JP2021089915A - 樹脂封止装置 - Google Patents
樹脂封止装置 Download PDFInfo
- Publication number
- JP2021089915A JP2021089915A JP2019218096A JP2019218096A JP2021089915A JP 2021089915 A JP2021089915 A JP 2021089915A JP 2019218096 A JP2019218096 A JP 2019218096A JP 2019218096 A JP2019218096 A JP 2019218096A JP 2021089915 A JP2021089915 A JP 2021089915A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- substrates
- thickness
- substrate mounting
- resin sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 67
- 229920005989 resin Polymers 0.000 title claims abstract description 67
- 238000007789 sealing Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 145
- 238000003825 pressing Methods 0.000 claims abstract description 64
- 230000007246 mechanism Effects 0.000 claims abstract description 27
- 238000000465 moulding Methods 0.000 claims abstract description 16
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 230000003028 elevating effect Effects 0.000 claims description 29
- 125000006850 spacer group Chemical group 0.000 claims description 15
- 238000005538 encapsulation Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
- B29C45/376—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings adjustable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C2045/2683—Plurality of independent mould cavities in a single mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
2 モールドベース
3 下金型
4 厚み計測手段
4A レーザ変位センサ
5 上金型
6,6A,6B 基板
7 半導体チップ
10 制御部
11 離型フィルム
21 金型保持部
22 押圧部材
22A スペーサ部材
22B 押圧板
23 調整機構
24 昇降部材
25 弾性部材
26 移動部材
27 駆動部
28,29 ローラ
30 台座
31 基板載置部
32 ロッド
33 受け板
34 弾性部材
35 ポット
36 樹脂
37 プランジャ
51 キャビティ
52 底面部材
53 ロッド
54 受け板
55 弾性部材
56 押圧部材
56A スペーサ部材
57 カル
58 ランナー
59 ゲート
60 エアベント
Claims (5)
- 上金型との間に複数の基板をクランプして前記上金型との間に形成されるキャビティ内に樹脂注入して樹脂封止成形するための下金型であり、前記複数の基板が個別に載置される複数の基板載置部と、当該下金型を上下方向に貫通して前記複数の基板載置部のそれぞれに当接するロッドとを有する下金型と、
前記複数の基板のそれぞれの厚みを計測する厚み計測手段と、
前記下金型を着脱可能に支持するモールドベースと、
前記厚み計測手段により計測された前記複数の基板のそれぞれの厚みに応じて、前記モールドベースを貫通する押圧部材により前記ロッドを押圧し、前記複数の基板載置部の高さを個別に調整する調整機構と
を含む樹脂封止装置。 - 前記調整機構は、前記押圧部材を昇降させる昇降部材であり、下部に第1テーパ面を有する昇降部材と、前記昇降部材を下方向へ押圧する弾性部材と、上部に前記昇降部材の第1テーパ面に対向する第2テーパ面を有する移動部材と、前記第1テーパ面と前記第2テーパ面との間に介在させる摺動部材と、前記移動部材を前進後退させることにより前記第1テーパ面、前記摺動部材および前記第2テーパ面を介して前記昇降部材を昇降させる駆動部とを有する請求項1記載の樹脂封止装置。
- 前記押圧部材の上端に着脱可能なスペーサ部材を有する請求項1または2に記載の樹脂封止装置。
- 前記ロッドは、前記複数の基板載置部のそれぞれに複数備えられ、
当該複数のロッドの下面に当接して前記押圧部材による押圧力を伝達する受け板を有する請求項1から3のいずれか1項に記載の樹脂封止装置。 - 前記厚み計測手段により前記複数の基板のそれぞれの厚みを計測し、前記厚み計測手段により計測された前記複数の基板のそれぞれの厚みに応じて前記調整機構により前記複数の基板載置部の高さを個別に調整した後、前記複数の基板載置部上へそれぞれ載置された前記複数の基板上に配設された離型フィルムを前記上金型と前記下金型とを一旦閉じてクランプし、樹脂注入した後、さらに前記上金型と前記下金型とを閉じ、前記調整機構により前記複数の基板載置部を上昇させる制御部を有する請求項1から4のいずれか1項に記載の樹脂封止装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019218096A JP6704159B1 (ja) | 2019-12-02 | 2019-12-02 | 樹脂封止装置 |
CN202010992238.2A CN112976475B (zh) | 2019-12-02 | 2020-09-21 | 树脂密封装置 |
TW109142155A TWI753678B (zh) | 2019-12-02 | 2020-12-01 | 樹脂密封裝置 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2019218096A JP6704159B1 (ja) | 2019-12-02 | 2019-12-02 | 樹脂封止装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6704159B1 JP6704159B1 (ja) | 2020-06-03 |
JP2021089915A true JP2021089915A (ja) | 2021-06-10 |
Family
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JP2019218096A Active JP6704159B1 (ja) | 2019-12-02 | 2019-12-02 | 樹脂封止装置 |
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JP (1) | JP6704159B1 (ja) |
CN (1) | CN112976475B (ja) |
TW (1) | TWI753678B (ja) |
Families Citing this family (1)
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KR20240038804A (ko) * | 2021-11-26 | 2024-03-25 | 아픽 야마다 가부시끼가이샤 | 수지 봉지 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011011426A (ja) * | 2009-07-01 | 2011-01-20 | Apic Yamada Corp | 樹脂モールド金型及び樹脂モールド装置 |
JP2012023147A (ja) * | 2010-07-13 | 2012-02-02 | Apic Yamada Corp | 樹脂モールド装置及びワーク板厚測定装置 |
JP2019081293A (ja) * | 2017-10-30 | 2019-05-30 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP2019081294A (ja) * | 2017-10-30 | 2019-05-30 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101028735B (zh) * | 2006-03-03 | 2010-09-29 | 鸿富锦精密工业(深圳)有限公司 | 模具结构 |
JP5944866B2 (ja) * | 2013-06-20 | 2016-07-05 | Towa株式会社 | 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置 |
JP6236486B2 (ja) * | 2016-03-07 | 2017-11-22 | Towa株式会社 | 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。 |
JP6580519B2 (ja) * | 2016-05-24 | 2019-09-25 | Towa株式会社 | 圧縮成形装置、樹脂封止品製造装置、圧縮成形方法、及び樹脂封止品の製造方法 |
TWI787417B (zh) * | 2018-02-09 | 2022-12-21 | 日商山田尖端科技股份有限公司 | 壓縮成形用模具及壓縮成形裝置 |
-
2019
- 2019-12-02 JP JP2019218096A patent/JP6704159B1/ja active Active
-
2020
- 2020-09-21 CN CN202010992238.2A patent/CN112976475B/zh active Active
- 2020-12-01 TW TW109142155A patent/TWI753678B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011011426A (ja) * | 2009-07-01 | 2011-01-20 | Apic Yamada Corp | 樹脂モールド金型及び樹脂モールド装置 |
JP2012023147A (ja) * | 2010-07-13 | 2012-02-02 | Apic Yamada Corp | 樹脂モールド装置及びワーク板厚測定装置 |
JP2019081293A (ja) * | 2017-10-30 | 2019-05-30 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP2019081294A (ja) * | 2017-10-30 | 2019-05-30 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN112976475A (zh) | 2021-06-18 |
JP6704159B1 (ja) | 2020-06-03 |
CN112976475B (zh) | 2024-02-02 |
TW202122236A (zh) | 2021-06-16 |
TWI753678B (zh) | 2022-01-21 |
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