JP6689959B2 - 基板処理装置、処理システム及び半導体装置の製造方法 - Google Patents

基板処理装置、処理システム及び半導体装置の製造方法 Download PDF

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JP6689959B2
JP6689959B2 JP2018508822A JP2018508822A JP6689959B2 JP 6689959 B2 JP6689959 B2 JP 6689959B2 JP 2018508822 A JP2018508822 A JP 2018508822A JP 2018508822 A JP2018508822 A JP 2018508822A JP 6689959 B2 JP6689959 B2 JP 6689959B2
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unit
substrate
operation unit
storage unit
recipe
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JPWO2017169464A1 (ja
Inventor
真 御福
真 御福
陽一 三村
陽一 三村
克己 森田
克己 森田
英雄 ▲やなせ▼
英雄 ▲やなせ▼
信明 山口
信明 山口
康明 澤田
康明 澤田
佐野 誠
誠 佐野
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Kokusai Electric Corp
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Kokusai Electric Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Retry When Errors Occur (AREA)
JP2018508822A 2016-03-30 2017-02-28 基板処理装置、処理システム及び半導体装置の製造方法 Active JP6689959B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016068476 2016-03-30
JP2016068476 2016-03-30
PCT/JP2017/007808 WO2017169464A1 (fr) 2016-03-30 2017-02-28 Dispositif de traitement de substrat et système de traitement

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JPWO2017169464A1 JPWO2017169464A1 (ja) 2018-12-20
JP6689959B2 true JP6689959B2 (ja) 2020-04-28

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JP2018508822A Active JP6689959B2 (ja) 2016-03-30 2017-02-28 基板処理装置、処理システム及び半導体装置の製造方法

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JP (1) JP6689959B2 (fr)
WO (1) WO2017169464A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020077666A (ja) * 2018-11-05 2020-05-21 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
JP7382769B2 (ja) 2019-09-20 2023-11-17 株式会社Screenホールディングス 基板処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2307212A1 (fr) * 1997-11-03 1999-05-14 Gateway, Inc. Copie de sauvegarde automatique en fonction de l'etat de l'unite de disque
JP5281037B2 (ja) * 2008-03-18 2013-09-04 株式会社日立国際電気 基板処理システム、基板処理システムの表示方法及びそのプログラム

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JPWO2017169464A1 (ja) 2018-12-20
WO2017169464A1 (fr) 2017-10-05

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