JP6732475B2 - インプリント装置、物品の製造方法、保持装置および露光装置 - Google Patents

インプリント装置、物品の製造方法、保持装置および露光装置 Download PDF

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Publication number
JP6732475B2
JP6732475B2 JP2016038129A JP2016038129A JP6732475B2 JP 6732475 B2 JP6732475 B2 JP 6732475B2 JP 2016038129 A JP2016038129 A JP 2016038129A JP 2016038129 A JP2016038129 A JP 2016038129A JP 6732475 B2 JP6732475 B2 JP 6732475B2
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Japan
Prior art keywords
substrate
region
mold
holding
imprint
Prior art date
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Active
Application number
JP2016038129A
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English (en)
Japanese (ja)
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JP2017157640A (ja
JP2017157640A5 (enExample
Inventor
雅見 米川
雅見 米川
洋一 松岡
洋一 松岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2016038129A priority Critical patent/JP6732475B2/ja
Priority to US15/436,635 priority patent/US10889052B2/en
Publication of JP2017157640A publication Critical patent/JP2017157640A/ja
Publication of JP2017157640A5 publication Critical patent/JP2017157640A5/ja
Application granted granted Critical
Publication of JP6732475B2 publication Critical patent/JP6732475B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning In General (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2016038129A 2016-02-29 2016-02-29 インプリント装置、物品の製造方法、保持装置および露光装置 Active JP6732475B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016038129A JP6732475B2 (ja) 2016-02-29 2016-02-29 インプリント装置、物品の製造方法、保持装置および露光装置
US15/436,635 US10889052B2 (en) 2016-02-29 2017-02-17 Imprint apparatus, method for manufacturing article, and exposure apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016038129A JP6732475B2 (ja) 2016-02-29 2016-02-29 インプリント装置、物品の製造方法、保持装置および露光装置

Publications (3)

Publication Number Publication Date
JP2017157640A JP2017157640A (ja) 2017-09-07
JP2017157640A5 JP2017157640A5 (enExample) 2019-04-11
JP6732475B2 true JP6732475B2 (ja) 2020-07-29

Family

ID=59679216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016038129A Active JP6732475B2 (ja) 2016-02-29 2016-02-29 インプリント装置、物品の製造方法、保持装置および露光装置

Country Status (2)

Country Link
US (1) US10889052B2 (enExample)
JP (1) JP6732475B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6735656B2 (ja) * 2016-11-18 2020-08-05 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7644656B2 (ja) * 2021-05-12 2025-03-12 キヤノン株式会社 評価方法、基板処理装置、基板処理装置の製造方法及び物品の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3947374B2 (ja) * 2000-08-25 2007-07-18 エーエスエムエル ネザーランズ ビー．ブイ． 平板投影装置および素子製造方法
JP2006120776A (ja) * 2004-10-20 2006-05-11 Canon Inc 露光装置
JP5647029B2 (ja) * 2011-02-18 2014-12-24 キヤノン株式会社 インプリント装置及び物品の製造方法
WO2012129541A2 (en) 2011-03-23 2012-09-27 Sri International Active electroadhesive cleaning
JP6171412B2 (ja) * 2013-03-06 2017-08-02 大日本印刷株式会社 インプリント方法、インプリント用のモールドおよびインプリント装置
JP6123396B2 (ja) * 2013-03-18 2017-05-10 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6643135B2 (ja) * 2016-02-17 2020-02-12 キヤノン株式会社 リソグラフィ装置および物品製造方法

Also Published As

Publication number Publication date
US20170246792A1 (en) 2017-08-31
JP2017157640A (ja) 2017-09-07
US10889052B2 (en) 2021-01-12

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