JP6721152B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
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- JP6721152B2 JP6721152B2 JP2018215932A JP2018215932A JP6721152B2 JP 6721152 B2 JP6721152 B2 JP 6721152B2 JP 2018215932 A JP2018215932 A JP 2018215932A JP 2018215932 A JP2018215932 A JP 2018215932A JP 6721152 B2 JP6721152 B2 JP 6721152B2
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- 239000003990 capacitor Substances 0.000 claims description 103
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000002184 metal Substances 0.000 claims description 49
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000002775 capsule Substances 0.000 claims description 11
- 238000003491 array Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
- H01G4/1245—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates containing also titanates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
図13〜図18は金属フレームの構造に応じた曲げ変形テストの結果をそれぞれ示すグラフである。
110 キャパシタ本体
111 誘電体層
121、122 第1及び第2内部電極
131、132 第1及び第2外部電極
140、150 第1及び第2金属フレーム
141、151 第1及び第2水平接合部
142、152 第1及び第2垂直部
143、153 第1及び第2水平実装部
144、154 第1及び第2切開部
145、155 第3及び第4切開部
160、160'、160'' カプセル部
Claims (10)
- 本体と、前記本体の両端部にそれぞれ形成される第1及び第2外部電極と、を含み、前記本体は、誘電体層と、前記誘電体層を挟んで幅方向に交互に配置される第1及び第2内部電極と、を含み、前記第1及び第2外部電極は、前記本体の両端面にそれぞれ形成される第1及び第2頭部と、前記第1及び第2頭部から前記本体の上下面の一部までそれぞれ延長される第1及び第2バンド部と、を含む積層型キャパシタの複数個が水平方向に連続して配列されるキャパシタアレイと、
前記キャパシタアレイの一側面に配置され、前記複数の積層型キャパシタのそれぞれの第1外部電極と接続される第1金属フレームと、
前記キャパシタアレイの他側面に配置され、前記複数の積層型キャパシタのそれぞれの第2外部電極と接続される第2金属フレームと、を含み、
前記第1金属フレームは、複数の第1外部電極の第1バンド部の上側部分と接合される第1水平接合部と、前記第1水平接合部と垂直方向に向かい合うように配置される第1水平実装部と、前記第1水平接合部と前記第1水平実装部とを連結し、水平方向に少なくとも一つ以上の第1切開部を有する第1垂直部と、を含み、
前記第2金属フレームは、複数の第2外部電極の第2バンド部の上側部分と接合される第2水平接合部と、前記第2水平接合部と垂直方向に向かい合うように配置される第2水平実装部と、前記第2水平接合部と前記第2水平実装部とを連結し、水平方向に少なくとも一つ以上の第2切開部を有する第2垂直部と、を含み、
前記積層型キャパシタの上下面を連結する方向に前記第1垂直部及び第2垂直部の長さが前記積層型キャパシタの高さより長く、前記第1水平実装部及び前記第2水平実装部が積層型キャパシタから離隔するように配置され、
前記第1金属フレーム及び前記第2金属フレームは、前記第1水平実装部及び前記第2水平実装部に水平方向に少なくとも一つ以上の第3切開部及び第4切開部がそれぞれ形成され、
複数の積層型キャパシタが連続して配列される方向に前記第1水平接合部は、前記複数の積層型キャパシタの前記第1バンド部の上側部分の合計の長さを少なくとも有し、複数の積層型キャパシタが連続して配列される方向と垂直な方向に前記第1水平接合部の幅は、前記第1バンド部の上側部分の幅より小さく、
複数の積層型キャパシタが連続して配列される方向に前記第2水平接合部は、前記複数の積層型キャパシタの前記第2バンド部の上側部分の合計の長さを少なくとも有し、複数の積層型キャパシタが連続して配列される方向と垂直な方向に前記第2水平接合部の幅は、前記第2バンド部の上側部分の幅より小さく、
前記第3切開部は、前記第1切開部と互いに連結され、前記第4切開部は、前記第2切開部と互いに連結される
電子部品。 - キャパシタアレイにおいて、第1外部電極又は第2外部電極の第1頭部又は第2頭部の総面積をAt、第1垂直部又は第2垂直部の面積をAmと定義する場合、0.2≦Am/At≦0.9を満たす、請求項1に記載の電子部品。
- 前記第1外部電極と前記第1水平接合部及び前記第1垂直部の間に導電性接着部が設けられ、
前記第2外部電極と前記第2水平接合部及び前記第2垂直部の間に導電性接着部が設けられる、請求項1または2に記載の電子部品。 - 前記キャパシタアレイをカプセル化するカプセル部をさらに含み、
前記第1水平実装部及び前記第2水平実装部が前記カプセル部の外に露出する、請求項1から3のいずれか一項に記載の電子部品。 - 前記第1垂直部が水平方向にそれぞれの第1頭部の中央部分に位置し、
前記第2垂直部が水平方向にそれぞれの第2頭部の中央部分に位置する、請求項1に記載の電子部品。 - 前記キャパシタアレイが垂直方向に少なくとも2層以上積層される、請求項1から5のいずれか一項に記載の電子部品。
- 前記第1垂直部が、上側に位置したキャパシタアレイの第1頭部まで延長され、
前記第2垂直部が、上側に位置したキャパシタアレイの第2頭部まで延長される、請求項6に記載の電子部品。 - 上側に配置されたキャパシタアレイにおいて、第1頭部と第1垂直部との間に導電性接着部が設けられ、第2頭部と第2垂直部との間に導電性接着部が設けられる、請求項7に記載の電子部品。
- 複数の前記キャパシタアレイをカプセル化するカプセル部をさらに含み、
前記第1水平実装部及び前記第2水平実装部が前記カプセル部の外に露出する、請求項6から8のいずれか一項に記載の電子部品。 - 前記キャパシタアレイが多層多列構造からなる、請求項1から9のいずれか一項に記載の電子部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0095233 | 2018-08-16 | ||
KR1020180095233A KR102194707B1 (ko) | 2018-08-16 | 2018-08-16 | 전자 부품 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020027932A JP2020027932A (ja) | 2020-02-20 |
JP6721152B2 true JP6721152B2 (ja) | 2020-07-08 |
Family
ID=68420458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018215932A Active JP6721152B2 (ja) | 2018-08-16 | 2018-11-16 | 電子部品 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11004613B2 (ja) |
JP (1) | JP6721152B2 (ja) |
KR (1) | KR102194707B1 (ja) |
CN (1) | CN110838410B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102211743B1 (ko) | 2018-08-29 | 2021-02-03 | 삼성전기주식회사 | 전자 부품 |
KR102581268B1 (ko) | 2019-09-03 | 2023-09-22 | 주식회사 엘지화학 | 에어로겔 블랭킷 제조방법 |
JP2022541827A (ja) | 2019-09-03 | 2022-09-27 | エルジー・ケム・リミテッド | エアロゲルブランケット |
KR20220099053A (ko) * | 2021-01-05 | 2022-07-12 | 삼성전기주식회사 | 적층형 전자 부품 및 그 실장 기판 |
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JPH07249541A (ja) | 1994-03-11 | 1995-09-26 | Mitsubishi Materials Corp | 複合セラミックコンデンサ |
JPH0817679A (ja) * | 1994-06-30 | 1996-01-19 | Kyocera Corp | 複合セラミックコンデンサ |
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JPH11251186A (ja) | 1998-02-26 | 1999-09-17 | Kyocera Corp | スタック型セラミックコンデンサ |
JP3877553B2 (ja) | 2001-07-02 | 2007-02-07 | 株式会社Maruwa | スタック型電子部品 |
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JP3847265B2 (ja) | 2003-03-20 | 2006-11-22 | Tdk株式会社 | 電子部品 |
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JP6295662B2 (ja) * | 2013-12-27 | 2018-03-20 | Tdk株式会社 | 電子部品 |
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KR102149789B1 (ko) | 2015-01-20 | 2020-08-31 | 삼성전기주식회사 | 적층 세라믹 전자 부품 |
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KR102139758B1 (ko) | 2015-02-02 | 2020-07-31 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
KR101740818B1 (ko) | 2015-10-28 | 2017-05-26 | 삼성전기주식회사 | 적층형 전자 부품 및 그 실장 기판 |
CN108281283A (zh) | 2017-12-28 | 2018-07-13 | 山东迪电子科技有限公司 | 立式陶瓷贴片电容的制造工艺及其电容产品 |
-
2018
- 2018-08-16 KR KR1020180095233A patent/KR102194707B1/ko active IP Right Grant
- 2018-11-14 US US16/190,919 patent/US11004613B2/en active Active
- 2018-11-16 JP JP2018215932A patent/JP6721152B2/ja active Active
-
2019
- 2019-02-01 CN CN201910102528.2A patent/CN110838410B/zh active Active
Also Published As
Publication number | Publication date |
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CN110838410A (zh) | 2020-02-25 |
US20200058448A1 (en) | 2020-02-20 |
US11004613B2 (en) | 2021-05-11 |
JP2020027932A (ja) | 2020-02-20 |
KR20190121147A (ko) | 2019-10-25 |
CN110838410B (zh) | 2022-12-06 |
KR102194707B1 (ko) | 2020-12-23 |
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