JP6637916B2 - レーザ加工機 - Google Patents

レーザ加工機 Download PDF

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Publication number
JP6637916B2
JP6637916B2 JP2017048143A JP2017048143A JP6637916B2 JP 6637916 B2 JP6637916 B2 JP 6637916B2 JP 2017048143 A JP2017048143 A JP 2017048143A JP 2017048143 A JP2017048143 A JP 2017048143A JP 6637916 B2 JP6637916 B2 JP 6637916B2
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Japan
Prior art keywords
lens
laser
diameter
laser light
light
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JP2017048143A
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Japanese (ja)
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JP2017185543A (ja
JP2017185543A5 (enExample
Inventor
伊藤 亮平
亮平 伊藤
宏明 石黒
宏明 石黒
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Amada Co Ltd
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Amada Holdings Co Ltd
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Priority to JP2017048143A priority Critical patent/JP6637916B2/ja
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Publication of JP2017185543A5 publication Critical patent/JP2017185543A5/ja
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Publication of JP6637916B2 publication Critical patent/JP6637916B2/ja
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  • Lenses (AREA)
  • Laser Beam Processing (AREA)
JP2017048143A 2017-03-14 2017-03-14 レーザ加工機 Active JP6637916B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017048143A JP6637916B2 (ja) 2017-03-14 2017-03-14 レーザ加工機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017048143A JP6637916B2 (ja) 2017-03-14 2017-03-14 レーザ加工機

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2016073906A Division JP6114431B1 (ja) 2016-04-01 2016-04-01 レーザ加工機

Publications (3)

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JP2017185543A JP2017185543A (ja) 2017-10-12
JP2017185543A5 JP2017185543A5 (enExample) 2019-12-26
JP6637916B2 true JP6637916B2 (ja) 2020-01-29

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ID=60043783

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JP2017048143A Active JP6637916B2 (ja) 2017-03-14 2017-03-14 レーザ加工機

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JP (1) JP6637916B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3731991B1 (en) * 2017-12-29 2023-04-26 Corelase OY Laser processing apparatus and method
JP7133425B2 (ja) * 2018-10-10 2022-09-08 株式会社アマダ レーザ加工機
JP7407384B2 (ja) * 2019-02-27 2024-01-04 パナソニックIpマネジメント株式会社 交換レンズ、画像投写装置および撮像装置
JP7496711B2 (ja) * 2020-05-12 2024-06-07 株式会社ディスコ レーザー加工装置
CN116897092A (zh) * 2021-02-26 2023-10-17 株式会社天田集团 激光加工机以及激光加工方法
US12265207B2 (en) * 2021-03-04 2025-04-01 Ii-Vi Delaware, Inc. Dynamic focus for laser processing head

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011117607B4 (de) * 2011-10-28 2017-03-30 Highyag Lasertechnologie Gmbh Optisches System und Verwendung des optischen Systems
JP6244308B2 (ja) * 2011-12-09 2017-12-06 ルーメンタム オペレーションズ エルエルシーLumentum Operations LLC レーザービームのビームパラメータ積を変動させること
DE102015108248B4 (de) * 2015-05-26 2024-02-08 Scanlab Gmbh System für Lasermaterialbearbeitung und Verfahren zum Einstellen der Größe und Position eines Laserfokus

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JP2017185543A (ja) 2017-10-12

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