JP6777985B2 - 基板保持装置 - Google Patents

基板保持装置 Download PDF

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Publication number
JP6777985B2
JP6777985B2 JP2015226775A JP2015226775A JP6777985B2 JP 6777985 B2 JP6777985 B2 JP 6777985B2 JP 2015226775 A JP2015226775 A JP 2015226775A JP 2015226775 A JP2015226775 A JP 2015226775A JP 6777985 B2 JP6777985 B2 JP 6777985B2
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JP
Japan
Prior art keywords
substrate
wafer
columns
support column
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015226775A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017098330A (ja
JP2017098330A5 (https=
Inventor
直樹 豊村
直樹 豊村
宮崎　充
充 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2015226775A priority Critical patent/JP6777985B2/ja
Priority to TW105135880A priority patent/TWI719075B/zh
Priority to KR1020160150985A priority patent/KR102557223B1/ko
Priority to US15/351,242 priority patent/US10847407B2/en
Publication of JP2017098330A publication Critical patent/JP2017098330A/ja
Publication of JP2017098330A5 publication Critical patent/JP2017098330A5/ja
Application granted granted Critical
Publication of JP6777985B2 publication Critical patent/JP6777985B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2015226775A 2015-11-19 2015-11-19 基板保持装置 Active JP6777985B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015226775A JP6777985B2 (ja) 2015-11-19 2015-11-19 基板保持装置
TW105135880A TWI719075B (zh) 2015-11-19 2016-11-04 基板保持裝置
KR1020160150985A KR102557223B1 (ko) 2015-11-19 2016-11-14 기판 보유 지지 장치
US15/351,242 US10847407B2 (en) 2015-11-19 2016-11-14 Substrate holding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015226775A JP6777985B2 (ja) 2015-11-19 2015-11-19 基板保持装置

Publications (3)

Publication Number Publication Date
JP2017098330A JP2017098330A (ja) 2017-06-01
JP2017098330A5 JP2017098330A5 (https=) 2018-07-26
JP6777985B2 true JP6777985B2 (ja) 2020-10-28

Family

ID=58721040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015226775A Active JP6777985B2 (ja) 2015-11-19 2015-11-19 基板保持装置

Country Status (4)

Country Link
US (1) US10847407B2 (https=)
JP (1) JP6777985B2 (https=)
KR (1) KR102557223B1 (https=)
TW (1) TWI719075B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018211876A1 (ja) 2017-05-17 2018-11-22 国立研究開発法人農業・食品産業技術総合研究機構 ビトリゲル膜乾燥体の製造方法及び製造装置
CN110098152B (zh) * 2018-01-31 2020-12-08 株洲中车时代半导体有限公司 一种压力分层串联夹具
JP7116550B2 (ja) * 2018-02-08 2022-08-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7255078B2 (ja) * 2018-03-20 2023-04-11 日新電機株式会社 クランプ機構及び当該クランプ機構を備える基板保持装置
JP7020986B2 (ja) * 2018-04-16 2022-02-16 株式会社荏原製作所 基板処理装置および基板保持装置
KR102753250B1 (ko) * 2019-05-14 2025-01-15 삼성디스플레이 주식회사 클램프 장치
CN110246783B (zh) * 2019-06-10 2021-06-15 宁波润华全芯微电子设备有限公司 一种去胶机夹持主轴
CN111048466B (zh) * 2019-12-26 2022-08-16 北京北方华创微电子装备有限公司 晶圆夹持装置
US11353497B2 (en) * 2020-03-27 2022-06-07 Yamaichi Electronics Co., Ltd. Test socket
JP7438015B2 (ja) * 2020-05-01 2024-02-26 東京エレクトロン株式会社 基板処理装置
JP7558043B2 (ja) * 2020-11-30 2024-09-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
US20230390898A1 (en) * 2022-06-07 2023-12-07 Ebara Corporation Substrate clamping apparatus
JP2025007277A (ja) * 2023-06-30 2025-01-17 芝浦メカトロニクス株式会社 基板処理装置
CN118366905B (zh) * 2024-06-19 2024-08-16 深圳市石金科技股份有限公司 硅片生产用移动装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100282160B1 (ko) * 1996-05-07 2001-03-02 가야시마 고조 기판처리장치 및 처리방법
JPH1059540A (ja) * 1996-05-13 1998-03-03 Ebara Corp 基板把持装置
JPH11186367A (ja) * 1997-12-24 1999-07-09 Dainippon Screen Mfg Co Ltd 基板保持装置
JP3660171B2 (ja) * 1999-09-22 2005-06-15 松下電器産業株式会社 通信装置及び通信方法
JP3953248B2 (ja) * 2000-01-14 2007-08-08 大日本スクリーン製造株式会社 基板処理装置
KR100873153B1 (ko) * 2007-10-05 2008-12-10 세메스 주식회사 스핀 헤드
KR20090041154A (ko) * 2007-10-23 2009-04-28 삼성전자주식회사 기판 세정 장치 및 기판 세정 방법
JP5422143B2 (ja) * 2008-06-04 2014-02-19 株式会社荏原製作所 基板把持機構
KR101958874B1 (ko) * 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
JP5258981B2 (ja) * 2010-02-05 2013-08-07 東京エレクトロン株式会社 基板保持具及び基板搬送装置及び基板処理装置
JP4794685B1 (ja) * 2010-10-19 2011-10-19 ミクロ技研株式会社 基板処理装置及び基板処理方法
JP6053528B2 (ja) * 2013-01-11 2016-12-27 株式会社荏原製作所 基板把持装置
JP6181438B2 (ja) * 2013-06-24 2017-08-16 株式会社荏原製作所 基板保持装置および基板洗浄装置

Also Published As

Publication number Publication date
TWI719075B (zh) 2021-02-21
TW201729334A (zh) 2017-08-16
US20170148660A1 (en) 2017-05-25
US10847407B2 (en) 2020-11-24
KR102557223B1 (ko) 2023-07-19
JP2017098330A (ja) 2017-06-01
KR20170058858A (ko) 2017-05-29

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