JP6648170B2 - 三次元プリンティングのための装置、システムおよび方法 - Google Patents
三次元プリンティングのための装置、システムおよび方法 Download PDFInfo
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- JP6648170B2 JP6648170B2 JP2018017152A JP2018017152A JP6648170B2 JP 6648170 B2 JP6648170 B2 JP 6648170B2 JP 2018017152 A JP2018017152 A JP 2018017152A JP 2018017152 A JP2018017152 A JP 2018017152A JP 6648170 B2 JP6648170 B2 JP 6648170B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/14—Titanium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
- B23K26/342—Build-up welding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Description
本出願は2013年4月29日に出願された米国仮出願第61/817,311号に基づく優先権を主張し、当該米国仮出願に記載された全ての記載内容を援用するものである。
本書で言及されている全ての出版物、特許、及び特許出願は、各個別の出版物、特許、又は特許出願が特定的に且つ個別に、参照することによって組み込まれると記載されているのと同じ程度まで、参照することによってここに組み込まれる。
この開示は、物体(又は部分)のコンピューターデザインからの直接的作成において、材料を溶融又は除去するために方向づけられたエネルギーを材料の層に当てるための装置、システム及び方法を提供する。これは、三次元物体を層ごとのやりかたで作成即ちプリントすることに使用することができる。本書で提供される方法は粉末材料の機構部品としての硬化を完遂させたり、硬化を完遂するために後処理が必要な部品として結合剤を融解したりすることに使用することができる。
(制御システム)
(実施例)
Claims (8)
- 三次元物体を成形する方法であって:
a.レーザー光源及び該レーザー光源の光学的下流にあるスキャニングモジュールを提供するステップと、
b.前記レーザー光源を用いて、誘導ラマン散乱によって100Wより大きい出力を有する青色の可視光の可干渉性ビームを発生するステップと、
c.前記青色の可視光の可干渉性ビームを前記レーザー光源と光学連通している基材に向かわせるステップと、
d.前記基材の中に又は前記基材から特徴形状を生成するステップであって、前記特徴形状は少なくとも前記三次元物体の予め定められた形状の部分に対応し、前記青色の可視光の可干渉性ビームで生成された前記特徴形状が透過電子顕微鏡法で測定して0.1nmから50nmの表面粗さを持つ、ステップと、
e.前記スキャニングモジュールを使用して、前記青色の可視光の可干渉性ビームの前記基材に対するスキャニング動作を発生するステップであって、前記スキャニング動作は前記三次元物体の前記予め定められた形状に対応しており、前記レーザー光源の出力を50kHz以上の速度で変調するステップと、
f.前記基材を前記レーザー光源に対して概して前記青色の可視光の可干渉性ビームの方向と平行の方向に沿って移動させるステップとを含む
方法。 - 前記青色の可視光の可干渉性ビームが500Wより大きい出力を有する、請求項1に記載の方法。
- 前記レーザー光源の出力が50kHzから10GHzの周波数で変調される、請求項1又は2に記載の方法。
- 前記スキャニング動作をメモリーにプログラムするステップを更に含む請求項1乃至3のいずれか一項に記載の方法。
- 前記(f)のステップにおいて、前記基材は少なくとも10ナノメートルの距離で移動される、請求項1乃至4のいずれか一項に記載の方法。
- 前記(f)のステップにおいて、(i)前記基材が概して前記青色の可視光の可干渉性ビームの方向と平行な方向に沿って移動されるか、又は(ii)前記レーザー光源を備える組立体が前記青色の可視光の可干渉性ビームの方向と平行な方向に沿って移動される、請求項1乃至5のいずれか一項に記載の方法。
- 前記基材は粉末である、請求項1乃至6のいずれか一項に記載の方法。
- 前記(d)のステップに続いて前記粉末を補充するステップを更に含む、請求項7に記載の方法。
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