JP6806093B2 - 黒化めっき液、導電性基板の製造方法 - Google Patents

黒化めっき液、導電性基板の製造方法 Download PDF

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Publication number
JP6806093B2
JP6806093B2 JP2017564216A JP2017564216A JP6806093B2 JP 6806093 B2 JP6806093 B2 JP 6806093B2 JP 2017564216 A JP2017564216 A JP 2017564216A JP 2017564216 A JP2017564216 A JP 2017564216A JP 6806093 B2 JP6806093 B2 JP 6806093B2
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Prior art keywords
layer
copper
blackening
conductive substrate
plating solution
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Japanese (ja)
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JPWO2017130866A1 (ja
Inventor
下地 匠
匠 下地
志賀 大樹
大樹 志賀
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/562Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
JP2017564216A 2016-01-29 2017-01-20 黒化めっき液、導電性基板の製造方法 Active JP6806093B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016016592 2016-01-29
JP2016016592 2016-01-29
PCT/JP2017/001987 WO2017130866A1 (ja) 2016-01-29 2017-01-20 黒化めっき液、導電性基板の製造方法

Publications (2)

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JPWO2017130866A1 JPWO2017130866A1 (ja) 2018-11-29
JP6806093B2 true JP6806093B2 (ja) 2021-01-06

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JP2017564216A Active JP6806093B2 (ja) 2016-01-29 2017-01-20 黒化めっき液、導電性基板の製造方法

Country Status (5)

Country Link
JP (1) JP6806093B2 (zh)
KR (1) KR102611763B1 (zh)
CN (1) CN108603301A (zh)
TW (1) TWI791427B (zh)
WO (1) WO2017130866A1 (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61163289A (ja) * 1985-01-14 1986-07-23 Nippon Kagaku Sangyo Kk ニツケル及びニツケル合金による黒色電気めつき浴
JPH0368795A (ja) * 1989-08-07 1991-03-25 K D K Kk 印刷回路用銅箔の製造方法
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
TWI236023B (en) * 2003-04-18 2005-07-11 Dainippon Printing Co Ltd Electromagnetic shielding sheet, front plate for display, and method for producing electromagnetic shielding sheet
JP5588597B2 (ja) * 2007-03-23 2014-09-10 富士フイルム株式会社 導電性材料の製造方法及び製造装置
TWI580822B (zh) * 2012-04-19 2017-05-01 迪普索股份有限公司 銅-鎳合金電鍍浴及電鍍方法
CN103345337B (zh) * 2013-07-15 2016-08-17 深圳南玻显示器件科技有限公司 柔性触摸屏及其制作方法
KR101416438B1 (ko) * 2013-12-17 2014-07-10 와이엠티 주식회사 메탈 메쉬, 이를 이용한 터치 스크린 센서 및 이의 제조방법
JP2015151594A (ja) * 2014-02-17 2015-08-24 住友金属鉱山株式会社 細線パターンの形成方法、及び導電性基板の製造方法

Also Published As

Publication number Publication date
JPWO2017130866A1 (ja) 2018-11-29
KR102611763B1 (ko) 2023-12-07
KR20180103072A (ko) 2018-09-18
TW201739966A (zh) 2017-11-16
WO2017130866A1 (ja) 2017-08-03
CN108603301A (zh) 2018-09-28
TWI791427B (zh) 2023-02-11

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