JP6772280B2 - 保護層を有する発光粒子を製造するための方法、および保護層を有する発光粒子 - Google Patents
保護層を有する発光粒子を製造するための方法、および保護層を有する発光粒子 Download PDFInfo
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- JP6772280B2 JP6772280B2 JP2018543696A JP2018543696A JP6772280B2 JP 6772280 B2 JP6772280 B2 JP 6772280B2 JP 2018543696 A JP2018543696 A JP 2018543696A JP 2018543696 A JP2018543696 A JP 2018543696A JP 6772280 B2 JP6772280 B2 JP 6772280B2
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- 239000002245 particle Substances 0.000 title claims description 144
- 239000011241 protective layer Substances 0.000 title claims description 126
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 121
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 96
- 239000007858 starting material Substances 0.000 claims description 61
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 229910052760 oxygen Inorganic materials 0.000 claims description 28
- 239000010410 layer Substances 0.000 claims description 27
- 238000005496 tempering Methods 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 17
- 239000001301 oxygen Substances 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 239000012298 atmosphere Substances 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 14
- 239000011701 zinc Substances 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 11
- 229910052725 zinc Inorganic materials 0.000 claims description 11
- 229910052693 Europium Inorganic materials 0.000 claims description 10
- 150000004767 nitrides Chemical class 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 9
- 229910052796 boron Inorganic materials 0.000 claims description 8
- 229910052791 calcium Inorganic materials 0.000 claims description 8
- 229910052749 magnesium Inorganic materials 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 229910052788 barium Inorganic materials 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 229910052758 niobium Inorganic materials 0.000 claims description 7
- 239000010955 niobium Substances 0.000 claims description 7
- 229910052715 tantalum Inorganic materials 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 239000011135 tin Substances 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 229910052684 Cerium Inorganic materials 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052735 hafnium Inorganic materials 0.000 claims description 6
- 229910001507 metal halide Inorganic materials 0.000 claims description 6
- 150000005309 metal halides Chemical class 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 5
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 4
- 229910052689 Holmium Inorganic materials 0.000 claims description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims description 4
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 4
- 229910052772 Samarium Inorganic materials 0.000 claims description 4
- 229910052771 Terbium Inorganic materials 0.000 claims description 4
- 229910052775 Thulium Inorganic materials 0.000 claims description 4
- 229910052792 caesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 150000002902 organometallic compounds Chemical class 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 229910052701 rubidium Inorganic materials 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 150000002736 metal compounds Chemical class 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229910052976 metal sulfide Inorganic materials 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 30
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 18
- 238000010521 absorption reaction Methods 0.000 description 16
- 238000000231 atomic layer deposition Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 238000000576 coating method Methods 0.000 description 10
- 239000007789 gas Substances 0.000 description 10
- 230000007062 hydrolysis Effects 0.000 description 10
- 238000006460 hydrolysis reaction Methods 0.000 description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 10
- 230000005855 radiation Effects 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 8
- 150000001408 amides Chemical class 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 150000004679 hydroxides Chemical class 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 150000003568 thioethers Chemical class 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- -1 Oxo nitrides Chemical class 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001805 chlorine compounds Chemical class 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000007873 sieving Methods 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 238000013112 stability test Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910016569 AlF 3 Inorganic materials 0.000 description 1
- 102100032047 Alsin Human genes 0.000 description 1
- 101710187109 Alsin Proteins 0.000 description 1
- 229910016036 BaF 2 Inorganic materials 0.000 description 1
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910016655 EuF 3 Inorganic materials 0.000 description 1
- 229910010199 LiAl Inorganic materials 0.000 description 1
- 229910013063 LiBF 4 Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- 229910020808 NaBF Inorganic materials 0.000 description 1
- 229910003691 SiBr Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004520 agglutination Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 150000002910 rare earth metals Chemical group 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4417—Methods specially adapted for coating powder
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/305—Sulfides, selenides, or tellurides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
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Description
A)蛍光体粒子を用意するステップと、
D)少なくとも1つの第1保護層を、原子層成長法を用いて蛍光体粒子の表面に設けるステップと
を含む。
D1)蛍光体粒子の表面に、原子層成長法を用いて第1出発化合物を堆積するステップと、
D2)蛍光体粒子の表面に、原子層成長法を用いて第2出発化合物を堆積するステップと
を含む。詳細には、第1出発化合物および第2出発化合物は、第1保護層が蛍光体粒子の表面を完全にまたはほぼ完全に覆うように、表面全体に、またはほぼ表面全体に堆積される。したがって、水分、酸素、および硫化水素などのその他の有害な気体に対する、蛍光体粒子の特に高い保護を確実にすることができる。特に、方法ステップD1)およびD2)は、指定される順序で実施する、即ち、D1)の後にD2)を実施する。
E)少なくとも1つの第1保護層で被覆された蛍光体粒子を、200℃から500℃、好ましくは250℃から400℃、例えば350℃で、焼き戻しを行うステップを行う。
B) ケイ素含有蛍光体および/またはアルミニウム含有蛍光体粒子を酸溶液で処理するステップであって、酸溶液のpHを少なくとも1時間にわたりpH3.5から7、好ましくはpH4から6.5、特に好ましくはpH4.5から6に保持し、且つケイ素を含有する第2保護層を蛍光体粒子の表面に形成し、当該第2保護層のケイ素含量は蛍光体粒子よりも高い、および/またはアルミニウムを含有する第2保護層を蛍光体粒子の表面に形成し、当該第2保護層(3)の表面のアルミニウム含量は、蛍光体粒子とは異なる、特に低い。このような方法は、既に蛍光体粒子の加水分解に対する安定性を著しく増大させる。その上に第2保護層を設けることにより、その安定性は再び著しく増大する。したがって本発明に係る方法を用いて第1保護層および第2保護層が設けられた蛍光体粒子は、高い大気湿度の環境下での適用例に特に適したものとなる。
C)少なくとも100℃の温度で、処理後の前記蛍光体粒子(1)の焼き戻しを行うステップ。特に、焼き戻しは、酸素含有雰囲気中、300℃から450℃、特に好ましくは300℃から350℃の温度で実施する。
(Ba1−x−ySrxCay)SiO4:Eu2+(0≦x≦1、0≦y≦1)、
(Ba1−x−ySrxCay)3SiO5:Eu2+(0≦x≦1、0≦y≦1)、
Li2SrSiO4:Eu2+、Ca8Mg(SiO4)4Cl2:Eu2+;
オキソ窒化物、例えば(Ba1−x−ySrxCay)Si2O2N2:Eu2+(0≦x≦1;0≦y≦1)、
SrSiAl2O3N2:Eu2+、Ba4−xCaxSi6ON10:Eu2+(0≦x≦1)、
(Ba1−xSrx)Y2Si2Al2O2N5:Eu2+(0≦x≦1)、
SrxSi(6−y)AlyOyN(8−y):Eu2+(0.05≦x≦0.5;0.001≦y≦0.5)、
Ba3Si6O12N2:Eu2+、Si6−zAlzOzN8−z:Eu2+(0≦z≦0.42)、
MxSi12−m−nAlm+nOnN16−n:Eu2+(M=Li、Mg、Ca、Y;x=m/v;v=mの価数、x≦0.2)、
MxSi12−m−nAlm+nOnN16−n:Ce3+、
AE2−x−aRExEuaSi1−yO4−x−2yNx(AE=Sr、Ba、Ca、Mg;RE=希土類金属元素)、
AE2−x−aRExEuaSi1−yO4−x−2yNx(AE=Sr、Ba、Ca、Mg;RE=希土類元素)、Ba3Si6O12N2:Eu2+、または
窒化物、例えばLa3Si6N11:Ce3+、(Ba1−x−ySrxCay)2Si5N8:Eu2+、(Ca1−x−ySrxBay)AlSiN3:Eu2+(0≦x≦1;0≦y≦1)、
Sr(Sr1−xCax)Al2Si2N6:Eu2+(0≦x≦0.2)、
Sr(Sr1−xCax)Al2Si2N6:Ce3+(0≦x≦0.2)、SrAlSi4N7:Eu2+、
(Ba1−x−ySrxCay)SiN2:Eu2+(0≦x≦1;0≦y≦1)、
(Ba1−x−ySrxCay)SiN2:Ce3+(0≦x≦1;0≦y≦1)、
(Sr1−xCax)LiAl3N4:Eu2+(0≦x≦1)、
(Ba1−x−ySrxCay)Mg2Al2N4:Eu2+(0≦x≦1;0≦y≦1)、
(Ba1−x−ySrxCay)Mg3SiN4:Eu2+(0≦x≦1;0≦y≦1)。
Sr(SraM1−a)Si2Al2(N,X)6:D,A,B,E,G,L
式中、Mは、Ca、Ba、Mg単独、または組合せから選択され;Dは、Mn、Ce、Pr、Nd、Sm、Eu、Tb、Dy、Ho、Er、Li、Na、K、Rb、Cs、Yb、Tmの群からの1つ、2つ、またはより多くの元素であり;Aは、MおよびDとは異なる2価の金属から選択され;B=3価の金属であり;E=1価の金属であり;G=4価の元素であり;L=3価の元素である。下記も適用される:0.6≦a<1、好ましくは0.6≦a<1、およびXは、例えばOまたはハロゲンなどの元素を表し、これらは特に、占有された中間格子位置が、格子位置の結晶格子または空格子点に存在する場合、キャリア補償を行うのにも使用される。特に、蛍光体は、空間群P1、P2、P21、またはP1バーで結晶化する。
Sr(SraM1−a)Si2Al2N6:D
式中、Mは、Ca、Ba、Zn、Mgの群から選択され、Dは、EuおよびCeから選択され、好ましくはEuである。さらに、下記が適用される:0.6≦a<1、好ましくは0.8≦a<1。好ましくは、M=Caである。特に、蛍光体は、空間群P1、P2、P21、またはP1バーで結晶化する。
Sr(SraCa1−a)Si2Al2N6:D
式中、D=Eu、および0.8≦a<1、好ましくは0.8≦a<1である。特に、蛍光体は、空間群P1、P2、P21、またはP1バーで結晶化する。
Sr:Ca:Si:Al:Eu=(1+a):(1−a):2:2:y
(式中、yは、ドーピングの程度、即ち、Euによって置換される2価の格子サイトの割合に該当する。)
さらに、1種または異なるフラックス剤を添加する。反応物混合物の全重量を、例えば上述の原子比を維持しながら、50〜100gになるようにする。その他の総重量単位を使用することも可能である。
Sr(SraCa1−a)Si2Al2N6:Eu
(式中、a=0.86であり、ユーロピウム含量が3%(相純度≧95%)である。)
希塩酸(c=2mol/L)6mlをこの分散体に添加し、混合物を75℃から85℃の温度に加熱する。混合物を、この温度範囲で保持し、5時間にわたり撹拌を継続する。pHを常に観察し、pH計に接続されている計量ポンプによって、pH5未満の値に保持する。合計で0.8mlの希塩酸を添加する。次いで酸で浸出させた蛍光体粒子をろ過し、吸引により抽出し、最初に水で、次いでエタノールで集中的に洗浄する。次いで蛍光体粒子を60℃で2時間乾燥し、次いで篩い分けする。乾燥蛍光体粒子は、350℃で5時間、任意選択で焼き戻しすることができる。蛍光体粒子1の表面への、特に第2保護層3上に第1保護層2を設けることは、原子層成長法を用いて実施される。この場合、方法ステップD1)では、第1出発化合物、例えばトリメチルアルミニウムを、原子層成長法を用いて蛍光体粒子の表面に堆積し、方法ステップD2)では、第2出発化合物、例えば水またはオゾンを、原子層成長法を用いて蛍光体粒子の表面に堆積する。第1保護層の気密性をさらに増大させるために、第1保護層を、方法ステップE)で200℃から500℃の温度で焼き戻しすることができる。
Sr(SraCa1−a)Si2Al2N6:Eu
(式中、a=0.86であり、ユーロピウム含量は3%(相純度≧95%)である。)
得られたグローケーキを冷却後に炉から取り出し、めのう製のモルターミルを使用して破砕し、メッシュ・サイズが31μmの篩に通して篩い分けした。31μm未満の篩画分は、それぞれ使用された蛍光体または使用された蛍光体粒子である。前記蛍光体粒子を、引き続き希酸に浸漬し、その後、水中で3回分級し、その後、ろ過し、吸引により抽出した。このことは、破片および微粉を除去する働きをする。この洗浄プロセスは、蛍光体粒子の、より狭いサイズ分布を得る働きもする。短時間の含浸の結果、方法ステップB)を実施するときに生じ得るような、第2保護層は特に生じない。次いで蛍光体粒子を乾燥した。一般式Sr(SraCa1−a)Si2Al2N6:Eu(式中、a=0.86であり、ユーロピウム含量が3%である)を有する得られた蛍光体粒子を、ALD被覆チャンバーに入れた。例えば、ALD被覆反応器Picosun POCA−100粉末カートリッジを、原子層成長法に使用することができる。150℃の堆積温度で、トリメチルアルミニウムを、原子層成長法を用いて蛍光体粒子の表面に最初に堆積させる。150℃の堆積温度は、被覆チャンバーの内部または被覆される蛍光体粒子およびプロセスガスが、この温度であることを意味する。トリメチルアルミニウムは、蛍光体粒子の表面に吸収される。次いで過剰なトリメチルアルミニウムを除去するために、被覆チャンバーをN2でパージする。その後、水を蛍光体粒子の表面に衝突させる。第1保護層が、水とトリメチルアルミニウムとの反応によって蛍光体粒子の表面に形成される。次いで過剰な水およびメタンガスなどの得られる副産物を除去するために、被覆チャンバーをN2でパージする。この堆積プロセスは、トリメチルアルミニウムの堆積からなり、N2で濯ぎ、水を分離し、N2で再度パージするものであり、合計で600回実施される。この結果、合計で層厚が94nmである、複数(600)の第1保護層が得られる。層密度は、例えば、蛍光体粒子の表面に類似した第1保護層が形成されているシリコン・ウェハを参照として使用する、反射型薄層測定を用いて決定することができる。トリメチルアルミニウムと水との反応は、N2による濯ぎプロセスによって、気相中で既に防止することができる。したがってこの反応は、蛍光体粒子の表面でのみ生じる。
2 第1保護層
3 第2保護層
t 時間
A 相対吸収
I、II、III、IV、V、VI、R、R2 安定性曲線
Claims (15)
- 少なくとも1つの第1保護層を含む蛍光体粒子を製造するための方法であって、
A)蛍光体粒子(1)を用意するステップと、
B)前記蛍光体粒子(1)を酸溶液で処理するステップであって、前記蛍光体粒子(1)の表面にSiを含有する第2保護層(3)を形成し、前記Siを含有する第2保護層(3)のSi含量は前記蛍光体粒子(1)よりも高い、あるいは前記蛍光体粒子(1)の表面にAlを含有する第2保護層(3)を形成し、前記Alを含有する第2保護層(3)の表面のアルミニウム含量は前記蛍光体粒子(1)とは異なる、
D)少なくとも1つの第1保護層(2)を、原子層成長法を用いて前記第2保護層(3)の表面に設けるステップと
を含み、方法ステップD)が、下記の方法ステップ:
D1)前記蛍光体粒子(1)の表面に、原子層成長法を用いて第1出発化合物を堆積させるステップと、
D2)前記蛍光体粒子(1)の表面に、原子層成長法を用いて第2出発化合物を堆積させるステップと
を含み、前記蛍光体粒子が下記一般式を有する蛍光体である方法。
Sr(SraM1−a)Si2Al2(N,X)6:D,A,B,E,G,L
[式中、Mは、Ca、Ba、Mg単独、または組合せから選択され、
Dは、Mn、Ce、Pr、Nd、Sm、Eu、Tb、Dy、Ho、Er、Li、Na、K、Rb、Cs、Tm、Ybの群から選ばれる1つ、2つ、またはそれ以上の元素であり、
Aは、MおよびDとは異なる2価の金属から選択され、
B=3価の金属であり、
E=1価の金属であり、
G=4価の元素であり、
L=3価の元素であり、
X=Oまたはハロゲンであり、0.6≦a<1である。] - 前記第1出発化合物が、有機金属化合物および金属ハロゲン化物を含む群から選択され、前記第2出発化合物が、H2O、H2S、NH3、およびO3を含む群から選択される、請求項1に記載の方法。
- 前記有機金属化合物または前記金属ハロゲン化物の金属が、ホウ素、アルミニウム、ケイ素、スズ、亜鉛、チタン、ジルコニウム、タンタル、ニオブ、および/またはハフニウムから選択される、請求項2に記載の方法。
- 前記第1出発化合物が、MClx、MBrx、M(CH3)x、M(CH2−CH3)x、M(CH2−CH2−CH3)x、M(OCH3)x、M(OCH2−CH3)x、およびM(OCH2−CH2−CH3)x[式中、Mは、B、Al、Si、Sn、Zn、Ti、Zr、Ta、Nb、および/またはHfであり、xはMの価数に該当する]を含む化合物群から選択される、請求項1〜3のいずれか一項に記載の方法。
- 前記第1出発化合物が、AlCl3、AlBr3、Al(CH3)3、Al(CH2−CH3)3、Al(CH2−CH2−CH3)3、Al(OCH3)3、Al(OCH2−CH3)3、およびAl(OCH2−CH2−CH3)3を含む化合物群から選択される、請求項4に記載の方法。
- 前記蛍光体粒子(1)の表面が複数の第1保護層(2)で被覆されるように、前記方法ステップD)を複数回実施する、請求項1〜5のいずれか一項に記載の方法。
- 前記方法ステップD)の後に、以下の方法ステップ:
E)200℃から500℃の間の温度における、少なくとも1つの第1保護層(2)で被覆された前記蛍光体粒子(1)の焼き戻しを行うステップ
をさらに実施する、請求項1〜6のいずれか一項に記載の方法。 - 方法ステップE)で行う前記焼き戻しを、不活性ガス雰囲気下、酸素含有雰囲気下、またはH2含有雰囲気下で行う、請求項7に記載の方法。
- 方法ステップB)において、前記酸溶液のpHを少なくとも1時間にわたってpH3.5から7の範囲内に保持する、請求項1〜8のいずれか一項に記載の方法。
- 方法ステップB)の後に、以下の方法ステップC):
C)少なくとも100℃の温度で、処理後の前記蛍光体粒子(1)の焼き戻しを行うステップ
をさらに実施する、請求項9に記載の方法。 - 前記蛍光体が、下記一般式を有する蛍光体である、請求項1〜10のいずれか一項に記載の方法。
Sr(SraM1−a)Si2Al2N6:D
[式中、Mは、Ca、Ba、Zn、Mgからなる群から選択され、Dは、EuおよびCeから選択される。] - 方法ステップE)における前記焼き戻しが、酸素含有雰囲気下またはH2含有雰囲気下で行われる、請求項7に記載の方法。
- 蛍光体を含む蛍光体粒子(1)であって、
前記蛍光体が、下記一般式:
Sr(SraM1−a)Si2Al2(N,X)6:D,A,B,E,G,L
[式中、Mは、Ca、Ba、Mg単独、または組合せから選択され、
Dは、Mn、Ce、Pr、Nd、Sm、Eu、Tb、Dy、Ho、Er、Li、Na、K、Rb、Cs、Tm、Ybの群から選ばれる1つ、2つ、またはそれ以上の元素であり、
Aは、MおよびDとは異なる2価の金属から選択され、
B=3価の金属であり、
E=1価の金属であり、
G=4価の元素であり、
L=3価の元素であり、
X=Oまたはハロゲンであり、0.6≦a<1である]
を有する蛍光体であり、
前記蛍光体粒子の表面が、少なくとも1つの第1保護層(2)および第2保護層(3)で被覆されており、且つ前記第1保護層(2)は前記第2保護層(3)の上方に配置されており、
前記第2保護層(3)は、前記蛍光体のSi含量よりも少なくとも40原子%高いSi含量を有する、または前記蛍光体のAl含量よりも少なくとも10%低いAl含量を有し、
前記少なくとも1つの第1保護層(2)は、金属酸化物、金属窒化物、金属硫化物、および金属酸窒化物のいずれか1種からなる分子単層を含む、または前記分子単層からなる、蛍光体粒子(1)。 - 前記第1出発化合物が、有機金属化合物および金属ハロゲン化物を含む群から選択され、前記第2出発化合物がO3である、請求項1に記載の方法。
- 前記蛍光体が、空間群P1、P2、P1バー、またはP21で結晶化する、請求項1に記載の方法。
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