JP2017217236A5 - - Google Patents

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Publication number
JP2017217236A5
JP2017217236A5 JP2016114376A JP2016114376A JP2017217236A5 JP 2017217236 A5 JP2017217236 A5 JP 2017217236A5 JP 2016114376 A JP2016114376 A JP 2016114376A JP 2016114376 A JP2016114376 A JP 2016114376A JP 2017217236 A5 JP2017217236 A5 JP 2017217236A5
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JP
Japan
Prior art keywords
light
wiring
holes
substrate
connecting portions
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Application number
JP2016114376A
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English (en)
Japanese (ja)
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JP6662716B2 (ja
JP2017217236A (ja
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Priority to JP2016114376A priority Critical patent/JP6662716B2/ja
Priority claimed from JP2016114376A external-priority patent/JP6662716B2/ja
Priority to US15/614,514 priority patent/US10115878B2/en
Publication of JP2017217236A publication Critical patent/JP2017217236A/ja
Publication of JP2017217236A5 publication Critical patent/JP2017217236A5/ja
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Publication of JP6662716B2 publication Critical patent/JP6662716B2/ja
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JP2016114376A 2016-06-08 2016-06-08 光センサ、光センサの製造方法 Active JP6662716B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016114376A JP6662716B2 (ja) 2016-06-08 2016-06-08 光センサ、光センサの製造方法
US15/614,514 US10115878B2 (en) 2016-06-08 2017-06-05 Optical sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016114376A JP6662716B2 (ja) 2016-06-08 2016-06-08 光センサ、光センサの製造方法

Publications (3)

Publication Number Publication Date
JP2017217236A JP2017217236A (ja) 2017-12-14
JP2017217236A5 true JP2017217236A5 (enExample) 2019-01-24
JP6662716B2 JP6662716B2 (ja) 2020-03-11

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ID=60573014

Family Applications (1)

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JP2016114376A Active JP6662716B2 (ja) 2016-06-08 2016-06-08 光センサ、光センサの製造方法

Country Status (2)

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US (1) US10115878B2 (enExample)
JP (1) JP6662716B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101900049B1 (ko) * 2018-03-29 2018-09-18 재단법인 대구경북과학기술원 플렉서블 전자 소자
US11828877B2 (en) 2019-09-12 2023-11-28 Stmicroelectronics Pte Ltd Optical sensor package with encapsulant is between and separates substrates and multiple assemblies
DE102019127731A1 (de) * 2019-10-15 2021-04-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung einer vielzahl von halbleiterbauelementen, halbleiterbauelement und halbleiterbauteil mit einem solchen halbleiterbauelement
US20230000378A1 (en) * 2019-12-05 2023-01-05 Sergio Lara Pereira Monteiro Method and means to measure oxygen saturation/concentration in animals
US11172836B1 (en) * 2019-12-05 2021-11-16 Sergio Lara Pereira Monteiro Method and means to measure heart rate with fitbit devices
JP7517359B2 (ja) * 2022-03-24 2024-07-17 カシオ計算機株式会社 検出装置および時計
CN121057540A (zh) * 2023-04-21 2025-12-02 株式会社村田制作所 生物体传感器以及生物体信息检测装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0518503U (ja) * 1991-08-28 1993-03-09 住友電気工業株式会社 生体光センサ
JP5394617B2 (ja) * 2006-06-16 2014-01-22 新光電気工業株式会社 半導体装置及び半導体装置の製造方法及び基板
JP2008212258A (ja) * 2007-03-01 2008-09-18 Fuji Xerox Co Ltd 光学検出装置、光学式血流計および光学検出方法
WO2009114689A1 (en) 2008-03-12 2009-09-17 The Trustees Of The University Of Pennsylvania Flexible and scalable sensor arrays for recording and modulating physiologic activity
GB2465230B (en) 2008-11-17 2013-08-21 Dialog Devices Ltd Assessing a subject's circulatory system
JP2011239865A (ja) * 2010-05-17 2011-12-01 Pioneer Electronic Corp 生体センサー装置
JP5167516B1 (ja) * 2011-11-30 2013-03-21 株式会社フジクラ 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体
JP6293995B2 (ja) * 2012-03-23 2018-03-14 新光電気工業株式会社 発光素子搭載用パッケージ及びその製造方法、並びに発光素子パッケージ
JP2014068733A (ja) * 2012-09-28 2014-04-21 Rohm Co Ltd 脈波センサ
RU2663633C2 (ru) * 2012-12-14 2018-08-07 Конинклейке Филипс Н.В. Устройство для измерения физиологического параметра пользователя
JP6244130B2 (ja) * 2013-07-26 2017-12-06 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ

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