JP6774178B2 - 基板を処理する装置、及び物品の製造方法 - Google Patents

基板を処理する装置、及び物品の製造方法 Download PDF

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Publication number
JP6774178B2
JP6774178B2 JP2015224226A JP2015224226A JP6774178B2 JP 6774178 B2 JP6774178 B2 JP 6774178B2 JP 2015224226 A JP2015224226 A JP 2015224226A JP 2015224226 A JP2015224226 A JP 2015224226A JP 6774178 B2 JP6774178 B2 JP 6774178B2
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Japan
Prior art keywords
substrate
mold
imprint material
adsorption
region
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JP2015224226A
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English (en)
Japanese (ja)
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JP2017092396A5 (ja
JP2017092396A (ja
Inventor
節男 吉田
節男 吉田
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2015224226A priority Critical patent/JP6774178B2/ja
Priority to PCT/JP2016/083495 priority patent/WO2017086246A1/en
Priority to KR1020187016084A priority patent/KR102103288B1/ko
Priority to KR1020207010979A priority patent/KR102238990B1/ko
Publication of JP2017092396A publication Critical patent/JP2017092396A/ja
Publication of JP2017092396A5 publication Critical patent/JP2017092396A5/ja
Application granted granted Critical
Publication of JP6774178B2 publication Critical patent/JP6774178B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2015224226A 2015-11-16 2015-11-16 基板を処理する装置、及び物品の製造方法 Active JP6774178B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015224226A JP6774178B2 (ja) 2015-11-16 2015-11-16 基板を処理する装置、及び物品の製造方法
PCT/JP2016/083495 WO2017086246A1 (en) 2015-11-16 2016-11-11 Imprint apparatus, and method of manufacturing article
KR1020187016084A KR102103288B1 (ko) 2015-11-16 2016-11-11 임프린트 장치 및 물품 제조 방법
KR1020207010979A KR102238990B1 (ko) 2015-11-16 2016-11-11 임프린트 장치 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015224226A JP6774178B2 (ja) 2015-11-16 2015-11-16 基板を処理する装置、及び物品の製造方法

Publications (3)

Publication Number Publication Date
JP2017092396A JP2017092396A (ja) 2017-05-25
JP2017092396A5 JP2017092396A5 (ja) 2018-12-20
JP6774178B2 true JP6774178B2 (ja) 2020-10-21

Family

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JP2015224226A Active JP6774178B2 (ja) 2015-11-16 2015-11-16 基板を処理する装置、及び物品の製造方法

Country Status (3)

Country Link
JP (1) JP6774178B2 (ko)
KR (2) KR102238990B1 (ko)
WO (1) WO2017086246A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019101295A (ja) * 2017-12-05 2019-06-24 Ｎｉｓｓｈａ株式会社 加飾成形品の製造方法、加飾成形品の製造装置及び加飾成形品
WO2019164640A1 (en) * 2018-02-20 2019-08-29 Applied Materials, Inc. Patterned vacuum chuck for double-sided processing
JP7100485B2 (ja) * 2018-04-26 2022-07-13 キヤノン株式会社 インプリント装置およびデバイス製造方法
JP7091151B2 (ja) 2018-06-01 2022-06-27 キオクシア株式会社 アライメントマーク、インプリント方法、および半導体装置の製造方法
JP7218114B2 (ja) * 2018-07-12 2023-02-06 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
JP7204457B2 (ja) * 2018-12-06 2023-01-16 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7284639B2 (ja) * 2019-06-07 2023-05-31 キヤノン株式会社 成形装置、および物品製造方法
CN114556211A (zh) * 2019-12-02 2022-05-27 Ev 集团 E·索尔纳有限责任公司 用于脱离印模的方法和装置
US11854911B2 (en) * 2021-02-25 2023-12-26 Applied Materials, Inc. Methods, systems, and apparatus for conducting chucking operations using an adjusted chucking voltage if a process shift occurs

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247153B2 (ko) * 1973-03-02 1977-11-30
US7019819B2 (en) * 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
US7636999B2 (en) * 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
JP2007083626A (ja) * 2005-09-22 2007-04-05 Ricoh Co Ltd 微細構造転写装置
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8652393B2 (en) * 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
JP5698958B2 (ja) * 2010-10-28 2015-04-08 ニッタ株式会社 インプリント用モールドの製造方法
JP5875250B2 (ja) * 2011-04-28 2016-03-02 キヤノン株式会社 インプリント装置、インプリント方法及びデバイス製造方法
JP6306830B2 (ja) * 2013-06-26 2018-04-04 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6242099B2 (ja) * 2013-07-23 2017-12-06 キヤノン株式会社 インプリント方法、インプリント装置およびデバイス製造方法
JP6333031B2 (ja) * 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法

Also Published As

Publication number Publication date
KR20200043512A (ko) 2020-04-27
WO2017086246A1 (en) 2017-05-26
KR102103288B1 (ko) 2020-04-22
KR102238990B1 (ko) 2021-04-13
JP2017092396A (ja) 2017-05-25
KR20180080308A (ko) 2018-07-11

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