JP6640106B2 - 研磨パッド及びシステム、並びにその作製方法及び使用方法 - Google Patents

研磨パッド及びシステム、並びにその作製方法及び使用方法 Download PDF

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Publication number
JP6640106B2
JP6640106B2 JP2016560383A JP2016560383A JP6640106B2 JP 6640106 B2 JP6640106 B2 JP 6640106B2 JP 2016560383 A JP2016560383 A JP 2016560383A JP 2016560383 A JP2016560383 A JP 2016560383A JP 6640106 B2 JP6640106 B2 JP 6640106B2
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Prior art keywords
polishing
layer
less
polishing pad
precisely shaped
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Japanese (ja)
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JP2017513722A5 (enExample
JP2017513722A (ja
Inventor
デュイ ケー． レフー，
デュイ ケー． レフー，
ケネス エー．ピー． マイヤー，
ケネス エー．ピー． マイヤー，
モーゼス エム． デイヴィッド，
モーゼス エム． デイヴィッド，
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/241—Methods

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016560383A 2014-04-03 2015-03-31 研磨パッド及びシステム、並びにその作製方法及び使用方法 Active JP6640106B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461974848P 2014-04-03 2014-04-03
US61/974,848 2014-04-03
US201462052729P 2014-09-19 2014-09-19
US62/052,729 2014-09-19
PCT/US2015/023572 WO2015153597A1 (en) 2014-04-03 2015-03-31 Polishing pads and systems and methods of making and using the same

Publications (3)

Publication Number Publication Date
JP2017513722A JP2017513722A (ja) 2017-06-01
JP2017513722A5 JP2017513722A5 (enExample) 2018-05-24
JP6640106B2 true JP6640106B2 (ja) 2020-02-05

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JP2016560383A Active JP6640106B2 (ja) 2014-04-03 2015-03-31 研磨パッド及びシステム、並びにその作製方法及び使用方法
JP2016560455A Active JP6656162B2 (ja) 2014-04-03 2015-03-31 研磨パッド及びシステム、並びにその作製方法及び使用方法

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Country Link
US (2) US10252396B2 (enExample)
EP (2) EP3126092B1 (enExample)
JP (2) JP6640106B2 (enExample)
KR (2) KR102350350B1 (enExample)
CN (2) CN106163740B (enExample)
SG (2) SG11201608134YA (enExample)
TW (2) TWI655998B (enExample)
WO (2) WO2015153601A1 (enExample)

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US20170182629A1 (en) 2017-06-29
US20170173758A1 (en) 2017-06-22
SG11201608219WA (en) 2016-10-28
US10252396B2 (en) 2019-04-09
EP3126093B1 (en) 2022-08-17
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KR20160142346A (ko) 2016-12-12
SG11201608134YA (en) 2016-10-28
CN106132630A (zh) 2016-11-16
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KR102350350B1 (ko) 2022-01-14
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US10071461B2 (en) 2018-09-11
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