JP6798728B2 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
- Publication number
- JP6798728B2 JP6798728B2 JP2019521921A JP2019521921A JP6798728B2 JP 6798728 B2 JP6798728 B2 JP 6798728B2 JP 2019521921 A JP2019521921 A JP 2019521921A JP 2019521921 A JP2019521921 A JP 2019521921A JP 6798728 B2 JP6798728 B2 JP 6798728B2
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- Prior art keywords
- ram
- interposer
- semiconductor module
- unit
- pair
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- 238000004519 manufacturing process Methods 0.000 description 5
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- 238000010586 diagram Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 2
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- 238000009434 installation Methods 0.000 description 1
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- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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Description
各実施形態に係る半導体モジュールは、例えば、演算装置(以下、論理チップという)と、積層型RAMとをインタポーザ上に配置したSIP(system in a package)である。半導体モジュールは、他のインタポーザ上に配置され、マイクロバンプを用いて電気的に接続される。半導体モジュールは、他のインタポーザから電源を得るとともに、他のインタポーザとの間でデータ送受信が可能な装置である。なお、以下の各実施形態において、MPUを論理チップの一例として説明する。
次に、本発明の第1実施形態に係る半導体モジュール1について、図1〜図5を参照して説明する。
半導体モジュール1は、図1〜図4に示すように、第1インタポーザ10と、MPU20と、一対のRAM部30と、接続部40と、ヒートシンク部50と、を備える。
まず、図5に示すように、第1インタポーザ10から、MPU20に電源W1が供給される。また、第1インタポーザ10から、一方のRAM部30aに電源W2が供給される。一方のRAM部30aに供給された電源W1は、接続部40を介して他方のRAM部30bにも供給される。また、MPU20は、第1インタポーザ10とグラウンド接続される(グラウンドG1)。一対のRAM部30は、第1インタポーザ10とグラウンド接続(グラウンドG2)される。なお、接続部40を介してインタフェースチップ32からMPU20に電源W4とグラウンドG4を供給しても良い。
(1)半導体モジュール1を、MPU20(論理チップ)と、それぞれが積層型RAMモジュールから構成される一対のRAM部30と、MPU20及び一対のRAM部30のそれぞれに電気的に接続される第1インタポーザ10と、MPU20と一対のRAM部30のそれぞれとの間を通信可能に接続する接続部40と、を含んで構成した。そして、一対のRAM部30の一方の一端部を、接続部40を介してMPU20の一端部と積層方向Cで重ねて配置し、一対のRAM部30の他方を、接続部40を介して一方のRAM部30aに重ね合わされるとともに、MPU20の外周のすくなくとも1辺に沿って配置した。これにより、MPU20と一対のRAM部30のそれぞれとを接続部40により直接的に接続可能であるので、MPU20と一対のRAM部30のそれぞれとの間の信号線を短くすることができる。よって、MPU20と一対のRAM部30との間のバンド幅を広くすることができる。また、RAM部30を積層型RAMモジュールで一対に構成することによりRAM部30の容量を容易に増加させることができる。さらに、積層型RAMモジュールを別々に製作でき、単体の積層型RAMモジュールでRAM部30を製作する場合に比べ歩留りを向上できる。
次に、本発明の第2実施形態に係る半導体モジュール1Aについて、図6及び図7を参照して説明する。第2実施形態の説明にあたって、同一構成要件については同一符号を付し、その説明を省略もしくは簡略化する。
第2実施形態に係る半導体モジュール1Aは、図6に示すように、一対のRAM部30のそれぞれが、インタフェースチップ32を対向させて配置される点で第1実施形態と異なる。第2実施形態に係る半導体モジュール1Aは、図7に示すように、一方のRAM部30aのインタフェースチップ32と他方のRAM部30bのそれぞれのインタフェースチップ32が、それぞれのRAM部30のメモリ部31を管理する点で第1実施形態と異なる。
(7)一対のRAM部30のそれぞれを、インタフェースチップ32を対向させて配置した。これにより、一対のRAM部30のそれぞれを別々のインタフェースチップ32で制御することができる。
次に、本発明の第3実施形態に係る半導体モジュール1Bについて、図8及び図9を参照して説明する。第3実施形態の説明にあたって、同一構成要件については同一符号を付し、その説明を省略もしくは簡略化する。
第3実施形態に係る半導体モジュール1Bは、図8に示すように、他方のRAM部30bが、メモリ部31のみで構成されている点で第1及び第2実施形態と異なる。第3実施形態に係る半導体モジュール1Bでは、図9に示すように、第1実施形態と同様に、一方のRAM部30aのインタフェースチップ32が一対のRAM部30の双方を管理する。
(8)他方のRAM部30bを、メモリ部31のみで構成した。これにより、半導体モジュール1Bの歩留まりを向上できるとともに、製作コストを低減できる。
次に、本発明の第4実施形態に係る半導体モジュール1Cについて、図10〜図13を参照して説明する。第4実施形態の説明にあたって、同一構成要件については同一符号を付し、その説明を省略もしくは簡略化する。
第4実施形態に係る半導体モジュール1Cは、図10〜図12に示すように、第2インタポーザ60と、第3インタポーザ又はパッケージ基板80と、ボンディングワイヤ70と、を備える点で第2実施形態と異なる。
第3インタポーザ又はパッケージ基板80は、第1インタポーザ10を載置する。第3インタポーザ又はパッケージ基板80は、第1インタポーザ10とマイクロバンプM1を用いて電気的に接続される。
図13に示すように、第2インタポーザ60には、ボンディングワイヤ70を介して第3インタポーザ又はパッケージ基板80から電源W3が供給される。他方のRAM部30bには、第2インタポーザ60から電源W3が供給される。他方のRAM部30bは、第2インタポーザ60とグラウンド接続(グラウンドG3)される。
(9)半導体モジュール1Cを更に、他方のRAM部30bに載置される第2インタポーザ60と、第1インタポーザ10を載置する第3インタポーザ又はパッケージ基板80と、第2インタポーザ60及び第3インタポーザ又はパッケージ基板80を電気的に接続するボンディングワイヤ70と、を含んで構成した。これにより、一対のRAM部30のそれぞれに別々に電力を供給できるので、電力をRAM部30に安定供給できる。
次に、本発明の第5実施形態に係る半導体モジュール1Dについて、図14を参照して説明する。第5実施形態の説明にあたって、同一構成については同一符号を付し、その説明を省略もしくは簡略化する。
第5実施形態に係る半導体モジュール1Dは、図14に示すように、ボンディングワイヤ70に代えて、導電性の柱状部90を備える点で第5実施形態と異なる。
図14に示すように、第2インタポーザ60には、柱状部90を介して第1インタポーザ10から電源W5が供給される。また、第2インタポーザ60は、第1インタポーザ10とグラウンド接続(グラウンドG5)される。
(10)半導体モジュール1Dを更に、他方のRAM部30bに載置される第2インタポーザ60と、第1インタポーザ10及び第2インタポーザ60を電気的に接続する柱状部90と、を含んで構成した。これにより、一対のRAM部30のそれぞれに別々に電力を供給できるので、電力をRAM部30に安定供給できる。また、柱状部90の他端が他方のRAM部30bに対向する第2インタポーザ60の下面に接続されるので、第2インタポーザ60の下面側に、柱状部90の接続位置と、他方のRAM部30bの接続位置との両者を配置できる。これにより、第2インタポーザ60を貫通させることなく、柱状部90から他方のRAM部30bに電源(電源W3,W5)及びグラウンド(グラウンドG3,G5)を供給できるので、半導体モジュール1Dの製作コストを低下させることができる。
次に、本発明の第6実施形態に係る半導体モジュールについて説明する。第6実施形態の説明にあたって、同一構成要件については同一符号を付し、その説明を省略もしくは簡略化する。
第5実施形態に係る半導体モジュールは、ヒートシンク部50がスペーサ部(図示せず)を備える点で第1〜第5実施形態と異なる。
スペーサ部は、MPU20の上面と、他方のRAM部30bとの上面との間に段差がある場合に、段差を埋める厚さで形成される。スペーサ部は、少なくとも他方のRAM部30b及びMPU20のいずれか一方に隣接する。スペーサ部は、他方のRAM部30b又はMPU20の上面と接触可能なように対向面を平面で形成される。
(11)ヒートシンク部を、少なくとも他方のRAM部30b及びMPU20のいずれか一方に隣接するスペーサ部を含んで構成した。これにより、RAM部及びMPU20の間が面一でない場合であっても、ヒートシンク部を設置することができる。
10 第1インタポーザ
20 MPU
30 一対のRAM部
30a 一方のRAM部
30b 他方のRAM部
31 メモリ部
32 インタフェースチップ
40 接続部
50 ヒートシンク部
60 第2インタポーザ
70 ボンディングワイヤ
80 第3インタポーザ又はパッケージ基板
Claims (10)
- 論理チップと、
それぞれが積層型RAMモジュールから構成される一対のRAM部と、
前記論理チップ及び一対の前記RAM部のそれぞれに電気的に接続される第1インタポーザと、
前記論理チップと一対の前記RAM部のそれぞれとの間を通信可能に接続する接続部と、
を備え、
一方の前記RAM部は、前記第1インタポーザに載置されるとともに、一端部が前記接続部を介して前記論理チップの一端部と積層方向で重なって配置され、
他方の前記RAM部は、前記接続部を介して一方の前記RAM部に重ね合わされるとともに、前記論理チップの外周の少なくとも1辺に沿って配置されることを特徴とする半導体モジュール。 - 一対の前記RAM部のそれぞれは、
メモリ回路が積層されたメモリ部と、
前記メモリ部の一端側に積層されるインタフェースチップと、
を備える請求項1に記載の半導体モジュール。 - 一対の前記RAM部のそれぞれは、前記インタフェースチップを対向させて配置される請求項2に記載の半導体モジュール。
- 一対の前記RAM部のそれぞれは、前記第1インタポーザに対向する面とは逆の面側に前記インタフェースチップが配置される請求項2に記載の半導体モジュール。
- 前記他方のRAM部は、前記メモリ部のみで構成される請求項2に記載の半導体モジュール。
- 前記他方のRAM部に載置される第2インタポーザと、
前記第1インタポーザを載置する第3インタポーザ又はパッケージ基板と、
前記第2インタポーザ及び、前記第3インタポーザ又はパッケージ基板を電気的に接続するボンディングワイヤと、
を更に備える請求項1〜5のいずれかに記載の半導体モジュール。 - 前記他方のRAM部に載置される第2インタポーザと、
前記第1インタポーザ及び前記第2インタポーザを電気的に接続する柱状部と、
を更に備える請求項1〜5のいずれかに記載の半導体モジュール。 - 前記他方のRAM部と前記論理チップとに載置されるヒートシンク部を更に備える請求項1〜7のいずれかに記載の半導体モジュール。
- 前記ヒートシンク部は、少なくとも前記他方のRAM部及び前記論理チップのいずれか一方に隣接するスペーサ部を備える請求項8に記載の半導体モジュール。
- 一対の前記RAM部のそれぞれは、平面視同じ形状及び大きさの積層型RAMモジュールを含む請求項1〜9のいずれかに記載の半導体モジュール。
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US20200328184A1 (en) | 2020-10-15 |
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US20200135696A1 (en) | 2020-04-30 |
CN112802835A (zh) | 2021-05-14 |
WO2018220846A1 (ja) | 2018-12-06 |
US11410970B2 (en) | 2022-08-09 |
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CN110720125A (zh) | 2020-01-21 |
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