JP6653119B2 - 半導体発光装置及びリードフレーム - Google Patents

半導体発光装置及びリードフレーム Download PDF

Info

Publication number
JP6653119B2
JP6653119B2 JP2015022237A JP2015022237A JP6653119B2 JP 6653119 B2 JP6653119 B2 JP 6653119B2 JP 2015022237 A JP2015022237 A JP 2015022237A JP 2015022237 A JP2015022237 A JP 2015022237A JP 6653119 B2 JP6653119 B2 JP 6653119B2
Authority
JP
Japan
Prior art keywords
wall
chip
light emitting
lead frame
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015022237A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016063210A (ja
JP2016063210A5 (https=
Inventor
秀徳 江越
秀徳 江越
野口　吉雄
吉雄 野口
一裕 井上
一裕 井上
崇 荒川
崇 荒川
輝雄 竹内
輝雄 竹内
敏宏 黒木
敏宏 黒木
小串　昌弘
昌弘 小串
Original Assignee
アルパッド株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルパッド株式会社 filed Critical アルパッド株式会社
Priority to US14/838,850 priority Critical patent/US20160079217A1/en
Priority to CN201510556155.8A priority patent/CN105428511A/zh
Priority to TW104128920A priority patent/TW201611358A/zh
Publication of JP2016063210A publication Critical patent/JP2016063210A/ja
Publication of JP2016063210A5 publication Critical patent/JP2016063210A5/ja
Application granted granted Critical
Publication of JP6653119B2 publication Critical patent/JP6653119B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
JP2015022237A 2014-09-12 2015-02-06 半導体発光装置及びリードフレーム Expired - Fee Related JP6653119B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US14/838,850 US20160079217A1 (en) 2014-09-12 2015-08-28 Semiconductor light emitting device and lead frame
CN201510556155.8A CN105428511A (zh) 2014-09-12 2015-09-02 半导体发光装置及导线架
TW104128920A TW201611358A (zh) 2014-09-12 2015-09-02 半導體發光裝置及導線架

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014187089 2014-09-12
JP2014187089 2014-09-12

Publications (3)

Publication Number Publication Date
JP2016063210A JP2016063210A (ja) 2016-04-25
JP2016063210A5 JP2016063210A5 (https=) 2018-03-15
JP6653119B2 true JP6653119B2 (ja) 2020-02-26

Family

ID=55798306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015022237A Expired - Fee Related JP6653119B2 (ja) 2014-09-12 2015-02-06 半導体発光装置及びリードフレーム

Country Status (2)

Country Link
JP (1) JP6653119B2 (https=)
TW (1) TW201611358A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016207739A (ja) 2015-04-17 2016-12-08 株式会社東芝 半導体発光装置及びその製造方法
JP6793139B2 (ja) * 2018-01-25 2020-12-02 日機装株式会社 半導体発光装置
JP7790949B2 (ja) * 2021-12-09 2025-12-23 ローム株式会社 半導体発光装置
JP2024035509A (ja) * 2022-09-02 2024-03-14 スタンレー電気株式会社 半導体発光装置、および、その製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101080355B1 (ko) * 2004-10-18 2011-11-04 삼성전자주식회사 발광다이오드와 그 렌즈
JP5212777B2 (ja) * 2007-11-28 2013-06-19 スタンレー電気株式会社 半導体発光装置及び照明装置
JP4985416B2 (ja) * 2008-01-16 2012-07-25 豊田合成株式会社 発光装置
JP2009224431A (ja) * 2008-03-14 2009-10-01 Nichia Corp 半導体装置
JP2011233645A (ja) * 2010-04-26 2011-11-17 Panasonic Corp 半導体装置及びその製造方法
JP2013089717A (ja) * 2011-10-17 2013-05-13 Rohm Co Ltd Ｌｅｄモジュール
JP2014036083A (ja) * 2012-08-08 2014-02-24 Toshiba Corp 半導体発光装置
CN103199183B (zh) * 2013-04-08 2016-01-27 厦门市三安光电科技有限公司 一种提高垂直发光二极管芯片亮度的封装结构

Also Published As

Publication number Publication date
JP2016063210A (ja) 2016-04-25
TW201611358A (zh) 2016-03-16

Similar Documents

Publication Publication Date Title
JP6387954B2 (ja) 波長変換部材を用いた発光装置の製造方法
US8785957B2 (en) Light-emitting device
CN113039653B (zh) 发光二极管封装
JP6628739B2 (ja) 発光装置
CN102479910A (zh) Led模块
US20140042472A1 (en) Semiconductor light-emitting device
JP2016058689A (ja) 半導体発光装置
US20200303596A1 (en) Light-emitting device package and lighting module
JP6653119B2 (ja) 半導体発光装置及びリードフレーム
US20160079217A1 (en) Semiconductor light emitting device and lead frame
US10714460B2 (en) Light emitting device and manufacturing method thereof
JP6700265B2 (ja) 発光装置およびその製造方法
JP6619966B2 (ja) 半導体発光装置
US20150076541A1 (en) Light-emitting device
JP5849694B2 (ja) 発光装置及びその製造方法
JP6575828B2 (ja) 発光装置及び発光モジュール
US20160079487A1 (en) Semiconductor light-emitting device
JP2009099823A (ja) 発光装置
CN115435253A (zh) 照明模块
JP7082280B2 (ja) 発光装置
KR102019498B1 (ko) 발광 소자 및 조명 시스템
JP2016115688A (ja) 発光装置
KR102689067B1 (ko) 발광소자 패키지 및 광원 장치
JP6602111B2 (ja) 半導体発光装置
KR101705372B1 (ko) 발광소자 패키지

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20171130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180205

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180205

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20181010

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20181107

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181219

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20190306

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190508

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20190521

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20190628

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191205

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200127

R150 Certificate of patent or registration of utility model

Ref document number: 6653119

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees