JP6725713B2 - 構造体及びコア材 - Google Patents
構造体及びコア材 Download PDFInfo
- Publication number
- JP6725713B2 JP6725713B2 JP2019018979A JP2019018979A JP6725713B2 JP 6725713 B2 JP6725713 B2 JP 6725713B2 JP 2019018979 A JP2019018979 A JP 2019018979A JP 2019018979 A JP2019018979 A JP 2019018979A JP 6725713 B2 JP6725713 B2 JP 6725713B2
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- JP
- Japan
- Prior art keywords
- core material
- fiber
- fibers
- porous layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011162 core material Substances 0.000 title claims description 150
- 239000000835 fiber Substances 0.000 claims description 189
- 239000000463 material Substances 0.000 claims description 88
- 229920005989 resin Polymers 0.000 claims description 57
- 239000011347 resin Substances 0.000 claims description 57
- 229920001187 thermosetting polymer Polymers 0.000 claims description 33
- -1 polyethylene terephthalate Polymers 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 239000004952 Polyamide Substances 0.000 claims description 9
- 229920002647 polyamide Polymers 0.000 claims description 9
- 239000004698 Polyethylene Substances 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
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- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 229910010272 inorganic material Inorganic materials 0.000 claims description 6
- 239000011147 inorganic material Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 239000011368 organic material Substances 0.000 claims description 5
- 239000005001 laminate film Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 claims description 3
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- 239000010410 layer Substances 0.000 description 183
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- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 11
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- 239000004925 Acrylic resin Substances 0.000 description 7
- 229920000178 Acrylic resin Polymers 0.000 description 7
- 102000008186 Collagen Human genes 0.000 description 7
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- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000012792 core layer Substances 0.000 description 3
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- 239000003365 glass fiber Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
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- 229920000642 polymer Polymers 0.000 description 3
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- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
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- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002608 ionic liquid Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
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- 229920002239 polyacrylonitrile Polymers 0.000 description 2
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- 150000003839 salts Chemical class 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- UGGQKDBXXFIWJD-UHFFFAOYSA-N calcium;dihydroxy(oxo)silane;hydrate Chemical compound O.[Ca].O[Si](O)=O UGGQKDBXXFIWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
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- 238000000635 electron micrograph Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
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- 239000002121 nanofiber Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
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- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
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- B32B15/00—Layered products comprising a layer of metal
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Description
さらに、実施形態によれば、繊維により構成されるコア材と、コア材を構成するものであって、コア材の変形を抑制する芯材と、コア材の少なくとも一部を覆う表面形成材であって、金属材料、有機材料及び無機材料からなる群より選択される少なくとも1種を含む表面形成材とを備える構造体が提供される。
さらに、実施形態によれば、繊維により構成されるコア材と、コア材を構成するものであって、コア材と接触している芯材と、コア材の少なくとも一部を覆う表面形成材であって、金属材料、有機材料及び無機材料からなる群より選択される少なくとも1種を含む表面形成材とを備える構造体が提供される。
(1)式において、V1は多孔質層の空孔を含む体積で、多孔質層の縦長さL1、多孔質層の横長さL2、及び多孔質層の厚みL3から下記(2)式により算出される。多孔質層の空孔を含む体積V1は、多孔質層に液体等の材料が充填されていない状態で行われる。多孔質層に液体等の材料が充填されている場合、多孔質層の洗浄等によって材料を除去した後に測定を行う。また、各寸法L1、L2及びL3は、基材又は芯材上に作製した多孔質層を基材及び芯材から剥離した後、多孔質層を平面上に置いた状態でスケールにより計測する。
また、V2は多孔質層の正味の体積で、多孔質層の重量を多孔質層の密度で割ったものである。
(3)式において、V3は積層体の空孔を含む体積で、積層体の縦長さL4、積層体の横長さL5、及び積層体の厚みL6から下記(4)式により算出される。積層体の空孔を含む体積V3は、積層体に液体等の材料が充填されていない状態で行われる。積層体に液体等の材料が充填されている場合、積層体の洗浄等によって材料を除去した後に測定を行う。また、各寸法L4、L5及びL6は、積層体を平面上に置いた状態でスケールにより計測する。
V3=L4×L5×L6 (4)
また、V4は積層体の正味の体積で、積層体の重量を積層体の密度で割ったものである。
(実施例1)
溶剤であるN.N−ジメチルホルムアミド(DMF)で50重量%希釈したエポキシ樹脂主剤に、LiBrを1重量%添加して溶解させて溶液を調製した。この溶液にエポキシ樹脂主剤に対して40重量%量の硬化剤を加えて70℃に加熱して仮硬化させ、原料溶液を得た。
(実施例2)
実施例1と同様な方法で作製した多孔質層と芯材を用意した。図3に示すように、芯材1の両方の最外層に多孔質層を積層し、積層体を得た。多孔質層の積層数は、芯材の片側当たり10層とした。積層体の空孔率は80%であった。得られた積層体を、実施例1と同様な5層構造のラミネートフィルム製の袋状外装部材に収納した後、真空ポンプを用いて外装部材内を真空状態にし、外装部材をヒートシールにより封止して構造体を得た。
(実施例3)
芯材として、図4に示す構造を有し、縦長さ150mm、横長さ150mm、厚み5mm、空孔率が80%のアクリル樹脂製の多孔質板を用意した。
(実施例4)
実施例3と同様な方法で作製した多孔質層と芯材を用意した。図3に示すように、芯材1の両方の最外層に多孔質層を積層し、積層体を得た。多孔質層の積層数は、芯材の片側当たり10層とした。積層体の空孔率は92%であった。
(実施例5)
電解質としてLiBrの代わりに0.1重量%のLiClを用いること以外は、実施例1と同様にして多孔質層を形成した。
(実施例6)
電解質としてLiBrの代わりに0.1重量%のベンジルトリエチルアンモニウムクロライドを用いること以外は、実施例1と同様にして多孔質層を形成した。
(実施例7)
エレクトロスピニング工程において、溶剤であるN.N−ジメチルホルムアミド(DMF)で45重量%希釈したエポキシ樹脂主剤を用いることによりエポキシ樹脂含有繊維の平均直径を450nmにすること以外は、実施例1と同様にして多孔質層を形成した。エポキシ樹脂の密度と比誘電率、繊維の熱伝導率、多孔質層の縦長さ、横長さ、厚みは実施例1と同様であった。多孔質層の空孔率、積層体の空孔率を表1に示す。
(実施例8)
溶剤であるN,N−ジメチルホルムアミド(DMF)にポリスチレンを溶解して20wt%溶液を調製し、原料溶液とした。
(実施例9)
溶剤であるN,N−ジメチルアセトアミド(DMAc)にポリアミドイミド30%を溶解して30wt%溶液を調製し原料溶液とした。
(比較例)
ガラス繊維からなる多孔質シートを用意した。多孔質シートは、縦長さ150mm、横長さ150mm、厚さが1mmであった。ガラスの密度は2.5g/cm3であった。ガラスの熱伝導率を繊維の熱伝導率とみなすため、繊維の熱伝導率は1W/m・Kである。繊維の平均直径を、実施例1と同様な方法で測定したところ、5μmであった。多孔質層の空孔率を前述の方法で測定したところ、95%であった。
以下に、当初の特許請求の範囲に記載された発明を付記する。
[1]繊維により構成されるコア材と、前記コア材を構成するものであって、前記コア材の変形を抑制する芯材と、を備える構造体。
[2]前記芯材は、前記コア材内に設けられ、前記繊維からなる繊維層の厚さを抑えることにより前記繊維の圧縮量を抑制する[1]に記載の構造体。
[3]前記芯材は、前記コア材内に設けられることにより、前記繊維の使用量を抑える[1]または[2]に記載の構造体。
[4]前記芯材は、多孔質である[1]から[3]の何れかに記載の構造体。
[5]前記コア材の少なくとも一部を覆う表面形成材を備える[1]から[4]何れかに記載の構造体。
[6][1]から[5]の何れかに記載の構造体に備えられるコア材。
[7]熱硬化性樹脂及び電解質を含む繊維を含む多孔質層を少なくとも一層含む、構造体。
[8]前記熱硬化性樹脂がエポキシ樹脂で、かつ前記電解質が臭化リチウムである、[7]に記載の構造体。
[9]前記繊維が30nm以上5μm以下の平均直径を有する、[7]または[8]に記載の構造体。
[10]前記熱硬化性樹脂の比誘電率の範囲は1以上1000以下である、[7]〜[9]いずれかに記載の構造体。
[11]密度が0.5g/cm3以上3g/cm3以下の樹脂を含有し、かつ30nm以上5μm未満の平均直径を有する繊維を含む空孔率が45%以上95%以下の多孔質層を複数含む積層体を含む、構造体。
[12]前記密度が1g/cm3以上2g/cm3以下である、[11]に記載の構造体。
[13]前記積層体の空孔率が45%以上95%以下である、[11]または[12]に記載の構造体。
[14]前記繊維の熱伝導率が0.01W/m・K以上5W/m・K以下である、[11]〜[13]のいずれかに記載の構造体。
[15]前記樹脂がエポキシ樹脂である、[11]〜[14]のいずれかに記載の構造体。
[16]繊維により構成されるコア材と、前記コア材を構成するものであって、前記コア材と接触している芯材と、を備える構造体。
Claims (11)
- 熱硬化性樹脂繊維により構成されるコア材と、
前記コア材を構成するものであって、前記コア材の変形を抑制する芯材と、
前記コア材及び前記芯材を収容する袋状の表面形成材であって、金属材料、有機材料及び無機材料からなる群より選択される少なくとも1種を含む表面形成材と
を備える構造体。 - 前記芯材は、前記コア材内に設けられ、前記熱硬化性樹脂繊維からなる繊維層の厚さを抑えることにより前記熱硬化性樹脂繊維の圧縮量を抑制する請求項1に記載の構造体。
- 前記芯材は、前記コア材内に設けられることにより、前記熱硬化性樹脂繊維の使用量を抑える請求項1または2に記載の構造体。
- 前記芯材は、多孔質である請求項1から3の何れか1項に記載の構造体。
- 前記表面形成材は、アルミニウム又はアルミニウム合金を含む層と、樹脂層とを含むラミネートフィルムである請求項1から4の何れか1項に記載の構造体。
- 前記ラミネートフィルムは、ポリエチレンテレフタレートを含む第1層と、ポリアミドを含む第2層と、アルミニウムから形成された第3層と、エチレン・ビニルアルコール共重合樹脂を含む第4層と、ポリエチレンを含む第5層とを含む請求項5に記載の構造体。
- 前記熱硬化性樹脂繊維の外径が0.1nm〜10μmの範囲である、請求項1から6の何れか1項に記載の構造体。
- 請求項1から7の何れか1項に記載の構造体に備えられるコア材。
- 熱硬化性樹脂繊維により構成されるコア材と、
前記コア材を構成するものであって、前記コア材と接触している芯材と、
前記コア材及び前記芯材を収容する袋状の表面形成材であって、金属材料、有機材料及び無機材料からなる群より選択される少なくとも1種を含む表面形成材と
を備える構造体。 - 前記表面形成材は、アルミニウム又はアルミニウム合金を含む層と、樹脂層とを含むラミネートフィルムである請求項9に記載の構造体。
- 前記ラミネートフィルムは、ポリエチレンテレフタレートを含む第1層と、ポリアミドを含む第2層と、アルミニウムから形成された第3層と、エチレン・ビニルアルコール共重合樹脂を含む第4層と、ポリエチレンを含む第5層とを含む請求項10に記載の構造体。
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