JP6759167B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP6759167B2
JP6759167B2 JP2017170422A JP2017170422A JP6759167B2 JP 6759167 B2 JP6759167 B2 JP 6759167B2 JP 2017170422 A JP2017170422 A JP 2017170422A JP 2017170422 A JP2017170422 A JP 2017170422A JP 6759167 B2 JP6759167 B2 JP 6759167B2
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gas
pipe
plasma processing
processing apparatus
plasma
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Expired - Fee Related
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Japanese (ja)
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JP2019047035A5 (enExample
JP2019047035A (ja
Inventor
森 功
功 森
基裕 田中
基裕 田中
安井 尚輝
尚輝 安井
靖 園田
靖 園田
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Hitachi High Tech Corp
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Hitachi High Tech Corp
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  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
JP2017170422A 2017-09-05 2017-09-05 プラズマ処理装置 Expired - Fee Related JP6759167B2 (ja)

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JP2017170422A JP6759167B2 (ja) 2017-09-05 2017-09-05 プラズマ処理装置

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JP2017170422A JP6759167B2 (ja) 2017-09-05 2017-09-05 プラズマ処理装置

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JP2019047035A JP2019047035A (ja) 2019-03-22
JP2019047035A5 JP2019047035A5 (enExample) 2019-11-07
JP6759167B2 true JP6759167B2 (ja) 2020-09-23

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119907956A (zh) * 2022-09-16 2025-04-29 桑名金属工业株式会社 质量流量控制器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1119494A (ja) * 1997-07-01 1999-01-26 Nippon Sanso Kk ガス混合装置
JP5037510B2 (ja) * 2006-08-23 2012-09-26 株式会社堀場エステック 集積型ガスパネル装置
JP4928893B2 (ja) * 2006-10-03 2012-05-09 株式会社日立ハイテクノロジーズ プラズマエッチング方法。
JP6034655B2 (ja) * 2012-10-25 2016-11-30 東京エレクトロン株式会社 プラズマ処理装置
TWI693638B (zh) * 2014-04-07 2020-05-11 美商蘭姆研究公司 獨立於配置的氣體輸送系統
US10557197B2 (en) * 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
JP6438751B2 (ja) * 2014-12-01 2018-12-19 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
US10215317B2 (en) * 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold

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