JP6781965B2 - 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 - Google Patents

物体保持装置、処理装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 Download PDF

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Publication number
JP6781965B2
JP6781965B2 JP2019510258A JP2019510258A JP6781965B2 JP 6781965 B2 JP6781965 B2 JP 6781965B2 JP 2019510258 A JP2019510258 A JP 2019510258A JP 2019510258 A JP2019510258 A JP 2019510258A JP 6781965 B2 JP6781965 B2 JP 6781965B2
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Japan
Prior art keywords
movement stage
fine movement
tile
substrate
holding device
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Japanese (ja)
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JPWO2018181913A1 (ja
Inventor
青木　保夫
保夫 青木
亮平 吉田
亮平 吉田
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
JP2019510258A 2017-03-31 2018-03-30 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 Active JP6781965B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017072207 2017-03-31
JP2017072207 2017-03-31
PCT/JP2018/013657 WO2018181913A1 (ja) 2017-03-31 2018-03-30 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法

Related Child Applications (1)

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JP2020174650A Division JP7192841B2 (ja) 2017-03-31 2020-10-16 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

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JPWO2018181913A1 JPWO2018181913A1 (ja) 2019-12-26
JP6781965B2 true JP6781965B2 (ja) 2020-11-11

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JP2019510258A Active JP6781965B2 (ja) 2017-03-31 2018-03-30 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2020174650A Active JP7192841B2 (ja) 2017-03-31 2020-10-16 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

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JP (2) JP6781965B2 (ko)
KR (1) KR102315472B1 (ko)
CN (1) CN110383178B (ko)
TW (1) TWI762610B (ko)
WO (1) WO2018181913A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7105482B2 (ja) * 2018-04-03 2022-07-25 株式会社ブイ・テクノロジー 石定盤の温度調整装置およびそれを備えた検査装置
CN113323512B (zh) * 2020-02-28 2022-06-17 上海微电子装备（集团）股份有限公司 版盒解锁装置及掩模传输版库设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2802157B2 (ja) 1990-09-25 1998-09-24 松下電工株式会社 曲線框用曲線材の製造方法
KR100525521B1 (ko) * 1996-10-21 2006-01-27 가부시키가이샤 니콘 노광장치및노광방법
JP4136363B2 (ja) * 2001-11-29 2008-08-20 キヤノン株式会社 位置決め装置及びそれを用いた露光装置
CN102782806A (zh) * 2010-03-04 2012-11-14 株式会社安川电机 工作台装置
JP2011244608A (ja) * 2010-05-19 2011-12-01 Nikon Corp リニアモータ、移動体装置、露光装置、デバイス製造方法、及びフラットパネルディスプレイの製造方法
US8988655B2 (en) * 2010-09-07 2015-03-24 Nikon Corporation Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method
JP5807841B2 (ja) * 2011-08-30 2015-11-10 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6132079B2 (ja) * 2012-04-04 2017-05-24 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
CN113204177A (zh) * 2015-03-31 2021-08-03 株式会社尼康 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法
CN107615169B (zh) * 2015-05-28 2021-02-23 株式会社尼康 物体保持装置、曝光装置、平板显示器的制造方法及器件制造方法

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Publication number Publication date
CN110383178B (zh) 2021-10-26
KR20190077564A (ko) 2019-07-03
KR102315472B1 (ko) 2021-10-21
JP2021015285A (ja) 2021-02-12
TW201842545A (zh) 2018-12-01
TWI762610B (zh) 2022-05-01
WO2018181913A1 (ja) 2018-10-04
JPWO2018181913A1 (ja) 2019-12-26
CN110383178A (zh) 2019-10-25
JP7192841B2 (ja) 2022-12-20

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