (en) * | 2008-09-16 | 2010-06-16 | Koninkl Philips Electronics Nv | Polymeric wavelength converting elements |
| TW201027807A (en) * | 2008-11-13 | 2010-07-16 | Maven Optronics Corp | System and method for forming a thin-film phosphor layer for phosphor-converted light emitting devices |
| TW201341899A (zh) * | 2012-02-23 | 2013-10-16 | Intematix Corp | 光致發光彩色顯示器 |
| TW201622171A (zh) * | 2014-12-05 | 2016-06-16 | High Power Optoelectronics Inc | 電致光與光致光多波段白光發光二極體 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI659550B (zh) * | 2018-02-14 | 2019-05-11 | 行家光電股份有限公司 | 具電極辨識之晶片級封裝發光裝置及其製造方法 |
| US11335842B2 (en) | 2018-02-14 | 2022-05-17 | Maven Optronics Co., Ltd. | Chip-scale packaging light-emitting device with electrode polarity identifier and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6817167B2 (ja) | 2021-01-20 |
| JP2018056552A (ja) | 2018-04-05 |
| KR101942042B1 (ko) | 2019-01-25 |
| TW201806189A (zh) | 2018-02-16 |
| JP2021044554A (ja) | 2021-03-18 |
| JP7100383B2 (ja) | 2022-07-13 |
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