JP6670177B2 - ダイボンドフィルム、ダイシングダイボンドフィルム、及び、半導体装置の製造方法 - Google Patents
ダイボンドフィルム、ダイシングダイボンドフィルム、及び、半導体装置の製造方法 Download PDFInfo
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- JP6670177B2 JP6670177B2 JP2016107149A JP2016107149A JP6670177B2 JP 6670177 B2 JP6670177 B2 JP 6670177B2 JP 2016107149 A JP2016107149 A JP 2016107149A JP 2016107149 A JP2016107149 A JP 2016107149A JP 6670177 B2 JP6670177 B2 JP 6670177B2
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Images
Classifications
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
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- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
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- H01L24/93—Batch processes
- H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
-
- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K2201/002—Physical properties
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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-
- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
-
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
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- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
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- Die Bonding (AREA)
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- Adhesives Or Adhesive Processes (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2016107149A JP6670177B2 (ja) | 2016-05-30 | 2016-05-30 | ダイボンドフィルム、ダイシングダイボンドフィルム、及び、半導体装置の製造方法 |
KR1020170064438A KR20170135705A (ko) | 2016-05-30 | 2017-05-25 | 다이 본드 필름, 다이싱 다이 본드 필름 및 반도체 장치의 제조 방법 |
TW106117528A TWI735584B (zh) | 2016-05-30 | 2017-05-26 | 黏晶膜、切晶黏晶膜及半導體裝置之製造方法 |
CN201710392803.XA CN107434955B (zh) | 2016-05-30 | 2017-05-27 | 芯片接合薄膜、切割芯片接合薄膜及半导体装置的制造方法 |
Applications Claiming Priority (1)
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JP2016107149A JP6670177B2 (ja) | 2016-05-30 | 2016-05-30 | ダイボンドフィルム、ダイシングダイボンドフィルム、及び、半導体装置の製造方法 |
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JP2017216273A JP2017216273A (ja) | 2017-12-07 |
JP6670177B2 true JP6670177B2 (ja) | 2020-03-18 |
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JP (1) | JP6670177B2 (zh) |
KR (1) | KR20170135705A (zh) |
CN (1) | CN107434955B (zh) |
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JP6961387B2 (ja) * | 2017-05-19 | 2021-11-05 | 日東電工株式会社 | ダイシングダイボンドフィルム |
JP6977588B2 (ja) * | 2018-01-30 | 2021-12-08 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法及び接着フィルム |
JP2020092157A (ja) * | 2018-12-05 | 2020-06-11 | 日東電工株式会社 | ダイシングダイボンドフィルム |
WO2020194613A1 (ja) * | 2019-03-27 | 2020-10-01 | 日立化成株式会社 | 半導体装置の製造方法、ダイボンディングフィルム、及びダイシング・ダイボンディング一体型接着シート |
JP2022135565A (ja) | 2021-03-05 | 2022-09-15 | 昭和電工マテリアルズ株式会社 | 接着フィルム及びその評価方法、並びに、半導体装置の製造方法及びダイシング・ダイボンディング一体型フィルム |
CN115703951A (zh) | 2021-08-06 | 2023-02-17 | 日东电工株式会社 | 芯片接合片及切割芯片接合薄膜 |
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KR100922226B1 (ko) * | 2007-12-10 | 2009-10-20 | 주식회사 엘지화학 | 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치 |
EP2254147A1 (en) * | 2008-03-14 | 2010-11-24 | Sumitomo Bakelite Co., Ltd. | Resin varnish for semiconductor element bonding film formation, semiconductor element bonding film, and semiconductor device |
JP5174092B2 (ja) * | 2009-08-31 | 2013-04-03 | 日東電工株式会社 | ダイシングシート付き接着フィルム及びその製造方法 |
JP4976522B2 (ja) * | 2010-04-16 | 2012-07-18 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法 |
JP5541613B2 (ja) * | 2011-06-08 | 2014-07-09 | 信越化学工業株式会社 | 熱伝導性接着剤組成物、接着用シートおよび熱伝導性ダイシング・ダイアタッチフィルム |
JP5991335B2 (ja) * | 2013-03-07 | 2016-09-14 | 住友ベークライト株式会社 | 接着フィルム、ダイシングシート一体型接着フィルム、バックグラインドテープ一体型接着フィルム、バックグラインドテープ兼ダイシングシート一体型接着フィルム、積層体、積層体の硬化物、および半導体装置、並び半導体装置の製造方法 |
JP6029544B2 (ja) * | 2013-06-17 | 2016-11-24 | リンテック株式会社 | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
JP6322026B2 (ja) * | 2014-03-31 | 2018-05-09 | 日東電工株式会社 | ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法 |
JP6374199B2 (ja) * | 2014-03-31 | 2018-08-15 | 日東電工株式会社 | ダイボンドフィルム、ダイシング・ダイボンドフィルム及び積層フィルム |
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CN107434955B (zh) | 2021-09-21 |
CN107434955A (zh) | 2017-12-05 |
KR20170135705A (ko) | 2017-12-08 |
JP2017216273A (ja) | 2017-12-07 |
TWI735584B (zh) | 2021-08-11 |
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