JP6777752B2 - 銅−セラミックス複合材料 - Google Patents
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Description
− 酸化アルミニウムを含むセラミック基板と、
− 前記セラミック基板上に存在する、銅又は銅合金からなる被膜と、を有し、
前記酸化アルミニウムは、粒子サイズが0.01μmから25μmの範囲内である、
上記銅−セラミックス複合材料により達成される。
本発明によれば、銅接着力の改善とは、銅−セラミックス複合材料に対する銅の接着力であって、接着された銅箔を銅−セラミックス複合材料のセラミックス表面から剥がすのに必要な力が増すことである。例示的な測定方法は、DE102004012231B4(DE102004012231B4の図2及び図3)によって当業者に公知である。
同様に、d5は、5%の粒子の径がd5よりも小さいことを指し、d95は、95%の粒子の径がd95よりも小さいことを指す。
粒子サイズ分布の算術平均darithは、個々の粒子の粒子サイズの合計を粒子数で除することにより得られる。
9.5≧(d95−d5)/d50≧0.7
4.0≧(d95−d5)/d50≧0.5
− 銅箔を酸化して、表面に酸化銅層を形成する;
− 酸化銅層を形成した銅箔をセラミック基板に載せる;
− 複合材料を<1083℃の温度(例えば1065℃から1080℃の温度範囲)で加熱する;
− 室温まで冷却する。
0.7≦S(Al2O3)/S(Cu)≦1.4。
0.74≦S(Al2O3)/S(Cu)≦1.35;
さらに好ましくは以下の条件を満たす:
0.80≦S(Al2O3)/S(Cu)≦1.25。
0.5≦Ra(Al2O3)/Ra(Cu)≦2.0。
0.75≦Ra(Al2O3)/Ra(Cu)≦1.5;
また、さらにより好ましくは、
0.80≦Ra(Al2O3)/Ra(Cu)≦1.20
である。
これにより、銅−セラミックス複合材料の耐熱衝撃性のさらなる最適化を実現することができる。
dmax(Cu)に対するdmin(Al2O3)の比及びdmin(Cu)に対するdmax(Al2O3)の比が、以下の(i)及び(ii)を満たす:
(i) dmin(Al2O3)/dmax(Cu)≧1x10−5;
(ii) 2.5≧dmax(Al2O3)/dmin(Cu)。
(i) dmin(Al2O3)/dmax(Cu)≧0.001;
(ii) 1.5≧dmax(Al2O3)/dmin(Cu);
最も好ましくは以下の(i)及び(ii)を満たす:
(i) dmin(Al2O3)/dmax(Cu)≧0.002;
(ii) 1.0≧dmax(Al2O3)/dmin(Cu)。
(i) 0.005≧dmin(Al2O3)/dmax(Cu)≧0.002;かつ
(ii) 1.0≧dmax(Al2O3)/dmin(Cu)≧0.05である。
セラミック基板の表面の走査顕微鏡写真(SEM像)を撮影する。研磨切片の形態の特別な試料調製は不要である。SEM像は、セラミック基板の銅で覆われていた箇所をエッチングにより露出させて撮影する。
粒子サイズ分布の算術平均は、個々の粒子の粒子サイズの合計を交差した粒子の数で除することにより得られる。
銅又は銅合金からなる被膜の表面の光学顕微鏡写真を撮る(被覆された基板表面と平行)。研磨切片の形態の特別な試料調製は不要である。
(酸化アルミニウム)
粒子サイズ分布の測定に用いたSEM像を用いる。
最も長い寸法dK,maxを求める。続いて、dK,maxの長さを半分にする箇所においてdK,maxに直交する粒子径dK,orthoを求める。個々の粒子RKの形状係数は、dK,maxに対するdK,orthoの比、すなわちRK=dK,ortho/dK,maxとして得られる。
粒子サイズ分布の測定に用いた光学顕微鏡写真を用いる。
銅−セラミックス複合材料1、以下「K−K−V1」と称する(本発明)
銅−セラミックス複合材料2、以下「K−K−V2」と称する(比較試料)
銅−セラミックス複合材料3、以下「K−K−V3」と称する(比較試料)
銅−セラミックス複合材料4、以下「K−K−V4」と称する(比較試料)
銅−セラミックス複合材料5、以下「K−K−V5」と称する(比較試料)
セラミック基板の厚さ:0.38mm;
セラミック基板の長さx幅:190x140mm2であった。
Claims (9)
- 酸化アルミニウムを含むセラミック基板であって、
前記酸化アルミニウムは、
粒子サイズが0.01μmから25μmの範囲内であり、
粒子サイズの数分布における中央値d50及び算術平均darithについて、darithに対するd50の比が0.75から1.10の範囲内であり、d5値及びd95値について、d95に対するd5の比が0.1から0.4の範囲内である、上記セラミック基板と、
前記セラミック基板上に存在する銅又は銅合金からなる被膜と、
を有する、銅−セラミックス複合材料。 - darithに対するd50の比が、0.78から1.05の範囲内である、請求項1に記載の銅−セラミックス複合材料。
- 前記d95に対するd5の比が0.12から0.30の範囲内である、請求項1又は請求項2に記載の銅−セラミックス複合材料。
- 前記酸化アルミニウムの粒子サイズが、0.3μmから23μmの範囲内である、請求項1から請求項3のいずれか1項に記載の銅−セラミックス複合材料。
- 前記セラミック基板が、酸化アルミニウムを少なくとも65重量%含む、請求項1から請求項4に記載の銅−セラミックス複合材料。
- 銅又は銅合金からなる前記被膜が、DCB法によって前記セラミック基板に貼り付けられる、請求項1から請求項5のいずれか1項に記載の銅−セラミックス複合材料。
- 銅又は銅合金からなる前記被膜が、少なくとも部分的に電気接触部を形成する構造化部を有する、請求項1から請求項6のいずれか1項に記載の銅−セラミックス複合材料。
- 前記銅又は銅合金からなる前記被膜は、前記被膜の面積の少なくとも70%に渡って、厚さが0.2mmから1.2mmの範囲内であり;及び/又は、前記セラミック基板は、前記セラミック基板の面積の少なくとも70%に渡って、厚さが0.2mmから1.2mmの範囲内である、請求項1から請求項7のいずれか1項に記載の銅−セラミックス複合材料。
- 請求項1から請求項8のいずれか1項に記載の銅−セラミックス複合材料を少なくとも1種と、1又は2以上のボンドワイヤーとを含むモジュール。
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Application Number | Priority Date | Filing Date | Title |
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DE102016203058.2A DE102016203058B3 (de) | 2016-02-26 | 2016-02-26 | Kupfer-Keramik-Verbund und Modul |
DE102016203058.2 | 2016-02-26 | ||
PCT/EP2017/053449 WO2017144331A1 (de) | 2016-02-26 | 2017-02-16 | Kupfer-keramik-verbund |
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JP2019511992A JP2019511992A (ja) | 2019-05-09 |
JP6777752B2 true JP6777752B2 (ja) | 2020-10-28 |
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US (1) | US20190023619A1 (ja) |
EP (1) | EP3419951B1 (ja) |
JP (1) | JP6777752B2 (ja) |
KR (1) | KR102206421B1 (ja) |
CN (1) | CN108698945B (ja) |
DE (1) | DE102016203058B3 (ja) |
HU (1) | HUE048932T2 (ja) |
WO (1) | WO2017144331A1 (ja) |
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CN108137900B (zh) | 2015-10-02 | 2020-06-16 | 株式会社钟化 | 固化性组合物 |
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US3994430A (en) | 1975-07-30 | 1976-11-30 | General Electric Company | Direct bonding of metals to ceramics and metals |
DE3204167A1 (de) | 1982-02-06 | 1983-08-11 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zum direkten verbinden von metallstuecken mit oxidkeramiksubstraten |
DE4004844C1 (de) | 1990-02-16 | 1991-01-03 | Abb Ixys Semiconductor Gmbh | Verfahren zur Herstellung einer strukturierten Kupfermetallisierung auf einem Keramiksubstrat |
WO2004074210A1 (ja) * | 1992-07-03 | 2004-09-02 | Masanori Hirano | セラミックス-金属複合体およびその製造方法 |
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DE102016203112B4 (de) * | 2016-02-26 | 2019-08-29 | Heraeus Deutschland GmbH & Co. KG | Kupfer-Keramik-Verbund |
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2016
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- 2017-02-16 JP JP2018544120A patent/JP6777752B2/ja active Active
- 2017-02-16 HU HUE17708987A patent/HUE048932T2/hu unknown
- 2017-02-16 US US16/078,235 patent/US20190023619A1/en not_active Abandoned
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KR102206421B1 (ko) | 2021-01-22 |
US20190023619A1 (en) | 2019-01-24 |
HUE048932T2 (hu) | 2020-09-28 |
DE102016203058B3 (de) | 2017-05-18 |
CN108698945B (zh) | 2021-05-07 |
JP2019511992A (ja) | 2019-05-09 |
KR20180111943A (ko) | 2018-10-11 |
EP3419951A1 (de) | 2019-01-02 |
CN108698945A (zh) | 2018-10-23 |
WO2017144331A1 (de) | 2017-08-31 |
EP3419951B1 (de) | 2019-12-11 |
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