JP6662716B2 - 光センサ、光センサの製造方法 - Google Patents

光センサ、光センサの製造方法 Download PDF

Info

Publication number
JP6662716B2
JP6662716B2 JP2016114376A JP2016114376A JP6662716B2 JP 6662716 B2 JP6662716 B2 JP 6662716B2 JP 2016114376 A JP2016114376 A JP 2016114376A JP 2016114376 A JP2016114376 A JP 2016114376A JP 6662716 B2 JP6662716 B2 JP 6662716B2
Authority
JP
Japan
Prior art keywords
light
substrate
light emitting
emitting element
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016114376A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017217236A5 (enExample
JP2017217236A (ja
Inventor
堀川　泰愛
泰愛 堀川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2016114376A priority Critical patent/JP6662716B2/ja
Priority to US15/614,514 priority patent/US10115878B2/en
Publication of JP2017217236A publication Critical patent/JP2017217236A/ja
Publication of JP2017217236A5 publication Critical patent/JP2017217236A5/ja
Application granted granted Critical
Publication of JP6662716B2 publication Critical patent/JP6662716B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/024—Measuring pulse rate or heart rate
    • A61B5/02416—Measuring pulse rate or heart rate using photoplethysmograph signals, e.g. generated by infrared radiation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue
    • A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
    • A61B5/14551—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue using optical sensors, e.g. spectral photometrical oximeters for measuring blood gases
    • A61B5/14552—Details of sensors specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/04—Arrangements of multiple sensors of the same type
    • A61B2562/046—Arrangements of multiple sensors of the same type in a matrix array
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/024—Measuring pulse rate or heart rate
    • A61B5/02416—Measuring pulse rate or heart rate using photoplethysmograph signals, e.g. generated by infrared radiation
    • A61B5/02427—Details of sensor
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Surgery (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Cardiology (AREA)
  • Molecular Biology (AREA)
  • Veterinary Medicine (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physiology (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Led Device Packages (AREA)
JP2016114376A 2016-06-08 2016-06-08 光センサ、光センサの製造方法 Active JP6662716B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016114376A JP6662716B2 (ja) 2016-06-08 2016-06-08 光センサ、光センサの製造方法
US15/614,514 US10115878B2 (en) 2016-06-08 2017-06-05 Optical sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016114376A JP6662716B2 (ja) 2016-06-08 2016-06-08 光センサ、光センサの製造方法

Publications (3)

Publication Number Publication Date
JP2017217236A JP2017217236A (ja) 2017-12-14
JP2017217236A5 JP2017217236A5 (enExample) 2019-01-24
JP6662716B2 true JP6662716B2 (ja) 2020-03-11

Family

ID=60573014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016114376A Active JP6662716B2 (ja) 2016-06-08 2016-06-08 光センサ、光センサの製造方法

Country Status (2)

Country Link
US (1) US10115878B2 (enExample)
JP (1) JP6662716B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101900049B1 (ko) * 2018-03-29 2018-09-18 재단법인 대구경북과학기술원 플렉서블 전자 소자
US11828877B2 (en) 2019-09-12 2023-11-28 Stmicroelectronics Pte Ltd Optical sensor package with encapsulant is between and separates substrates and multiple assemblies
DE102019127731A1 (de) * 2019-10-15 2021-04-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung einer vielzahl von halbleiterbauelementen, halbleiterbauelement und halbleiterbauteil mit einem solchen halbleiterbauelement
US20230000378A1 (en) * 2019-12-05 2023-01-05 Sergio Lara Pereira Monteiro Method and means to measure oxygen saturation/concentration in animals
US11172836B1 (en) * 2019-12-05 2021-11-16 Sergio Lara Pereira Monteiro Method and means to measure heart rate with fitbit devices
JP7517359B2 (ja) * 2022-03-24 2024-07-17 カシオ計算機株式会社 検出装置および時計
CN121057540A (zh) * 2023-04-21 2025-12-02 株式会社村田制作所 生物体传感器以及生物体信息检测装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0518503U (ja) * 1991-08-28 1993-03-09 住友電気工業株式会社 生体光センサ
JP5394617B2 (ja) * 2006-06-16 2014-01-22 新光電気工業株式会社 半導体装置及び半導体装置の製造方法及び基板
JP2008212258A (ja) * 2007-03-01 2008-09-18 Fuji Xerox Co Ltd 光学検出装置、光学式血流計および光学検出方法
WO2009114689A1 (en) 2008-03-12 2009-09-17 The Trustees Of The University Of Pennsylvania Flexible and scalable sensor arrays for recording and modulating physiologic activity
GB2465230B (en) 2008-11-17 2013-08-21 Dialog Devices Ltd Assessing a subject's circulatory system
JP2011239865A (ja) * 2010-05-17 2011-12-01 Pioneer Electronic Corp 生体センサー装置
JP5167516B1 (ja) * 2011-11-30 2013-03-21 株式会社フジクラ 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体
JP6293995B2 (ja) * 2012-03-23 2018-03-14 新光電気工業株式会社 発光素子搭載用パッケージ及びその製造方法、並びに発光素子パッケージ
JP2014068733A (ja) * 2012-09-28 2014-04-21 Rohm Co Ltd 脈波センサ
RU2663633C2 (ru) * 2012-12-14 2018-08-07 Конинклейке Филипс Н.В. Устройство для измерения физиологического параметра пользователя
JP6244130B2 (ja) * 2013-07-26 2017-12-06 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ

Also Published As

Publication number Publication date
US10115878B2 (en) 2018-10-30
US20170358723A1 (en) 2017-12-14
JP2017217236A (ja) 2017-12-14

Similar Documents

Publication Publication Date Title
JP6662716B2 (ja) 光センサ、光センサの製造方法
TWI675497B (zh) 發光裝置封裝及搭載發光裝置之封裝
JP7329502B2 (ja) 半導体レーザ駆動装置およびその製造方法
US6777612B2 (en) Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device
JP6335619B2 (ja) 配線基板及び半導体パッケージ
JP6280710B2 (ja) 配線基板、発光装置及び配線基板の製造方法
JPH11163022A (ja) 半導体装置、その製造方法及び電子機器
JP2012033855A (ja) Ｌｅｄモジュール、ｌｅｄパッケージ、並びに配線基板およびその製造方法
JP2010283044A (ja) 配線基板および配線基板の製造方法
JPH11307689A (ja) 半導体装置、半導体装置用基板及びこれらの製造方法並びに電子機器
JP6697870B2 (ja) 配線基板及びその製造方法
JP2013225643A (ja) 発光素子搭載用パッケージ及びその製造方法、並びに発光素子パッケージ
JP6392163B2 (ja) 配線基板及びその製造方法、半導体装置
JP2013532901A (ja) 放熱回路基板及びその製造方法
JP2006179606A (ja) 配線回路基板
JP6317989B2 (ja) 配線基板
JP6316731B2 (ja) 配線基板及びその製造方法、並びに半導体パッケージ
JP2013045943A (ja) 半導体発光装置及びその製造方法
JPH1050734A (ja) チップ型半導体
JP2018207083A (ja) プリント配線板およびその製造方法
JP7341863B2 (ja) 電子機器
JP2001044452A (ja) 光通信用モジュール
KR20130051141A (ko) 조명 장치
JPH11307694A (ja) 半導体装置およびその製造方法
JPH11126913A (ja) 赤外線データ通信モジュール及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181207

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181207

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190913

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191008

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191106

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200213

R150 Certificate of patent or registration of utility model

Ref document number: 6662716

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150