JP6704159B1 - 樹脂封止装置 - Google Patents

樹脂封止装置 Download PDF

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Publication number
JP6704159B1
JP6704159B1 JP2019218096A JP2019218096A JP6704159B1 JP 6704159 B1 JP6704159 B1 JP 6704159B1 JP 2019218096 A JP2019218096 A JP 2019218096A JP 2019218096 A JP2019218096 A JP 2019218096A JP 6704159 B1 JP6704159 B1 JP 6704159B1
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Japan
Prior art keywords
mold
thickness
substrates
substrate
resin
Prior art date
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Active
Application number
JP2019218096A
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English (en)
Japanese (ja)
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JP2021089915A (ja
Inventor
正明 石井
正明 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Engineering Co Ltd
Original Assignee
Asahi Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Engineering Co Ltd filed Critical Asahi Engineering Co Ltd
Priority to JP2019218096A priority Critical patent/JP6704159B1/ja
Application granted granted Critical
Publication of JP6704159B1 publication Critical patent/JP6704159B1/ja
Priority to CN202010992238.2A priority patent/CN112976475B/zh
Priority to TW109142155A priority patent/TWI753678B/zh
Publication of JP2021089915A publication Critical patent/JP2021089915A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C45/376—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings adjustable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C2045/2683—Plurality of independent mould cavities in a single mould

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2019218096A 2019-12-02 2019-12-02 樹脂封止装置 Active JP6704159B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019218096A JP6704159B1 (ja) 2019-12-02 2019-12-02 樹脂封止装置
CN202010992238.2A CN112976475B (zh) 2019-12-02 2020-09-21 树脂密封装置
TW109142155A TWI753678B (zh) 2019-12-02 2020-12-01 樹脂密封裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019218096A JP6704159B1 (ja) 2019-12-02 2019-12-02 樹脂封止装置

Publications (2)

Publication Number Publication Date
JP6704159B1 true JP6704159B1 (ja) 2020-06-03
JP2021089915A JP2021089915A (ja) 2021-06-10

Family

ID=70858256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019218096A Active JP6704159B1 (ja) 2019-12-02 2019-12-02 樹脂封止装置

Country Status (3)

Country Link
JP (1) JP6704159B1 (zh)
CN (1) CN112976475B (zh)
TW (1) TWI753678B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240038804A (ko) * 2021-11-26 2024-03-25 아픽 야마다 가부시끼가이샤 수지 봉지 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101028735B (zh) * 2006-03-03 2010-09-29 鸿富锦精密工业（深圳）有限公司 模具结构
JP5560479B2 (ja) * 2009-07-01 2014-07-30 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置、並びに樹脂モールド方法
JP5544585B2 (ja) * 2010-07-13 2014-07-09 アピックヤマダ株式会社 樹脂モールド装置及びワーク板厚測定装置
JP5944866B2 (ja) * 2013-06-20 2016-07-05 Ｔｏｗａ株式会社 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置
JP6236486B2 (ja) * 2016-03-07 2017-11-22 Ｔｏｗａ株式会社 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。
JP6580519B2 (ja) * 2016-05-24 2019-09-25 Ｔｏｗａ株式会社 圧縮成形装置、樹脂封止品製造装置、圧縮成形方法、及び樹脂封止品の製造方法
JP6541746B2 (ja) * 2017-10-30 2019-07-10 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP6861609B2 (ja) * 2017-10-30 2021-04-21 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
TWI787417B (zh) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 壓縮成形用模具及壓縮成形裝置

Also Published As

Publication number Publication date
JP2021089915A (ja) 2021-06-10
TW202122236A (zh) 2021-06-16
CN112976475A (zh) 2021-06-18
CN112976475B (zh) 2024-02-02
TWI753678B (zh) 2022-01-21

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