TWI762610B - 物體保持裝置、處理裝置、平板顯示器的製造方法、元件製造方法以及物體保持方法 - Google Patents

物體保持裝置、處理裝置、平板顯示器的製造方法、元件製造方法以及物體保持方法 Download PDF

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Publication number
TWI762610B
TWI762610B TW107111132A TW107111132A TWI762610B TW I762610 B TWI762610 B TW I762610B TW 107111132 A TW107111132 A TW 107111132A TW 107111132 A TW107111132 A TW 107111132A TW I762610 B TWI762610 B TW I762610B
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TW
Taiwan
Prior art keywords
substrate
drive system
moving body
object holding
tile
Prior art date
Application number
TW107111132A
Other languages
English (en)
Chinese (zh)
Other versions
TW201842545A (zh
Inventor
青木保夫
吉田亮平
Original Assignee
日商尼康股份有限公司
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Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW201842545A publication Critical patent/TW201842545A/zh
Application granted granted Critical
Publication of TWI762610B publication Critical patent/TWI762610B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW107111132A 2017-03-31 2018-03-30 物體保持裝置、處理裝置、平板顯示器的製造方法、元件製造方法以及物體保持方法 TWI762610B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-072207 2017-03-31
JP2017072207 2017-03-31

Publications (2)

Publication Number Publication Date
TW201842545A TW201842545A (zh) 2018-12-01
TWI762610B true TWI762610B (zh) 2022-05-01

Family

ID=63676251

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107111132A TWI762610B (zh) 2017-03-31 2018-03-30 物體保持裝置、處理裝置、平板顯示器的製造方法、元件製造方法以及物體保持方法

Country Status (5)

Country Link
JP (2) JP6781965B2 (ko)
KR (1) KR102315472B1 (ko)
CN (1) CN110383178B (ko)
TW (1) TWI762610B (ko)
WO (1) WO2018181913A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7105482B2 (ja) * 2018-04-03 2022-07-25 株式会社ブイ・テクノロジー 石定盤の温度調整装置およびそれを備えた検査装置
CN113323512B (zh) * 2020-02-28 2022-06-17 上海微电子装备（集团）股份有限公司 版盒解锁装置及掩模传输版库设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135776A1 (en) * 1996-10-21 2002-09-26 Kenji Nishi Exposure apparatus and method
US20060215145A1 (en) * 2001-11-29 2006-09-28 Canon Kabushiki Kaisha Positioning apparatus and method for manufacturing same
JP2013051289A (ja) * 2011-08-30 2013-03-14 Nikon Corp 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
WO2016190423A1 (ja) * 2015-05-28 2016-12-01 株式会社ニコン 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
TW201643556A (zh) * 2015-03-31 2016-12-16 尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2802157B2 (ja) 1990-09-25 1998-09-24 松下電工株式会社 曲線框用曲線材の製造方法
CN102782806A (zh) 2010-03-04 2012-11-14 株式会社安川电机 工作台装置
JP2011244608A (ja) * 2010-05-19 2011-12-01 Nikon Corp リニアモータ、移動体装置、露光装置、デバイス製造方法、及びフラットパネルディスプレイの製造方法
US8988655B2 (en) * 2010-09-07 2015-03-24 Nikon Corporation Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method
JP6132079B2 (ja) * 2012-04-04 2017-05-24 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135776A1 (en) * 1996-10-21 2002-09-26 Kenji Nishi Exposure apparatus and method
US20060215145A1 (en) * 2001-11-29 2006-09-28 Canon Kabushiki Kaisha Positioning apparatus and method for manufacturing same
JP2013051289A (ja) * 2011-08-30 2013-03-14 Nikon Corp 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
TW201643556A (zh) * 2015-03-31 2016-12-16 尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法
WO2016190423A1 (ja) * 2015-05-28 2016-12-01 株式会社ニコン 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Also Published As

Publication number Publication date
CN110383178A (zh) 2019-10-25
JP7192841B2 (ja) 2022-12-20
JP6781965B2 (ja) 2020-11-11
WO2018181913A1 (ja) 2018-10-04
KR102315472B1 (ko) 2021-10-21
KR20190077564A (ko) 2019-07-03
JPWO2018181913A1 (ja) 2019-12-26
JP2021015285A (ja) 2021-02-12
CN110383178B (zh) 2021-10-26
TW201842545A (zh) 2018-12-01

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